Assistant for trusted Ai for lifesciences.

Many pharma and life sciences companies want to leverage the efficiency gains of generative Ai, yet they cannot afford inaccurate or unverifiable results in GxP-regulated processes (Good Manufacturing Practice and other Good Practice guidelines). With the new K.AI Assistant, Körber closes this gap by bringing trustworthy Ai to regulated environments. Operators, engineers, and quality teams can access compliant answers in seconds while reducing the risks typically associated with generic Ai tools.

“AI will only create value in life sciences operations if it can be trusted in GxP-critical processes,” said Shaun Tyler, VP Artificial Intelligence, Software, Körber Business Area Pharma. “With the new K.AI Assistant, we are bringing together trusted AI, regulatory compliance, and deep industry expertise to help manufacturers confidently scale AI across their operations.”

Life sciences require a different approach to Ai.
As pharmaceutical companies face growing pressure to improve productivity and accelerate digital transformation, many teams still spend valuable time searching through standard operating procedures, batch records, and compliance documentation. At the same time, generic Ai tools are often unsuitable for regulated environments because of high hallucination risks and the validation effort required to deploy them in GxP-critical processes.

Reliable answers for regulated processes.
Körber’s K.AI Assistant addresses these challenges by delivering reliable answers based on Körber product knowledge and customer-specific GxP documentation. Powered by PharmaGuardrails, the solution prevents inaccurate and out-of-scope responses, helping life sciences companies establish trusted Ai workflows in regulated environments.

New capabilities for faster responses.
The latest release introduces new capabilities including document upload, easy onboarding, improved communication management, an enhanced user experience, and intuitive natural-language interaction. Together, these features help reduce search times, accelerate operator productivity, simplify training, and support audit readiness across manufacturing and quality operations.

Native PAS-X MES integration further lowers adoption barriers by embedding K.AI Assistant into an already validated manufacturing environment, reducing validation effort and accelerating time-to-value. In addition, flexible headless integration enables companies to embed trusted Ai capabilities directly into existing applications, workflows, and digital ecosystems.

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@WerumKarrierec #Koerber  #PAuto #Pharma #Ai

New initiative to foster technology co-operation to innovation.

First phase of this initiative is focused on enabling part manufacturers to start production preparation before machine delivery.

Meet at the Machine is a new initiative from Siemens, designed to bring together machine builders, software and automation technologies to accelerate innovation across the machine tool industry and help manufacturers achieve productivity faster. It provides a framework for Siemens and machine builders to jointly deliver integrated machining solutions that address real manufacturing challenges. The initiative is designed to make manufacturing customers more productive and enhance quality and performance. It brings engineering software, automation hardware and machine expertise together in one solution, helping machine builders deliver differentiated value.

Manufacturers today face increasing complexity, workforce shortages and growing pressure to become productive faster. While advances in software, automation and digitalization continue to create new opportunities, many manufacturers still face challenges connecting those technologies into efficient production workflows.

Siemens believes the next step in machining innovation is creating a continuous digital thread that connects engineering, programming, virtual validation and execution to deliver next-level productivity starting from the first machine power-on. By improving the flow of data across the part manufacturing lifecycle, organizations can reduce complexity, accelerate ramp-up and create a foundation for continuous improvement.

“Manufacturing truth has always ultimately been at the machine,” said Mark Hindsbo, head of Operations Software at Siemens. “By bringing together engineering software, automation hardware and machine expertise, we enable our customers and users to be productive faster, accelerate return on investment and reduce ramp-up time by up to 50 percent.”

Built in collaboration with TRAK Machine Tools, the first phase of this initiative is focused on enabling part manufacturers to be productive from day one. It addresses one of the most common challenges manufacturers face when purchasing a new machine: the time required to move from machine delivery to productive machining. The solution combines software, automation and machine expertise into a connected workflow that allows manufacturers to program, simulate and validate production while a machine is still being built.

