Board connector.

Samtec has released its 1.0 mm vertical compression mount board connector, the 100-CM Series. Designed for next-generation millimeter-wave test and measurement applications for W-band and into D-band (DC to 120 GHz), the 100-CM’s wide performance margin delivers greater reliability, precision, and repeatability through upper-limit frequencies without having to transition to complex waveguides or more expensive 0.8 mm equipment.

The solderless compression mount design enables field-replaceable functionality and layout flexibility by allowing the connector to be used in a range of PCB locations. Unlike soldered board interfaces, compression mount technology helps simplify installation, replacement, and evaluation while supporting repeatable millimeter wave performance.

Another key differentiator of Samtec’s 100-CM Series compression-mount interconnect is its alignment features. Alignment grooves milled into the connector foot, paired with fiducials on the PCB, ensure the alignment pin is centered on the landing pad. This precise positional accuracy facilitates peak connector performance and optimal signal integrity. Performance is specified at a VSWR of 1.25:1 from DC to 40 GHz, 1.4:1 from 40 GHz to 110 GHz, and 1.6:1 from 110 GHz to 120 GHz, including microstrip PCB launch.

Samtec 1.0 mm vertical compression mount jacks mate with 1.0 mm low-loss flexible microwave cable assemblies, including Samtec’s proprietary and highly stable-over-flexure Nitrowave® cables (LL095 and LL110 Series). Nitrowave cable’s novel construction, including a Dynamic Performance Layer (DPL), supports reliable, repeatable measurements in demanding lab environments.

At millimeter-wave frequencies, connector launch design becomes increasingly critical. Samtec offers signal integrity support, including board launch optimization, e-field simulation, and 3D modeling, to help ensure maximum system performance. Contact RFgroup@samtec.com for RF launch optimization and design support.

The extended frequency range of Samtec’s 100-CM connectors provides engineers additional margin when developing and validating advanced RF, microwave, and high-speed digital systems.

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@SamtecInc  @TechWireIntl #Electronics #PAuto

Thermoplastic connectors for multiple industries.

Amphenol Sine Systems’ ATD Series™ connectors are now available from Inelco Hunter. They are engineered for demanding, high‑reliability applications across multiple industries. The ATD Series is a compact, high-density, heavy-duty, thermoplastic solution with superior environmental seals and end caps for exceptional rear seal retention. They are available in a 20 (4+16 Mixed) position layout.

As a hybrid system, these connectors facilitate the simultaneous transmission of power and signals within one unit. Their compact design offers increased flexibility for wire harness designers, enabling efficient space use without sacrificing functionality. The ATD connectors have been developed to be comparable with other similar existing products industry-wide.

The connectors can accommodate a wire range of 14-22AWG, with a current of up to 13A, and up to 16/20 contacts. They are IP67, IP68 and IP69K rated in a mated condition, featuring a thermoplastic housing with integrated latch for secure mating. ATD Series plugs and receptacles include integrated Terminal Position Assurance (TPA) Wedgelocks. Plugs are available with an optional Connector Position Assurance (CPA) Lock, which simplifies assembly, installation, and repair by minimising the need for additional components or specialised tools.

Uses will include demanding applications such as marine, heavy equipment, agricultural, automotive, transport, aviation, alternative energy, as well as many other rugged interconnect applications.

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@InelcoHunter @amphenol #PAuto

Interconnect platform.

Vertical and right-angle orientations optimise internal space utilisation, minimise cable strain and accommodate diverse layout requirements.

Molex has unveiled MiniMix Hybrid Power and Signal Connectors, a purpose-built interconnect platform designed to solve manufacturing and packaging challenges in next-generation humanoid robotics, autonomous mobile robots (AMRs) and advanced industrial automation systems. Combining 15.0A power and high-speed Ethernet communication within a single, ultra-compact interface, MiniMix streamlines installation in space-constrained joints, actuators and robotic mechanisms, reducing connector count, cabling complexity and assembly effort.

“Humanoid robot manufacturers are rapidly moving from prototype builds to commercial mass production, but traditional joint wiring methods create major manufacturing bottlenecks," said Brian Hauge, president and SVP, Consumer and Commercial Solutions, Molex. “MiniMix replaces tedious manual assembly with an integrated solution for power and signal transmission, freeing robotics designers to build sleeker, lighter and more responsive autonomous systems at scale.”

Overcoming manufacturing obstacles.
Integrating power and signal connectivity into increasingly compact joints, actuators and articulated mechanisms without sacrificing performance is a major hurdle for the robotics industry. Design engineers face severe space and assembly constraints in multi-axis articulated joints—such as wrists, elbows, knees, ankles and neck assemblies—where actuator motion systems must route high power and high-speed control data through extremely tight channels.

