Components for Nordic and Baltic regions.

Franchise extension will be supported by locally-based technical and commercial staff.*

Anglia Components has extended its franchise agreement with Digi International and now represents the M2M and IoT solution provider in the Nordic and Baltic regions. One of the key reasons for the enhanced relationship between the two companies is the success of the innovative programs that Anglia runs in the Britain and Ireland with Digi to develop new business. Examples include where the two companies have collaborated to deliver technical workshops providing an introduction to RF communications and connecting wireless sensors to the cloud for remote monitoring and control, as well as discussing Digi’s hardware, software and development kit solutions.

Jurgen De Biscop, Digital and John Bowman, Anglia.

“The Nordic and Baltic regions have a large number of SMEs and Contract Electronics Manufacturers, just like the UK”, says John Bowman, Anglia’s Marketing Director. “Such customers can often be left behind by the big high service and production fulfilment distributors, whereas for Anglia, they are a key part of our customer base. We look forward to growing with Digi in these regions.”

Jurgen De Biscop, Senior Channel Manager for Digi in the EMEA region adds: “We have been impressed by Anglia’s commitment to demand creation and new customer development in the UK, which is why we presented them with an award for this activity last year. We are delighted to extend the relationship and look forward eagerly to enjoying even greater success together.”

Anglia’s Nordic/Baltic agreement with Digi follows hot on the heels of a similar business extension with STMicroelectronics, and the three companies are collaborating to deliver a one-day event, titled ‘Learn How to Seamlessly Transition to Linux-Based MPUs’ in Reading (GB) on the 22nd April.

---

*Anglia is currently interviewing candidates for a Managing Director and FAEs based in the Nordics to support its business activities in the area.

@angliaLive @digidotcom @BWW_Comms #Electronics #PAuto #Baltic

Industrial connectivity.

In industrial wireless deployments, one technology sits at the center of every high-performance network: the Wireless Distribution System (WDS) bridge. It is the fundamental building block that transforms isolated access points into a unified, scalable network fabric yet it remains one of the most misunderstood components in the field.

Whether connecting data across a sprawling manufacturing floor, linking multiple buildings on a corporate campus, or extending coverage across remote field sites, every WDS application demands one thing: reliable, intelligent network bridging.

WDS bridges eliminate the cost, complexity, and downtime risk of deploying wired Ethernet backbones in environments where cable is impractical or impossible.

Why industrial environments demand WDS.
For plant managers and network engineers alike, the challenge is familiar: industrial environments make traditional wired Ethernet backbones impractical, cost-prohibitive, or outright impossible. Moving cables through active production facilities, bridging across open yards, or connecting distributed sites on a campus introduces enormous installation costs and operational disruption.

Since the early days of IEEE 802.11 networking, engineers have solved this problem with WDS — the wireless interconnection of access points that replaces the wired backbone with a seamless, high-performance wireless bridge. The result is faster deployment, lower costs, and the flexibility to extend network coverage exactly where it is needed, without touching a conduit.

How WDS bridge configuration works.
A WDS deployment designates one device as the main access point — the main base station — which anchors the connection to the wired network. Additional access points, known as relay stations or remote base stations, connect wirelessly to the main base station and forward traffic between the core network and all downstream users and devices.

APs are configured in one of two bridge modes depending on deployment requirements:

• Point-to-Point: Two APs communicate via high-gain directional antennas, wirelessly joining two discrete LAN segments across distances that would be impossible or cost-prohibitive to cable.
• Point-to-Multipoint: A single main AP anchors connections to multiple remote APs simultaneously, enabling centralized network distribution across a large facility or multi-site campus.

In a point-to-multipoint configuration, all APs must share the same SSID, wireless channel, authentication mode, security settings, and LAN IP subnet range. Both the 2.4 GHz and 5 GHz bands support WDS bridging, however, the two bands cannot be bridged together within the same link.

Critical design considerations.
AP Placement & Signal Strength: Every WDS hop introduces latency and reduces potential throughput. Placing APs too far apart compounds this effect, degrading link speed across the entire network. Strategic AP placement, optimized for signal strength and line of sight, is essential to maximizing WDS link performance.

Security & Access Control: Industrial networks are high-value targets. Restricting WDS access to authorized personnel requires strong wireless encryption. While WEP remains an option for legacy compatibility, WPA and WPA2 are the protocols of choice for modern deployments, delivering the authentication strength and encryption depth needed to protect critical infrastructure from unauthorized access.

Antaira delivers purpose-built WDS bridge hardware designed for the demands of real-world industrial environments from bridge-only devices to full-featured multifunction platforms.