“When our customers invest in a new machine, their goal is to achieve productivity and business results as quickly as possible,” said Steve Pinto, president, TRAK Machine Tools. “Meet at the Machine creates a new model for collaboration focused on customer outcomes, and we are proud to be the first partner helping bring this vision to life.”

Traditionally, many programming, validation and training activities begin only after a machine is installed. The new initiative shifts these activities earlier in the process, allowing manufacturers to prepare for production before physical machine delivery and helping reduce ramp-up time.

Through the initiative, Siemens plans to work with machine builders to develop future solutions that address key manufacturing challenges through collaborative innovation.

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@siemensindustry @prototrak @Siemens @siemens_press #PAuto #MachineBuild #Manufacturing

Simplified digital I/O module.

As automated machines become more capable, the amount of decentralised I/O required increases. Conventional approaches often rely on multiple dedicated input and output modules, increasing hardware, commissioning and the number of additional components that machine builders and system integrators must engineer, stock and support.

Festo addresses this challenge with a new configurable digital I/O module for the CPX-AP-I decentralised I/O platform. Designated CPX-AP-I-16DIO M12 (or M12 for short), the new module enables more efficient use of decentralised I/O across a machine.

The new M12 configurable digital I/O module provides 16 channels that can each be configured as a digital input or digital output to match application requirements. Users can configure the module channel by channel, divide it into eight inputs and eight outputs, or configure all 16 channels as outputs. Selected output channels provide up to 500 mA for high-current devices.

The module comes with a default 16-input configuration for immediate installation and commissioning, while output functions are enabled through software parameterisation. Individual LED indicators on each channel simplify commissioning and troubleshooting by providing clear operating and diagnostic status.

The M12 module gives machine builders greater freedom to design around the needs of the application instead of the limitations of fixed I/O modules. A single M12 module can support a wider range of machine configurations, reducing the number of module variants that must be specified, stocked, and maintained over the life of a machine.

The new module is part of Festo’s CPX-AP-I decentralised I/O platform, a high-performance system that distributes I/O, valve terminals, and IO-Link devices throughout a machine. Supporting up to 80 modules over distances of up to 50 m between modules, the platform reduces wiring, simplifies modular machine architectures, and allows machine builders to expand or reconfigure systems without redesigning the entire control architecture.

Expanding connectivity with CC-Link IE Field Basic.
Festo has also introduced a new CPX-AP-I bus node supporting CC-Link IE Field Basic, expanding the platform’s connectivity for Mitsubishi Electric Automation environments. Widely used throughout Asia, the industrial Ethernet protocol enables machine builders to integrate CPX-AP-I decentralised I/O into Mitsubishi PLC architectures without additional gateways or custom engineering.

The new bus node allows machine builders to retain the same CPX-AP-I decentralised I/O architecture while changing only the network interface for Mitsubishi Electric systems. The result is less engineering effort, faster machine adaptation for regional markets, and a common automation platform that supports multiple industrial Ethernet protocols, including EtherNet/IP, PROFINET, EtherCAT, Modbus TCP, and now CC-Link IE Field Basic.

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@FestoGB @festo_global #PAuto #IO

Evaluation for GaN MMICs devices.

The Electronics and Telecommunications Research Institute (ETRI), one of Korea’s leading research institutes, has selected Anritsu’s Broadband Vector Network Analyzer (VNA) VectorStar™ ME7838G for the characterisation and design verification of high-frequency devices using GaN MMICs. By deploying the ME7838G, ETRI has established an evaluation platform for millimeter-wave and sub-THz applications, improving measurement reproducibility and enabling reliable design verification.

As next-generation communications technologies advance, device evaluation is expanding into millimeter-wave and sub-THz frequency ranges. To improve design accuracy and performance prediction for GaN MMIC-based device development, ETRI conducts broadband characterisation that covers not only the operating frequency band but also harmonic frequency ranges. On-wafer measurements, which evaluate device characteristics directly on the wafer while excluding the effects of packaging and mounting, are widely used for this purpose. However, in millimeter-wave and sub-THz on-wafer measurements, probe contact conditions and measurement-system effects can easily cause measurement variation, making it a challenge to establish an evaluation platform that enables highly reliable comparison and verification between design and measured data.