Traditional approaches using separate power and signal connectors are typically too bulky and heavy to fit in these confined spaces, forcing manufacturers to thread bare wires manually and hand-solder terminals during final assembly, which introduces potential failure points and slows production output.

The Molex MiniMix Hybrid Power and Signal Connectors resolve these manufacturing challenges by consolidating up to 15.0A power contacts and 1Gbps 1000BASE-T1 Ethernet communication into a single integrated interface. Featuring an ultra-compact 5.65mm routing profile, MiniMix is the industry’s smallest hybrid connector, requiring up to 50% less routing area than alternative options. This enables pre-terminated cable assemblies to pass smoothly through narrow internal actuator channels, articulated limbs, robotic joints and end-effectors.

Offered in vertical and right-angle mating orientations, the Molex MiniMix Hybrid Power and Signal Connectors can accommodate diverse layout requirements while optimising space utilisation and reducing cable strain. Furthermore, its robust, vibration-resistant mechanical design withstands continuous motion and constant flexing, ensuring reliable electrical performance and long-term durability across repeated movement cycles.

Purpose-built for next-gen robots.
The Molex MiniMix Hybrid Power and Signal Connectors offer wire-to-board connector and cable assembly solutions that are ideally suited for evolving robotic applications where space, weight and reliability are crucial. According to a 2026 supply chain analysis by McKinsey & Company, joint actuator systems represent 40% to 60% of a humanoid robot’s total bill of materials (BOM), intensifying requirements to optimise sub-assembly space and eliminate manual cabling labor. As robots scale to include approximately 50 articulated joint actuators, integrated connectivity solutions like the Molex MiniMix Hybrid Power and Signal Connectors will play a pivotal role in facilitating plug-and-play assembly, reducing harness weight and minimising potential failure points across next-generation humanoid robotic architectures.

Samples and functional evaluation assemblies of the Molex MiniMix Hybrid Power and Signal Connector family are available now for customer design-in and joint evaluation, with full commercial production scaling slated for late 2026. Molex connects humanoid robotic systems.

The MiniMix Hybrid Power and Signal Connectors are the latest Molex solution to meet the demands of next-gen robots, AMRs and advanced industrial automation systems. .

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@MolexConnectors @NapierPR #PAuto #Robotics

Power solutions leader acquired.

TE Connectivity plc has entered into a definitive agreement to acquire Astrodyne TDI, a leading provider of advanced power management and filter solutions for mission-critical industrial applications, from Tinicum L.P. This acquisition represents another deliberate step in TE's disciplined long-term strategy to build a differentiated portfolio of highly engineered technologies benefiting from secular growth trends.

Headquartered in Hackettstown, New Jersey, and with manufacturing operations in North America, China and Southeast Asia, Astrodyne TDI has a proven track record of solving complex power electronics challenges. The company is recognised for its deep engineering expertise and close collaboration with customers developing next-generation technologies across semiconductor manufacturing equipment, medical, and industrial applications.

“Automation, electrification, and digitalisation trends across industries drive the need for advanced power electronics in our customers’ applications. Astrodyne TDI’s expertise in custom-engineered power supplies and filter solutions complements our product portfolio, strengthens our ability to solve increasingly complex technical challenges and deepens our partnership with our customers in many fast-growing market segments,” said Carlo Ghirardo, SVP & GM of TE’s Industrial Automation and Electrification business unit. “We’re proud to partner with a company and team that is widely recognised for engineering excellence, product performance, reliability, and commitment to innovation. We look forward to welcoming the team to TE.”

“The agreement announced today with TE Connectivity represents an exciting opportunity and a bright future for our company, our customers and our team,” said Chris Viola, CEO of Astrodyne TDI. “Our legacy of exceptional engineering and highly reliable power electronics is a testament to our team and the great work we’ve done in our nearly 70 years in business. TE Connectivity’s global scale, manufacturing footprint, and R&D resources will enable us to accelerate product innovation and better support our customers' increasingly complex system architectures.”

“We are excited for Astrodyne TDI to join TE Connectivity, where the business will receive the support necessary to continue scaling its engineering and operational resources to better serve customers,” said Jeffrey Ernsting, Partner at Tinicum. “We will miss working with Astrodyne TDI’s incredibly capable and dedicated team, and we wish them all the best as they join TE Connectivity.”