• AMY-5133-AC-PD: A compact, cost-effective 802.11 5 GHz wireless AP/Client Bridge engineered for straightforward WDS deployments. Purpose-built, reliable, and ready to deploy.
• ARX-7235-AC-PD-T: A multifunction industrial powerhouse combining 802.11a/b/g/n/ac Wireless Access Point, Client, Bridge, Repeater, Router, NAT, and VPN all in a single PoE PD device. One platform. Every function. (Pictured right)

Both platforms deliver secure, stable wireless bridging with the performance margins that industrial operations require. And they are joined by Antaira’s full portfolio of industrial wireless routers, IoT gateways, access points, clients, and repeaters, all engineered to the same exacting standard. Every Antaira wireless device is hardened to endure the conditions that would destroy standard network equipment: extreme temperatures, high humidity, vibration, shock, and industrial-grade electromagnetic interference.

---

@AntairaTech @OConnell_PR #PAuto #Comms

Quantum dot laser simulator.

Photon Design has officially released its HAROLD QD, quantum dot laser simulation tool.

HAROLD QD enables engineers to model a quantum dot (QD) laser’s multi-layer, graded epitaxy structure, including dot size and distribution. It has an eight-band, K.P-based modeller to calculate the energy levels of the quantum dots, where previously it was six-band. As an evolution of the company’s HAROLD, hetero-structure semiconductor and laser simulator, developed over many years, HAROLD QD enables engineers to produce 3-D stress and strain models for each quantum dot shape. From this, HAROLD QD also allows engineers to calculate QD laser gain and absorption spectra, which reliably match the results of quantum dot lasers in field tests.

Dr. Dominic Gallagher, CEO of Photon Design, said, “OFC is the leading, global exhibition for the optical communications and networking supply chain; an ideal platform to officially launch HAROLD QD. Quantum dot lasers are critical to next-generation data centres, AI, and HPC applications and HAROLD QD puts Photon Design at the forefront of their design. QD lasers offer unparalleled, high-temperature operation, when compared to existing lasers, along with superior modulation, data transmission performance and power efficiency. They also bring practical, silicon-based manufacturing benefits, where quantum dots can be grown directly on silicon waveguides.

“HAROLD QD enables engineers to work in a single, integrated environment for gain materials, including InP and silicon. Seamless integration into Photon Design’s PICWAVE, to give engineers three-dimensional, time evolving, quantum dot laser models will follow.”

---

@photond #Design #Communications #OptimumPDM

How do applied stresses and residual stresses interact?

Paper from ECOROLL AG Tool Technology

Surface properties - Subsurface properties - Residual stresses - Information/Know-how.

How to estimate the effect of residual stresses.

It is not always easy to estimate the effect of residual stresses during the design phase. It is generally known that residual stresses can significantly influence the service life of components. For this reason, processes such as deep rolling, machine hammer peening, and shot peening are used repeatedly. They generate the necessary compressive residual stresses in the subsurface area and are thus largely responsible for extending the service life of a dynamically loaded component. However, it is still difficult for design departments to take this into account in their calculations. In the following, we will explain how an initial rough estimate can be made and how residual stresses actually affect dynamic strength.

Residual stresses are internal stresses in the structure.
First, we need to understand what residual stresses actually are. Residual stresses are stresses in the microstructure of a component that are present even when no external forces, torques, or temperature gradients are acting on the component, i.e., when the component is completely free of any load. They can occur anywhere in the manufacturing chain and are the result of mechanical and thermal loads during the individual manufacturing steps. For example, so-called casting stresses can arise during casting because the component cools at different rates in different areas. They can arise during machining due to the strong thermo-mechanical stresses caused by the cutting edge, or they can be generated specifically by means of mechanical solidification processes.

As with residual stresses, intrinsic stresses are generally divided into tensile and compressive stresses. Tensile stresses are described mathematically by a positive figure, while compressive stresses are described by a negative figure. In general terms, it can be said that compressive stresses extend the service life of components, while tensile stresses shorten it.

The reason for this is the initiation of cracks by stress peaks. If the tensile stress in one part in a component is too great, a crack will form at this point. Initially, this crack is small, but it grows larger and larger with further loading until the component finally fails. In simple terms, tensile residual stresses pull on the crack, causing it to grow faster. Compressive residual stresses counteract crack propagation and thus slow down crack growth.

Superposition of load stresses and residual stresses.
Like all stresses, residual stresses can also be superimposed with load stresses. This can be done by simple superposition. In other words, the load and residual stresses are simply added together. The result is then a resulting stress.