To address these challenges, ETRI deployed the ME7838G. The ME7838G supports single-sweep measurements up to 220 GHz and enables evaluation from millimeter-wave to sub-THz frequencies on a single platform. Since broadband evaluation can be performed using a single measurement system, ETRI established an on-wafer evaluation platform that enables measurements from millimeter-wave to sub-THz frequencies under consistent test conditions, without switching measurement systems between frequency bands. This provided an environment in which measurement data acquired across a wide bandwidth could be compared with and analysed against design data under consistent conditions and with a high degree of accuracy.

Anritsu recognises that measurement technologies that combine broadband characterisation with high measurement reproducibility will become increasingly important for high-frequency device development for 6G and next-generation satellite communications. Anritsu will continue to support customers’ semiconductor research, development, and evaluation through its test and measurement technologies.

Further details of this case study “Establishing a High-Frequency Evaluation Platform to Support Foundry-Grade Quality.” It describes how the high-frequency evaluation platform established by ETRI contributes to improving design verification and performance prediction accuracy for GaN MMICs.

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@Anritsu @AnritsuEMEA @NapierPR #ETRI #TandM  #Korea

Wireless bridge kit.

Turns multi-day wireless deployments into plug-and-play installs.

Antaira Technologies, a global leader in industrial networking and wireless connectivity solutions, today announced The Airolinx Go MAX, from Antaira, is a preconfigured point-to-point (PtP) wireless bridge kit engineered to eliminate the guesswork, configuration time, and truck rolls that typically bog down outdoor wireless backhaul projects. Purpose-built for Security and Intelligent Transportation Systems (ITS) applications, the Airolinx Go MAX pairs rugged, high-throughput hardware with Antaira's new Airolinx Go Studio software to compress what is normally a multi-hour commissioning process into minutes.

Security integrators and ITS engineers face a common problem: wireless links need to go up fast, perform predictably, and survive years of outdoor exposure without a service call. The Airolinx Go MAX kit is designed around that reality. Every kit ships as a matched pair of pre-paired radios. Once powered on, the link forms automatically, no controller, no IP scheme, and no on-site configuration is required to pass traffic.

Zero-touch bridging, video-grade throughput.
At the core of every Airolinx Go MAX kit is a transparent Layer 2 bridge architecture that requires no management IP to pass traffic — units simply extend the network as if a cable were run between sites. Each radio integrates a dual chain (2x2) 5GHz radio delivering wireless speeds up to 2400Mbps, paired with an integrated 19dBi panel antenna capable of reaching 6+ miles.

For camera and sensor backhaul specifically, the kit is tuned for video-grade performance across a 1.5–4 mile (2.4–6.5km) line-of-sight range, holding the higher, more consistent throughput that live video streams and time-sensitive ITS data demand.

Power comes via active 802.3at PoE input, simplifying cabling at both ends of the link, and the entire unit is housed in an IP67-rated enclosure rated for -40°C to 75°C (-40°F to 167°F) operation. The kit is engineered for permanent outdoor installation in the enclosures, gate posts, and roadside cabinets where Security and ITS hardware lives. 

Airolinx Go Studio commissioning software.
What sets the Airolinx Go MAX kit apart isn't just the radio hardware. It's the install experience engineered around it. Antaira's new Airolinx Go Studio software was built specifically to solve the problem of commissioning devices that ship without a management IP. Using Layer 2 discovery, Airolinx Go Studio finds and identifies units on the local segment before any IP addressing is configured, giving installers a guided workflow to:

• Discover and commission devices at Layer 2, even prior to IP assignment
• Set first-run security to lock down access before the link goes live
• Optimize RF channel selection to avoid interference and maximize throughput
• Align antennas in real time, using live signal feedback instead of guesswork
• Validate the link and generate a link test report on the spot — ready-made documentation for project close-out and client sign-off

For integrators, this turns antenna alignment and RF tuning from an experience-dependent art into a repeatable, verifiable process, and it hands over documentation that used to require a separate site visit or spreadsheet.