The transaction is subject to customary regulatory approvals and closing conditions. Upon closing, Astrodyne TDI will continue to operate under its current leadership team and become part of TE’s Automation & Connected Living sector. Citi is serving as financial advisor and Davis Polk is serving as legal advisor to TE Connectivity on this transaction. William Blair & Company and Houlihan Lokey are serving as financial advisors and Goodwin is serving as legal advisor to Tinicum and Astrodyne TDI.

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@TEConnectivity @Astrodyne @ttiinc #PAuto #TandM #Connector

Angled launch connectors.

Full production quantity availability of Samtec's new 1.85 mm 30-degree angled launch board connector (185-AL Series) has been announced. This series delivers precision RF performance through 67 GHz while solving common mechanical and routing challenges found in dense, millimeter wave lab test and evaluation environments.

Modern RF and high-speed digital test boards often face tight mechanical constraints that make cable routing difficult or unreliable. The 30-degree angled launch geometry of the Samtec 185-AL Series allows coaxial cables to exit the PCB in a natural direction, significantly reducing sharp bends that can degrade electrical stability.

The solderless, compression mount design enables field replaceable functionality. Eliminating the need for solder reflow enables rapid connect/disconnect to the printed circuit board, significantly reducing downtime and allowing connector reuse. It also removes performance variability that can occur with solder, enabling repeatable precision millimeter wave performance.

Threaded coupling provides high mechanical reliability. Mating interconnects include Samtec’s high-performance microwave cable assemblies, such as .047” diameter RF047-A Series cable, .086” diameter RF086 Series cable, and stable during flexure Nitrowave® LL071 Series cable. Mechanical stress when bending or twisting can change the dielectric’s properties and alter performance, with effects more pronounced at higher frequencies. Nitrowave cable’s optimised cable construction, which includes a Dynamic Performance Layer, protects from measurement errors that can occur due to flexure.

At millimeter wave frequencies, connector launches become increasingly complex. Samtec offers signal integrity support such as board launch optimisation, e-field simulation, and 3D modeling to help ensure maximum performance through a system. Contact RFgroup@samtec.com for RF launch optimisation and design support.

1.85 mm 30-degree angled launch connectors are available direct from Samtec.

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@SamtecInc @TechWireIntl #Electronics #PAuto #TandM

Liquid cooling systems' connectors.

Amphenol Industrial Operations’ range of connectors for liquid cooling systems are available from Inelco Hunter. These connectors are specifically designed for demanding energy applications such as Ai Data Centres, ESS, and EV Charging Stations, as well as the evolving needs of hyperscale and next-generation energy storage.

Ai data centres and other demanding energy environments require integrated liquid cooling around the clock, 24/7, and have to handle the high levels of heat constantly that are constantly generated. Amphenol’s connectors ensure reliable connection, minimal pressure loss and consistent integrity suited to virtually any high-performance, liquid-cooled environment. The connectors incorporate a dual safety interlocking mechanism for improved spill protection. The durable, corrosion-resistant construction ensures easier maintenance and safer operation.

The flagship of the liquid cooling series, UQD and UQDB connectors fully comply with the Open Compute Project (OCP) Rev 2.0 specifications. The UQD Series offers quick connect technology, while the UQDB features blind mating for easy installation. The latest OCP specification offers a hybrid configuration enabling the UQD plug to mate with a UQDB socket.

With flow performance up to 800 L/min, the semi-hand mate (SHQD) self-sealing connector series features a dual interlocking safety mechanism as well as large-diameter valve designs of 1", 1.5" or 2”, facilitating full-flow, low-resistance liquid cooling between a coolant distribution unit (CDU) and a manifold (distribution pipe). This ensures reliable operation and minimises pressure drop in high-flow applications.

The Multi Quick Disconnect (MQD) connectors incorporate a push-pull locking mechanism in a compact design to provide high performance and reliability for compact computer tray environments. Fundamental to enabling the next generation of liquid-cooled systems, the MQD comes in sizes 02, 03, and 04, all of which have both a straight version and an elbow 90° right angle version for flexible installation and ease of use.

Reliably distributing coolant across a multi-channel network, Amphenol’s manifold design provides the infrastructure for optimal cooling across the entire system. Made of durable material, such as stainless steel, copper, aluminum, or durable plastics, the manifold promotes corrosion resistance, whilst facilitating thermal management to reduce overheating risks and energy use. Customised manifolds are available with short lead times for quick installation in a range of applications, from high performance data systems to electric vehicles and industrial machinery.

The new connectors come in a variety of termination options, such as threaded, hose barb and sanitary flange, with customisation upon request, and the outer shells employ corrosion-resistant stainless steel. As standard, EPDM rubber seals provide chemical and thermal resistance against a range of glycol-based coolants, with additional seal options available depending on a system’s coolant or fluid.