We can easily understand this using the example of a uniaxial stress state, i.e., a bar. If a uniaxial tensile stress of sload = 600 MPa is applied to this component and it has no residual stress, then the resulting stress is still sres = 600 MPa. If, on the other hand, the bar is subjected to a compressive residual stress of sESP = -200 MPa in the same direction, then mathematically the 200 MPa is subtracted from the 600 MPa and the resulting stress is sRes = 400 MPa. A bar that would fail at 550 MPa, for example, could therefore be used in the second case, but not in the first case. This explains the effect of residual stresses in a comprehensible way.

But what about a multi-axial stress state? Here, of course, the concept must be applied to the entire stress tensor. In this case, the corresponding residual stress values must be used for each component of the stress tensor. For example, in the x-direction, the principal stress of s(x) must be calculated with the principal stresses in the x-direction. If this is done for all components as well as the shear stresses, the result is a complete stress tensor with principal stresses.*

In order to estimate the effect on strength, the concepts of equivalent stress can be applied. This compresses the stress tensor to a single stress value and allows it to be compared with the strength characteristics from the stress-strain diagram.

Of course, the method presented here is not a complete service life assessment, and further calculations or tests must always be carried out to estimate dynamic strength. However, the method presented here allows the effect of residual stresses to be roughly estimated. Effects such as additional strengthening of the microstructure or residual stress reduction during loading are not taken into account, however.

---

* Mörke, T.: Randzonenanalyse zur Bestimmung mechanischer Belastungen im Lebenszyklus spanend gefertigter Bauteile. Doctoral thesis, Leibniz University Hannover, 2016.

@PresseBox @UnnGmbh #Ecoroll #Stress #Manufacturing

IPS Touch Display.

Four new 10.1 inch touch displays featuring IPS (In-Plane Switching) have been introduced by Inelco Hunter. IPS is a high-performance liquid crystal display (LCD) technology known for superior colour accuracy,and wide viewing angles. IPS liquid crystals rotate horizontally to improve light transmission. The displays are available with or without a Projective Capacitive touchscreen (PCAP), making the range a very cost-effective proposition.

The usual Powertip features, including high resolution and high brightness, are now available in a 10.1 inch format. This size will make the touch panels ideal for applications requiring a larger screen, such as industrial equipment monitors, vending machines, point-of-sale screens, EV charging stations, smart home control panels and medical devices.

Two screen resolutions are offered, the first is 1024x600 dots. The display features IPS and a 6 bit/ 8bit LVDS interface. The brightness is 500nits and the MTBF is 20,000. The display offers a full viewing angle, normally black. The display is also available as a Projective Capacitive touchscreen version (PCAP), which has a robust, durable glass surface and is highly resistant to scratches. The surface can be easily cleaned, making it ideal for applications such as medical instruments where hygiene is paramount. The tempered 1.1mm cover lens has a surface hardness of 6H and provides IP4 environmental rating.

The second resolution offered is 1280x800 dots. This display features IPS and a 6 bit/ 8bit LVDS interface. The brightness is 500nits and the MTBF is 50,000. The display also offers a full viewing angle, normally black. This display is also available as a Projective Capacitive touchscreen version (PCAP).

In addition to offering the displays as a standard product, Inelco Hunter offers a customisation service to help customers to adapt products for their own solutions. Inelco Hunter’s engineering team can help customers define the project requirements, including as-yet unformed product ideas, turning a concept into an outstanding product. A set of pre-design activities is worked through, critical when defining product specifications, documenting design challenges and identifying potential risks. This added-value support is at the core of Inelco Hunter’s philosophy, and has been for over 30 years, setting them apart from the "stock and ship" distributors.

---

@InelcoHunter #PAuto

EX Submersible pressure sensor.

The LS-1000 submersible pressure sensor from WIKA is now certified in accordance with the European ATEX and international IECEx directives. The sensor continuously measures the level of liquid media in industrial environments. Thanks to the new approvals, companies can now also use it in hazardous areas of ATEX zone 0 and 1 as well as IECEx zone 0, 1 and 2. This applies to numerous applications, for example in the process industry, wastewater and environmental technology and power generation. Typical applications include wastewater lifting stations, pumping stations and oil and fuel tanks.

The LS-1000 measures levels hydrostatically from 1 ... 10 m [3.28 ... 32.81 ft]. Optimal long-term stability of 0.2 % ensures precise measured data and minimal signal drift. Thanks to its robust design, the stainless steel submersible pressure sensor is permanently sealed in accordance with ingress protection IP68. A specially developed cable provides effective strain relief, and potting of the cable inlet provides additional protection. Each individual device undergoes a helium leak test during the final inspection. Even the smallest leaks and hairline cracks are detected here.

