Core module

ADLINK Technology has released its newest Extreme Rugged™ CoreModule® offering. The ADLINK CoreModule® 920, with outstanding mechanical, thermal and power design, is able to support Intel® Core™ i7 performance with low power consumption in a small PC/104 form factor, making it an ideal choice for mission-critical applications in space-constrained environments such as transportation, aviation and defense/homeland security.

Integrating a dual-core 3rd generation Intel® Core™ i7 processor running at up to 2.8GHz with Turbo Boost, up to 4GB of solder-down DDR3 ECC memory, 8 GB of industrial grade SSD, as well as a fast data-transfer SATA 6 Gb/s interface, the CoreModule® 920 boosts the highest specification of PC/104 products available on the market and supports rich graphics performance with versatile video outputs including HDMI, VGA and LVDS. The CoreModule® 920 is expected to usher in many new applications for embedded systems and is also available with an economically-priced Intel® Celeron® CPU option.

Compliant with the PCI/104-Express Type 1 standard, the CoreModule® 920 provides both PCIe and PCI connectivity and allows for SATA 6 Gb/s data transfer. Space and cost savings are provided by the PC/104 family’s inherent self-stacking bus which allows modules to stack together like building blocks without backplanes or card cages. This stacking feature also delivers high reliability as it uses four-corner mounting holes which can resist shock and vibration. The CoreModule® 920 extreme ruggedness is also a result of its specially designed PCB, which is 50% thicker than ordinary PCBs, and an extended operating temperature range of -40oC to +85oC.

The CoreModule® 920 implements a heat spreader design which allows for more flexible thermal solutions to enable a higher component density not common to its PC/104 family predecessors. Its customized BIOS allows users to “underclock” the CPU and reduce total power consumption as well as heat generation.

The CoreModule® 920’s unique mechanical, power-saving and thermal design maximize the outstanding features of the PCI/104-Express form factor, setting a new benchmark for embedded solutions in the PC/104 family at comparatively low power consumption and cost.