Connectors to FPGA and SoC FPAG standard.

A new product portfolio designed for the SGeT oHFM.c standard has been announced by Samtec. These connectors are based on the company's proven AcceleRate® HD and AcceleRate® HP high-density, high-performance product families.

oHFM™, or Open Harmonized FPGA Module, is the world’s first open modular FPGA standard. It addresses the common challenges of unique pinouts, custom form factors, and proprietary thermal concepts of FPGA and SOM development by providing a unified, scalable architecture. Ready-to-use building blocks and clear design rules reduce engineering time for faster time-to-market.

Connector-based SOMs defined by the oHFM.c standard are optimized for compact high-speed interfaces, mid- to high-end FPGAs, and in-field upgrades using 5 mm or 10 mm stack height Samtec connectors. Samtec’s oHFM.c connectors feature high-density channels on a 0.635 mm pitch with performance targets of 64 Gbps PAM4 or 112 Gbps PAM4. Inside each connector, the narrow edges of the Edge Rate® contact system are aligned with the connector body to reduce broadside coupling and crosstalk, optimizing signal integrity. The Edge Rate contact system also features a smooth, broad milled mating surface which reduces wear and increases durability for high-cycle applications. Samtec’s IPC Class 3-compliant solder column board termination technique is used to secure connectors to the printed circuit board. Solder column termination provides superior solder joint reliability and excellent insertion loss and return loss performance.

Designed to meet the evolving demands of FPGA-based compute platforms, Samtec’s interconnect solutions enable scalable, flexible, and reliable system architectures for next-generation embedded and edge applications.

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@SamtecInc  @TechWireIntl #Electronics #PAuto #Connectors

Ultra-high-resolution imaging.

Teledyne DALSA has released the new Linea™ ML 32K line scan camera. Designed for ultra-high-resolution imaging in semiconductor wafer and electronics inspection, the Linea ML 32K camera joins the existing Linea ML family, delivering exceptional image quality with 2.5 µm pixels and a maximum line rate of 150 kHz.

The Linea ML family features a multiline CMOS sensor, available in 8k, 16k, and now 32k resolutions, with optimized quantum efficiency to meet the rigorous demands of current and future machine vision applications. Its multiline sensor architecture enables configuration for single-line, dual-line, trilinear color, or quadlinear multispectral imaging, depending on application requirements. Unique features such as sequential exposure provide versatility and flexibility to meet a variety of demanding requirements.

The small 2.5 µm pixel size makes the Linea ML 32K particularly well suited for inspecting entire 300 mm wafers using a single camera. Features such as HDR and sequential exposure significantly improve the detectability of small defects. The camera also includes Camera Link HS® CX4 connectors for Active Optical Cables, providing complete EMI immunity.

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@TeledyneDALSA  @TeledyneVisInd @TeledyneVisSci #PAuto #Electronics

New registered dual in-line memory module (RDIMM).

Supports demanding Ai and enterprise-server workloads.

The launch of Innodisk's new industrial-grade DDR5 8000 RDIMM has been announced. This expands its DDR5 portfolio for compute-intensive applications such as edge AI and enterprise servers. Delivering industry-leading data transfer speeds of 8000 MT/s, 11.1% higher than the previous generation, the module addresses growing memory bandwidth requirements while enhancing signal integrity and transmission reliability, enabling system developers to achieve higher performance and stability in next-generation designs.

Pairing high bandwidth with reliability for faster Ai computing.
As Ai models grow in scale and complexity, the efficient movement of massive datasets becomes increasingly critical to system performance. The DDR5 8000 RDIMM raises data transfer speeds to 8000 MT/s and offers capacities ranging from 16GB to 64GB, supporting applications such as large language models (LLMs), generative AI, digital twins, and telehealth. Additionally, it improves data throughput for demanding workloads, while its registered ECC architecture enhances signal quality and error correction for more reliable Ai processing.

Built for Harsh Industrial Environments and System Resilience Innodisk’s DDR5 8000 RDIMM is engineered with rigorous validation and built-in protection features to support continuous operation. Integrated Transient Voltage Suppressor (TVS) diodes and eFuse protection help mitigate the risk of system failure caused by voltage fluctuations and abnormal power conditions. Designed for prolonged industrial use, the modules also feature 30μ” gold fingers and anti-sulfuration protection, enhancing contact durability and corrosion resistance for extended service life.

Advancing memory performance for the Ai era.
“The rapid expansion of Ai workloads is reshaping system performance requirements, with the ability to efficiently handle vast data volumes becoming just as important as compute power,” said Samson Chang, GM of Embedded DRAM Division at Innodisk. “The DDR5 8000 series helps customers overcome memory bandwidth bottlenecks while offering a more flexible path to system upgrades through enhanced memory performance, serving as a keystone for edge AI applications.”

Innodisk will roll out additional DDR5 8000 modules in Q1 2027, including CUDIMM, CSODIMM, ECC CUDIMM, and ECC CSODIMM, offering broader options across diverse system designs.

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@Innodisk_Corp @mepaxIntPR #PAuto #Ai 

Optimising quality control lab testing.