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• See also:Coolant Temperasture Sensors (30/3/2026) 

@InelcoHunter @amphenol #PAuto 

Connectors for high-density Ai.

The release of the ARJ6 cable-to-cable, high-density panel mount cable assembly has been announced by Samtec. Supporting PCI® 6.0/CXL® 3.2 and 100 GbE in Ai architectures and FPGA prototyping, the ARJ6 cable assembly is part of Samtec’s popular AcceleRate® HP family with 112 Gbps PAM4 performance per channel.

Cable to cable.
Their ARJ6 cable assembly mounts into a panel bracket (ARJ6-PB). When paired with the ARP6 Series, the ARJ6 cable assembly enables cable-to-cable connection at the front panel, mid-plane, or backplane, which eliminates the need to route signals through a PCB. The ARJ6-to-ARP6 cable-to-cable connection also uses direct-attach technology which removes the transition PCB inside the cable assembly housing and replaces it with high-density contacts that solder directly to the cable. Removing unnecessary PCBs at both the panel and within the connector assembly itself streamlines the signal path and improves impedance control, overall signal integrity, and density.

Extreme density and performance.
In addition to eliminating unnecessary PCB transitions, the ARJ6 AcceleRate HP cable system balances density and performance with designated signal mapping and staggered row-to-row spacing, which reduces crosstalk. High-density differential pair configurations are available with 25 or 37 positions per row on 4 or 6 rows.

ARJ6 uses Samtec’s 34 AWG, 92 Ohm Eye Speed® Thinax™ cable which has approximately a 40-percent smaller cross-sectional area compared to equivalent micro twinax cable. This makes it easier to route through a system while also maximizing air flow and reducing weight. Eye Speed cable is designed to manage intrapair skew by eliminating physical mismatch within a differential pair and controlling skew to very low and predictable levels, especially at 112 Gbps PAM4 speeds and beyond. Advanced co-extrusion techniques create best-in-class symmetry between conductors and shielding, resulting in a maximum skew of 3.5 ps/meter.

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@SamtecInc @TechWireIntl #Electronics #Ai 

Panel mounted audio jack addition.

A new 3.5mm 4-Pole Panel Mount Audio Jack has been added to Cliff Electronics' popular range of FeedThrough (FT) connectors for applications such as audio, communications equipment and audio visual (AV) systems. They provide through panel female-to-female connectivity, allowing standard off-the-shelf cables to be used for external and internal wiring. These FeedThrough connectors offer users a better build outcome with clean, serviceable and neater cable routing.

The new Audio Jack connectors are panel mounting, passthrough keystone couplers with tin-plated copper alloy contacts for Tip, Ring, Ring & Sleeve (TRRS), for Stereo and microphone / control. Key features include:

• Female to Female FeedThrough connectivity.
• Plug connection from both sides – no internal wiring.
• Stereo with microphone control.
• Available in standard XLR , SLIM and DualSLIM frames.
• Front or rear mounting.
• Plastic or metal frame
• Secure panel flange with M3 or countersunk fixings

The new FeedThrough connectors may be rear mounted providing a near flush face for compact boxes or front mounted with flush, quick swap countersunk fixing screws.

Their growing range of FeedThrough connectors now offers analogue, digital and optical connectivity in formats including SMA and RP-SMA, BNC (50 or 75 ohm), MMC, DisplayPort, HDMI, Optical fibre (FC, LC Duplex, SC Simplex, ST BFOC, TOSLINK and US Conec MTP® brand MPO), RCA phono, RJ45 ethernet (UTP or FTP) in Cat6, Cat6a or Cat5e, USB 2, USB 3 and USB-C.

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@proactivefleet #CliffElectronics #PAuto #Electronic #TandM

Edge-mount board connector.

Production quantity are now available of Samtec's new high-frequency, 50 Ohm impedance, SMA edge-mount board connector delivering repeatable, reliable performance through 26.5 GHz. The edge-mount design terminates directly to the PCB edge, providing a compact signal path that minimizes discontinuities and lowers return loss when compared to vertical or right-angle connectors.

These connectors are suitable for 5G/6G wireless infrastructure, test & measurement, military, and aerospace applications. They feature a gold-plated body and contact (30 µin center contact, 10 µin outer contact) enabling superior electrical conductivity and durability. Their construction offers resistance to corrosion and enables up to 500 mating cycles. The 4-post through-hole design further enhances durability, allowing for greater mechanical reliability when connecting to the board.