The submersible pressure sensor is maintenance-free, minimising failures, downtimes and total cost of ownership. It can be operated with a 5 V battery, as the energy-saving ratiometric 0.5 ... 4.5 V output signal consumes less than 5 mA. This places such a low load on the battery that it does not need to be replaced for years.

---

@WIKANews #PAuto #Hazardous

Flowmeter for datacentres.

Flow device primed for security in data centre and OEM applications at various stages of the liquid cooling process.

A new OEM‑configured variant of the Picomag electromagnetic flowmeter for the US market has been announced by Endress+Hauser. Purpose‑built for liquid cooling applications in data centres and OEM cooling systems, this version provides customers with a factory‑configured option designed for environments where instrumentation without wireless connectivity is required.

Picomag is Endress+Hauser’s compact electromagnetic flowmeter designed for accurate measurement of conductive fluids in small‑diameter pipelines. It combines flow, temperature and conductivity measurement in a single device.

While the standard Picomag includes industry‑leading Bluetooth® technology that meets rigorous global cybersecurity standards, many data centres and OEM partners operate under policies that prohibit wireless communication of any kind. The OEM variant meets this operational preference by offering a Picomag model delivered with Bluetooth® deactivated from the factory, ensuring alignment with facility policies while maintaining all core Picomag performance capabilities. In this configuration, the device integrates seamlessly through IO‑Link or standard signal outputs — 4–20 mA current, pulse, switch or 2–10 V — offering a controlled starting point ideal for secure or regulated environments.

"Data centres operate under some of the most demanding security expectations in the world,” said Nathan Hedrick, Product Marketing Group Manager at Endress+Hauser. “This OEM Picomag gives cooling system designers a compact, reliable and secure measurement option tailored for environments where wireless features are not permitted without compromising on the functionality our customers expect.”

Purpose‑built for high‑security data centre environments.
The OEM Picomag variant is designed to integrate seamlessly into standardized cooling skids, secondary distribution loops and rack‑level cooling modules. Key characteristics include:

• Factory‑delivered with wireless connectivity deactivated to meet strict facility requirements
• Preconfigured display behavior, output settings and engineering units for consistent OEM deployment
• Available in 1” and 2” sizes, ideal for compact rack or subsystem cooling circuits

This version retains all Picomag’s hallmark advantages, including flow, temperature and conductivity measurement, a bright and auto‑rotating display, intuitive commissioning and built‑in diagnostic capabilities.

“This addition strengthens our ability to support every stage of a data centre facility’s cooling architecture,” said Lauton Rushford, Flow Product Marketing Manager at Endress+Hauser. “It ensures operators and OEMs can select instrumentation that aligns with their policies while benefiting from Picomag’s proven performance and simplicity.”

How does liquid cooling compare to traditional air cooling in data centres?
As data centres grow in density and power consumption, many operators are shifting from traditional air-cooling systems to liquid cooling architectures. Liquid cooling offers significantly greater heat‑removal efficiency, allowing facilities to manage higher thermal loads generated by modern CPUs and GPUs.

While air cooling relies on large volumes of conditioned airflow, liquid cooling absorbs and transports heat far more effectively, supporting higher rack densities, reducing energy use and enabling more compact system designs. This shift is especially pronounced in AI, hyperscale and high‑performance computing environments where equipment demands exceed what air cooling alone can accommodate.

Liquid cooling also supports more precise thermal management at the subsystem or rack level. This creates new measurement requirements for inline flow and temperature monitoring, which is where compact, secure devices like the OEM Picomag play a key role. 

What are the latest trends in data centre optimization technology?
As data centres adopt increasingly complex liquid‑cooling architectures driven by high‑density GPU workloads, AI clusters and expanding global capacity, operators need compact, accurate measurement at more distributed points throughout the cooling network.

The OEM Picomag complements Endress+Hauser’s broader flow portfolio, including Proline Promag W 300/500 (0xDN), enabling a complete, scalable measurement strategy spanning from large‑diameter primary loops to small‑diameter subsystem circuits.

Stable water quality is also essential for maintaining liquid cooling efficiency. Complementary technologies such as inline liquid analysis (e.g., pH, conductivity and turbidity) help operators prevent scaling, corrosion and fouling, further supporting uptime and thermal stability.

---

@Endress_Hauser @Endress_UK @Endress_US #PAuto #USA