New QC lab scheduling capability synchronises lab testing with real-time production conditions to improve efficiency and flexibility.

DeltaV™ Real-Time Scheduling (RTS) software has been enhanced by Emerson so that extends integrated, real-time manufacturing scheduling capabilities to quality control (QC) labs. The new capability automates complex scheduling rules and logic to optimise lab operations and keep QC activities continuously synchronised with changing production conditions, helping life sciences manufacturers improve throughput, reduce delays and accelerate decision-making.

QC labs face numerous challenges that limit efficiency and scalability. Labs receive many samples from multiple points throughout the manufacturing processes across a plant and must conduct a wide range of tests on those samples. As labs navigate equipment availability, multi-sample test capabilities, technician capacity, incoming samples and shifting priorities, scheduling quickly becomes too complex for the whiteboards, spreadsheets and lab information management systems commonly used today.

“Well-run QC labs are a keystone of ensuring quality and meeting delivery commitments. By driving efficiency, QC teams ensure samples are tested with results returned promptly, enabling manufacturing to proceed without delays and quality teams to promptly determine product disposition so therapies can reach patients on time,” said Kristel Biehler, vice president of life sciences for Emerson’s process systems and solutions business. “QC scheduling in DeltaV RTS software is a simple and effective tool providing automated, real-time scheduling to integrate the lab with the shop floor to make the most effective use of resources and eliminate bottlenecks.”

The enhancement provides fit-for-purpose QC lab scheduling directly into Emerson’s proven DeltaV RTS software, harmonising schedules with manufacturing operations. Users can ensure that testing is executed correctly at the right time on the right equipment, including both production-dependent and final product testing. Integration with real-time lab information management systems automates lab schedule alignment, ensuring accurate updates to changing priorities and sample availability. The software empowers teams to implement and automate complex rules to optimise the lab, such as analytical test run sample batching and other advanced scheduling strategies.

This expanded DeltaV RTS functionality enables the scheduling rules to be configured in a flexible manner, which empowers lab schedulers to quickly adapt to the dynamic needs of the testing lab, even when supporting new product introductions. Ultimately, this functionality can reduce the manual QC lab scheduling effort and improve on-time delivery of test results to enable faster, more reliable release of batches.

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@EMR_Automation @EmersonExchange@Emerson_News @HHC_Lewis #PAuto  #TandM

New head for power solutions provider in India.

Danfoss Power Solutions has named Anup Deshmukh Managing Director of its India business, effective immediately. In this newly created role, Deshmukh will report directly to Henrik V. Jørgensen, President, Controls Division. Deshmukh is based in Pune, India.

Anup Deshmukh

In his new role, Deshmukh will be responsible for driving business growth and ensuring effective execution of Danfoss Power Solutions' strategies across India. He will build and maintain strong relationships with key customers, partners, and stakeholders, and he will create and execute strategies to attract, develop, and retain talent across multiple functions. Deshmukh will lead the Danfoss Power Solutions India Leadership Team, and he will represent the Power Solutions segment on the Danfoss India country governance board.

"India is one of the most important growth markets for Danfoss Power Solutions, and I am honoured to lead the team here at this stage of our journey,” Deshmukh said. “My focus will be on strengthening our customer partnerships, building local capabilities, and positioning our India business for long-term, sustainable growth."

"Anup brings deep operational and commercial experience from across India and the broader Asia-Pacific region," Jørgensen said. "His track record of building high-performing teams and driving growth will be a strong asset as we continue to invest in India as a strategic market."

Deshmukh brings nearly 28 years of experience spanning sales, business development, general management, manufacturing operations, and strategic growth to his new role. He joins Danfoss from Parker Hannifin, where he held senior leadership roles across India, China, and Southeast Asia, most recently serving as Country Sales Director within the company's Filtration, Engineering Material, Instrumentation, Fluid Control, and Motion Control groups in India. Prior to Parker Hannifin, Deshmukh served as Sales Manager for General Electric in India.

He holds a degree in chemical engineering from Shivaji University, along with diplomas in marketing and business management from NMIMS and ICFAI, respectively.

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@Danfoss @NapierPR #PAuto #Power #India

High-performance edge computing multiscreened platform with Ai performance.

Displays maps, video streams and operational data across three 14-inch screens while bringing powerful Ai processing directly into the field.

Bressner Technology is expanding its range of rugged mobile computing systems with the Durabook Z14I-DX3, an exceptional mobile workstation that combines three Full HD touchscreens with the latest Intel® Core™ Ultra technology and optional NVIDIA® graphics acceleration. It has been developed for applications in which large volumes of information need to be assessed simultaneously and a conventional laptop would quickly reach its limits.

The Z14I-DX3 is available from Bressner with immediate effect. The company sees potential applications particularly in government agencies and emergency services, energy and utilities, field engineering, maritime environments and industrial operations.

Three displays, one integrated workspace.
In addition to its central 14-inch display, the Z14I-DX3 features two fold-out side screens. Within moments, the system can be transformed into a mobile workstation with three full-size displays. For transport, the additional screens fold inwards and remain securely attached to the device. No separate monitors, cables or mounting hardware are required.