Several coaxial cable varieties mate with Samtec’s SMA board connectors. Samtec offers SMA connector assemblies using low-loss flexible microwave cable in small and large diameters ranging from .047” to .277”, semi-flexible cable, or phase and amplitude stable Nitrowave™ high-performance cable (Series: LL043, LL032). Pairing the SMA connectors with a variety of cable types allows Samtec to support rapid application-specific customization, delivering efficient lead-time efficiencies with off-the-shelf solutions.

As frequencies increase, connector launches become increasingly complex. The company offers signal integrity support such as board launch optimization, e-field simulation, and 3D modeling to help ensure maximum performance through a system.

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@SamtecInc @TechWireIntl #Electronics #TandM  #Aerospace

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Portfolio of high-reliability connectivity solutions expanded.

Acquisition assures more localised design and engineering support across North America, Europe and Asia

The acquisition of Smiths Interconnect, a subsidiary of British-based Smiths Group plc, has been completed by Molex. This marks "a major milestone in Molex’s vision to enable technology that is transforming the future and improving people’s lives." Smiths Interconnect brings a diverse portfolio of complementary products and advantaged capabilities in ruggedised custom connectors, contacts, RF components and optical transceivers for harsh environments. Smiths Interconnect also brings leading semiconductor test capabilities that complement Molex’s data communications and data center solutions to support growth in AI, along with a strong medical interconnect capability to support Medtech customers.

“We are excited to finalise the Smiths Interconnect acquisition, which expands our portfolio and engineering expertise worldwide,” said Joe Nelligan, CEO, Molex. “Along with their products and technology, we are excited about the Smiths Interconnect’s global team and the strong customer relationships that they have established.”

As the largest acquisition in Molex’s history, the addition of Smiths Interconnect positions Molex to drive innovation across the high-reliability interconnect market—encompassing aerospace and defense, space exploration, industrial, medical and semiconductor test industries. The combination of Smiths Interconnect’s capabilities with Molex’s global footprint, engineering strength, culture and financial strength enables Molex to deliver increased value to customers around the world.

“This acquisition reinforces Molex’s position as a leader across every sector where high reliability is critical,” said Michael Cole, SVP and president, Aerospace and Defense Solutions Division, Molex. “By unifying these high-reliability solutions under the Molex banner, we provide a borderless platform that enables engineers to leverage ruggedised, precision-engineered connectivity.”

The Smiths Interconnect acquisition expands Molex’s global footprint to over 90 plants across 22 countries, and its global headcount to over 55,000 employees. The integration creates strong design and technical alignment to enhance innovation and solution capabilities to provide more value to customers.

This news builds upon the November 2024 acquisition of AirBorn by Molex, a foundational milestone in serving customers in the aerospace and allied sectors.

“The integration of Smiths Interconnect into the Molex engineering ecosystem is a significant win for the global design engineering community,” said Lew LaFornara, SVP, Global Interconnect Business Strategy, TTI. “As a prominent Smiths Interconnect distributor, we are excited to continue offering our customers access to a robust line of mission-critical solutions—spanning aerospace and defense, medical, industrial and semiconductor test—all backed by Molex’s world-class logistics and technical support."

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@MolexConnectors  @smithsinterconn @NapierPR #PAuto 

Touch-protection keeps users safe.

High-current meets high safety.

Robot-human interaction can be a complex field with high safety requirements. Especially when dealing with high-current solutions, the emphasis on user safety cannot be strong enough.

One important aspect is increasing user safety, the other one is keeping product advantages at the same time. That’s why ODU’s new ODU-MAC® Silver-/White-Line high-current modules come with extra features. Up to 255 A and 2.5 kV (PD 2) call for an increase in clearance and creepage. Additionally, IP2X touch-protection has been added to the pin side.

While this optimisation is necessary for any high-current application, the modules have more advantages by using ODU LAMTAC® Flex contacts: a minimum of 100,000 mating cycles and decreased mating forces of up to 10 N.

The benefit for the user: a safe, highly reliable and durable high-current interface, making it ideal for use in AGVs/AMRs, where the ODU-MAC® SilverLine is the interface between robot and the station, or high-power applications in general. Of course, the new modules can be combined with regular ODUMAC® Silver-/White-Line modules to create a modular connector specifically adapted to any customer requirement.

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@ODU_Connectors @UnnGmbh @PresseBox #Robotics #PAuto

Connectors for harsh conditions.

The Amphenol heavy|mate® series of heavy-duty rectangular connectors, which consists of hoods, housings, inserts and contacts are available through Inelco Hunter. The connectors form a modular system, designed for applications in harsh industrial environments. On-site installation is rapid and cost-effective, using stamped crimp contacts to ensure consistently high-quality connections.