Scales from one link to a full network.
While the Airolinx Go MAX kit is preconfigured for point-to-point deployment out of the box, the architecture is built to grow:

• Add the optional AIROLINX-GOMAX-BASE-IP67-T high-speed base unit to convert a single link into a point-to-multipoint (PtMP) network
• Add additional AIROLINX-GOMAX-KIT-IP67-T preconfigured kits to expand coverage across more sites without re-engineering the network

This lets integrators start with a single camera or intersection link and scale up to a distributed Security or ITS network using the same hardware family and the same Airolinx Go Studio workflow.

Every Airolinx Go MAX kit is backed by a 5-year warranty, reinforcing Antaira's commitment to hardware that performs in the harshest outdoor environments, from roadside heat to winter cold, without the premature failures that drive up total cost of ownership.

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@AntairaTech @OConnell_PR #PAuto #Safety #Transportation

Industrial-grade 3D vision with on-camera processing.

Teledyne e2v has announced Perciva™ ToF, its new industrial grade 3D Time-of-Flight (ToF) camera. Designed for reliable operation in demanding environments, Perciva ToF combines high-performance depth sensing, on-camera processing, and flexible integration for a wide range of applications, including logistics, robotics, inspection, and surveillance.

Powered by their Hydra3D™+ CMOS image sensor, Perciva ToF combines 832 x 600 pixel resolution with patented HiRho technology, which increases FFxQE at near-infrared wavelengths while maintaining excellent MTF and modulation contrast. Its 10 µm three-tap pixel architecture captures more light, enabling longer operating distances, reliable detection of low-reflectivity materials, and motion-artifact-free imaging of fast-moving objects. This enables accurate, dependable 3D measurements, even in high-speed industrial applications.

Perciva ToF has been engineered to deliver robust performance in challenging conditions, including varying outdoor illumination and interference caused by other systems, without requiring interconnecting cameras. Factory calibration and embedded processing simplify system integration by providing depth maps and point cloud data directly through the camera’s GigE interface.

The camera's industrial design and embedded intelligence enable developers and system integrators to deploy 3D vision capabilities more quickly in applications requiring reliable depth measurement and real-time performance.

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@e2vteledyne #PAuto #Security #3D_Vision

Connectors, cables and electromechanical products for Europe.

A wide range of products from Adam Tech are now being stocked at Anglia Components. This follows the signing of a pan-European franchise agreement with the US manufacturer of connectivity components and cables, electromechanical products, and power and protection solutions.

David Pearson, Technical Director at Anglia explained: “Adam Tech’s commitment to delivering high-quality products, exceptional service and competitive pricing aligns perfectly with Anglia’s own values and customer-first philosophy. Their extensive connector portfolio further strengthens our offering, enabling us to provide customers with a broader range of reliable interconnect solutions. We are particularly excited to make Adam Tech products available through our pan-European e-commerce platform, Anglia Live, giving customers fast, convenient access to the latest technologies, backed by Anglia’s renowned technical support and logistics expertise.”

Magen Rigdon - Adam Tech

“Europe is a highly diverse market, spanning a wide range of industries and applications. Adam Tech’s extensive product portfolio is designed to meet these varied requirements, making partnering with an experienced, financially strong, and independent distributor such as Anglia key. Their market expertise and reach will drive growth, expand market penetration, and maintain the integrity of the supply chain,” said Magen Rigdon, Global Distribution Sales Director at Adam Tech.

Adam Tech is a diversified manufacturer with locations and facilities spanning the globe. Its worldwide headquarters is in New Jersey, USA and its Asia headquarters is in New Taipei City, Taiwan. Both locations are fully staffed with sales and engineering support personnel.

During the past decades, Adam Tech has expanded its manufacturing and product development footprint across numerous countries and locations in China, Taiwan, Vietnam, and Malaysia. 

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@angliaComponent @angliaLive @AdamTech_ @BWW_Comms #Electronics #Pauto