The additional screen space is particularly useful when several sources of information need to remain visible at the same time. An operational map can be shown on the main screen, for example, while a live video stream runs on the second display and telemetry or sensor data is presented on the third. This arrangement also simplifies the control of unmanned systems, technical diagnostics and the monitoring of geographically distributed equipment.

All three touchscreens provide Full HD resolution, a brightness of 1,200 nits and DynaVue® technology for improved readability in direct sunlight. They can be operated using a finger, gloves or a stylus and continue to support reliable input in wet conditions. Display brightness can be adjusted simultaneously across all three screens or individually for each display.

Processing power for demanding edge applications.
The Z14I-DX3 is powered by Intel® Core™ Ultra processors with an integrated Intel® AI Boost NPU. This enables AI-assisted workloads to be processed directly on the device, reducing dependence on a reliable connection to data centers or cloud services. This is a significant advantage in remote locations and time-critical operations.

For more demanding applications, Durabook offers a choice of dedicated NVIDIA® GPUs. Available options include the RTX™ A500 AI accelerator, RTX™ 3500 Ada and RTX™ 5000 Ada. The most powerful configuration delivers up to 682 TOPS and is suitable for tasks such as real-time image recognition, sensor fusion and local video analysis. Combined with the platform’s CPU and NPU, the system’s total Ai performance exceeds this figure.

“The Z14I-DX3 rugged mobile laptop with its triple-screen design is a prime example of how Durabook is moving beyond the expected evolution of rugged computing,” said Fred Kao, CEO of Twinhead. “The Z14I-DX3 combines the capabilities customers expect from a rugged Durabook computer with an expansive multi-screen workspace and Ai performance in a powerful edge computing platform.” 

Modern and legacy connectivity.
Mobile operations often require both new and existing equipment to be connected. The Z14I-DX3 therefore offers a broad selection of interfaces, including Thunderbolt™ 4, two RJ-45 Ethernet ports, two serial RS-232 ports, ExpressCard 54 and USB ports spanning several generations.

Wireless connectivity is provided through Intel® Wi-Fi 7 and Bluetooth® 5.4. Depending on the selected configuration, the workstation can also be equipped with dedicated GPS as well as 4G LTE or 5G mobile connectivity. Nano-SIM and eSIM are supported.

Two removable NVMe PCIe SSDs can be exchanged without tools in a matter of seconds. This makes it easier to switch between different operational profiles and supports the secure handling of sensitive data. Security options include a smart card reader, a Windows Hello-compatible webcam, an RFID/NFC reader and a fingerprint sensor.

Designed for use beyond protected office environments.
The Z14I-DX3 is certified to MIL-STD-810H and MIL-STD-461G. Its design therefore addresses both mechanical stresses and operation in electromagnetically demanding environments. The rugged construction makes the workstation a mobile alternative for tasks that have traditionally required a fixed command station or several separate devices.

Bressner supports users in selecting the appropriate processor, graphics solution, storage capacity and communication options. The company can also assist with integrating the workstation into existing IT and operational environments.

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@BRESSNER_Tech@UnnGmbh @PresseBox #PAuto #Display #Ai

Swiss innovation in sensors.

Sensirion ranks third among the top 100 most innovative companies in Switzerland in 2027. Innovation has been part of the company's DNA ever since its founding. The company’s commitment to innovation has now been confirmed by the ranking of “Top 100 Innovative Companies Switzerland 2027.” With its third-place ranking, Sensirion has been recognised as one of the most innovative companies in the country. The award from Bilanz, PME and Statista* is based on a comprehensive analysis of innovation achievement, patent strength and innovation culture. The top-three ranking underscores Sensirion’s leading role as an innovation partner for sensor solutions worldwide.

Being named the third most innovative company in Switzerland confirms Sensirion’s consistent focus on innovation and the continuous development of trailblazing sensor solutions. Sensirion invests in research and development to support customers around the world with precise and reliable technologies for applications in industry, medical technology, consumer electronics and automotive industry.

The Top Innovative Companies Switzerland 2027 ranking was conducted by Bilanz, PME and Statista and is based on a multi-stage assessment process. The analysis incorporated the assessments of employees, evaluations by external innovation experts and the strength of a company’s patent portfolio. In total, more than 5,000 people were surveyed and around 20,000 company evaluations were carried out. The patent data was provided by LexisNexis Intellectual Property Solutions and rated using the Patent Asset Index, which considers both the technological relevance and the economic significance of the patents.

The evaluation was based on three equally weighted innovation dimensions: product innovation, process innovation and innovation culture. It took into account the development of new products and technologies, the continuous improvement of processes and digital solutions, and a working environment that fosters creativity, entrepreneurship and the implementation of new ideas.

With its third place in the ranking, Sensirion is one of the companies that not only drive innovation through technological excellence, but make this ethos an integral and enduring part of their processes and corporate culture. This result underscores the company’s ambition to create long-term added value for customers, partners and society through continuous innovation.

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* More information on the top 100 most innovative companies in Switzerland.

@sensirion @BILANZ #Electronics #PAuto #Switzerland