Heavy|mate® connectors feature a robust design with a safe locking mechanism, suitable for signal, power, pneumatic, coax and ethernet connections, all in a single connector to a customer-specified configuration. With excellent EMC protection and water-resistant ratings from IP65 to IP69K, they can be used in outdoor and indoor applications. The connectors are vibration-proof and have excellent corrosion resistance, and come with VDE, UL, CSA approvals. Potential markets include industrial, chemical, marine, military, transport and EV applications.

The heavy|mate® range offers a wide variety of pole sizes from 3 up to 280 poles per connector, with current ratings up to 250A per contacts and voltages up to 1000V. Configuration is very simple: select an insert that meets the application's requirements, choose the related contacts (if not included in the inserts), choose the related housings and finally, choose the related cable gland. Cable assemblies are also offered upon request.

Inelco Hunter's engineering support provides comprehensive technical backup for every product in the extensive range of products. Inelco Hunter can also help customers with the design of their application. The engineering team can help define the project requirements, including as-yet unformed product ideas, turning a concept into an outstanding product. This added-value support is at the core of Inelco Hunter’s philosophy, and has been for over 30 years.

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@InelcoHunter @amphenol #PAuto 

Benchmark for Test & Measurement.

Engineered to solve complexities of multi-channel signal routing in complicated test environments.

An industry benchmark for Test and Measurement (T&M) has been claimed with the introduction of Molex Cardinal Multi-Port High-Frequency Coaxial Assemblies. Supporting frequencies up to 145 GHz, this product represents a strategic expansion of the Cardinal family, evolving its proven mechanical integrity into the high-bandwidth spectrum required to validate the next generation of AI-driven architectures and 6G wireless infrastructure.

“The expansion to 145 GHz represents a natural evolution of the Cardinal product line, which was built to solve the growing need for increased port density without compromising signal integrity,” said Roman Buff, general manager, RF, Molex. “This new high-speed solution integrates high-frequency contact technology in the Cardinal multi-port housing, empowering engineers to bridge the gap from AI to 6G and test the silicon of tomorrow using the infrastructure of today.”

Testing ahead of the curve.
While 110 GHz has been the benchmark for high-performance testing, the surge in 6G research and AI backhaul demands a raised ceiling. The new 145 GHz Cardinal product from Molex characterizes signals that were previously beyond the reach of standard coaxial interfaces. The new assemblies deliver phase-matched, high-precision connections up to 145 GHz, optimized for minimal insertion loss and superior return loss at extreme frequencies.

This latest Cardinal solution also supports data characterization rates up to 448 Gbps, enabling use with next-generation devices and systems. By pushing the measurement envelope, this versatile product helps engineers meet today's standards while validating the silicon and networking protocols that will define the next decade of global connectivity.

The multi-port design of the Cardinal assemblies supports simultaneous, high-density testing in a compact footprint, accelerating research and development cycles. Designed for seamless integration across the Cardinal product ecosystem, the new assemblies provide a high-performance connectivity solution for a broad spectrum of industries, encompassing next-gen AI clusters, 5G/6G infrastructure, satellite communications, mmWave radar and the emerging requirements of terahertz imaging.

Molex consolidates multiple RF connectors into a single, multi-port housing, reducing testing cycles and total cost of ownership (TCO). The high-performance RF connectors and compression-mounted, solderless Printed Circuit Board (PCB) attachment elevate testing flexibility while reducing installation and rework time. The integration of high-frequency contact technology into the multi-port assemblies provides engineers with a smooth upgrade path and trouble-free transition from 110 GHz testing to 145 GHz capabilities.

A hallmark of the Molex Cardinal assemblies is connector repeatability, which is crucial in test environments where connectors are mated and unmated frequently. Cardinal Multi-Port High-Frequency Coaxial Assemblies are rated for reliable performance over 500 cycles. Most important, however, is that Molex uses highly precise connectors for greater repeatability, assuring consistent, repeatable performance from the first to the 500th measurement. This high-density PCB connector minimizes board real estate, allowing smaller evaluation boards to further reduce costs.

These Multi-Port High-Frequency Coaxial Assemblies are available now, with the Cardinal 145 GHz assemblies joining the existing lineup of 67 GHz Precision Coaxial Assemblies and 110 GHz Precision Coaxial Assemblies. Cardinal assemblies also offer versatile connector options, including vertical, right-angle and edge-mount PCB terminations, along with scalable, multi-port configurations, including 1x4, 1x8 and 2x8 for high-density setups.

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@MolexConnectors @mepaxIntPR  #TandM

Connections for Industrial LED lights.

The X-Lok connectivity solutions from Amphenol LTW, which is ideally suited to industrial LED lighting (to name one of the many possible applications). They provide rapid, reliable assembly using push-lock technology, with an audible “click” that techicians will feel and hear to confirm positive mating. The X-Lok system also makes “blind mating” a safe and reliable operation.

X-Lok Series connectors, available through Inelco Hunter, are presented in various sizes for power, signal and hybrid applications for fast, simple and reliable connections, using a positive spring-loaded mechanism. The series ensures fewer mating failures and provides a quicker installation time than traditional threaded solutions. With UL1977 & 2238+50e certification, X-Lok is an ideal solution for both indoor and outdoor applications. The range of possible applications is vast and includes factory lighting, industrial automation, transport, aerospace and military.

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@InelcoHunter @amphenol #PAuto #Lighting

Accredited in-house value-added solutions for critical industries.

Specialist connector distributor Lane Electronics, a franchised distributor and stockist of electrical connectors and accessories, is reinforcing supply-chain resilience for customers across aerospace, medical, industrial, and other high-reliability sectors.

Against a backdrop of geopolitical instability, global conflict, tariffs, and the growing impact of environmental change, Lane Electronics delivers exceptional service and reliability by combining extensive stockholding, in-house assembly, and value-added engineering expertise. A key member of the privately owned Lodge Group, Lane Electronics provides customers with seamless access to one of the industry’s most comprehensive interconnection portfolios, while sister company and connector manufacturer Weald Electronics adds design, assembly, and manufacturing capabilities that ensure continuity of supply and technical excellence as one of Lane Electronics’ key supply partners.

“In today’s uncertain global landscape, component availability and agility are paramount,” said Nick Wheeler, Sales Director of Lane Electronics. “Our focus on supply-chain resilience, supported by strategic stock management and in-house assembly, allows us to respond rapidly to customer needs while maintaining exceptional quality and performance standards through our industry-leading suppliers.”

Lane Electronics offers an extensive stockholding of connectors, accessories, and component piece-parts, supported by automated and strategic replenishment systems. Stock can be ring-fenced to meet specific customer or project requirements, helping OEMs and system integrators mitigate the risks of extended lead times, rapidly escalating prices or obsolescence.

The company’s in-house assembly services further enhance availability, with more than 90% of standard product ranges available for next-day shipment through stock or rapid assembly. As a specialist assembling distributor for leading connector manufacturers, Lane Electronics delivers tailored interconnect solutions across industries including aerospace, defence, mining, test and measurement, medical equipment, entertainment systems, and general industrial applications.

Complementing these capabilities, the company’s partnership with Weald Electronics provides accredited UK-made optical and RF cable assemblies and other value-added solutions, ensuring customers benefit from certified, high-performance interconnect products built to meet exact specifications.

Other key service advantages include:

• No minimum order quantity or order value on stocked items
• Next-day delivery on most standard connectors and accessories
• Online access to stock, specifications, and ordering
• Rapid engineering support for custom or obsolete designs

“Our customers value having a trusted partner who can combine technical knowledge, stock security, and responsive service.” continues Wheeler “We understand that connector availability can make or break a project timeline — so our goal is to remove that uncertainty.”

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@FC_Lane @proactivefleet  #PAuto #Electrical

Connections in energy storage.

Energy storage systems (ESS) require interfaces which are compact and generate as little heat as possible, even when transmitting high currents. Harting has developed the Han® S series for this application area. The cable side consists of angled housings, with the input side freely rotating around 360 degrees when plugged in. This makes the cables which connect the ESS modules more flexible. Storage modules can also be combined into larger units.

Previously, 200 A was the maximum power rating. The power capacity of the new Han® S 450 Plus has been increased to 500 A to meet the demand for higher charging and discharging currents for battery storage. The enlarged contacts and housings are designed so that they do not overheat during operation. Harting has developed larger housings for contacts with three different conductor cross-sections:

• for 95 mm² (AWG 3/0 or 4/0) up to 350 A
• for 120 mm² (250 kcmil) up to 400 A
• and for 150 mm² (300 kcmil) up to 450 A

Robustness and ease of use are also benefits of the Han® interface: it is guaranteed to withstand up to 500 mating cycles, which no other comparable product can offer. The locking mechanism is intuitive.

The colours red for positive and black for negative, as well as additional colour options of blue and orange, make Han® S connections easily identifiable. In addition, the housings feature a double locking system and numerous coding options, including the use of five different mating profiles.

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@HARTING_Group @HARTING #PAuto #Power #ESS

Modular Wire-to-Wire Connectors.

Cut cost and complexity of automotive wiring harness and zonal architecture applications.

The MX-DaSH Modular Wire-to-Wire Connectors have been introduced by Molex. These, the newest additions to its award-winning MX-DaSH family of data-signal hybrid connectors unify power, signal and high-speed data connectivity in a single connector system. These Modular connectors utilise multiple, versatile cartridges incorporated into a single housing system to simplify wiring and harness architecture while improving automotive design flexibility, adaptability and scalability across multiple vehicle models and applications.

“MX-DaSH Modular Wire-to-Wire Connectors solve some of the biggest pain points in today’s automotive design processes, caused by constant and rapid change in electrical and electronic requirements,” said Scott Whicker, SVP, president, Transportation Innovative Solutions, Molex. “Our cartridge-based design makes it easy to mix-and-match functions and reconfigure wire harnesses or modules to help achieve faster development cycles and reduced costs.”

Purpose-built for zonal architectures.
Each MX-DaSH Modular Wire-to-Wire Connector is based on an unsealed, cartridge-based hybrid connectivity platform that consolidates multiple connectors and connection types into a single connector. By reducing the total number of unique parts, this new connectivity system offers unparalleled freedom to meet specific automotive design challenges and accelerate upgrades, as well as slash design and tooling time.

This “building block” approach optimises vehicle harnesses, which can result in significant weight, size and cost savings. Purpose-built for zonal architectures, MX-DaSH Modular connectors are ideally suited for high-content connection points, including instrument panel-to-body harness connections, seat power and signal connections, and electrical/electronic architecture components. Wiring and module engineers can also change cartridges within the housing, making it easier to add new features or swap out pins and cartridges to meet architecture needs.

Global reach and adoption by OEMs.
Localised manufacturing and compatibility with industry-standard terminals is driving adoption of MX-DaSH Modular connectors worldwide while decreasing global supply chain challenges.

The MX-DaSH Modular connector’s adherence to USCAR2 performance specifications for automotive electrical connector systems is also key, along with USCAR49 performance specifications for miniature automotive coaxial connectors.

As the largest automotive market and hotbed for innovation in electrified vehicles (EVs) and Advanced Driver-Assistance Systems (ADAS), China is a major proving ground for next-generation automotive technologies, including Molex connectivity solutions. A regional version of the MX-DaSH Modular connector will be included in MY26 cars in China to address the unique cost, packaging and expedited time-to-market requirements of Chinese automotive OEMs.

In addition, the new modular, cartridge-based connectors are being deployed by other automotive manufacturers in North America and Europe with new designs for MY28 vehicles expected to include MX-DaSH Modular Wire-to-Wire and Wire-to-Board Connectors.

Automation friendly, reliability focused.
The MX-DaSH Modular connector’s automation-friendly design lends itself to precise automated assembly operations, improving manufacturing efficiency and quality while lowering labor costs. Moreover, inclusion of positive-locking features, blade stabilisation and vibration resistance help boost overall reliability by protecting against inadvertent disconnection in demanding automotive environments. Robust engineering support, extensive quality control and a full range of versatile and customisable solutions reinforce the role Molex plays as a unique resource for improving vehicle wiring performance and reliability.

Molex MX-DaSH Modular Wire-to-Wire Connectors are available now, offering unprecedented design freedom and flexibility to accommodate the rapid rise in data, power and high-speed signal requirements in today’s vehicles. Maximum pin count for the connectors is 70 circuits, with maximum circuit count per cartridge as follows: 26 circuits for 0.50mm (CTX50) cartridges, 14 circuits for 1.20mm cartridges, 4 circuits for 2.80mm cartridges, and 3 circuits for 4.80 and 6.30mm cartridges.

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@MolexConnectors @mepaxIntPR #Automotive #China

Sockets ease PCB-relay assembly and replacement.

The P6K surface-mount sockets just introduced by OMRON Electronic Components Europe, are specially designed for G6K through-hole PCB relays. The sockets facilitate relay insertion during board assembly and removal for servicing or repair.

This series, with a choice of coil voltage ratings from 3V to 24V DC, are used in industrial machinery, inspection systems, test instruments, office equipment, telecom boards, and security equipment. The compact, 6.5mm × 10mm × 5mm-high, relays offer a selection of packages including the through-hole version with straight pins, as well as two surface-mount options with inside- or outside-facing terminals.

They are used with the through-hole G6K package style and allow easy insertion of the relays, without soldering, during board manufacture. The sockets can be placed on the board and reflowed at the same time as other components using standard surface-mount equipment. The terminals can be soldered to ordinary solder pads, saving PCB complexity and cost by eliminating plated-through holes, as well as streamlining board assembly by saving pin-in-paste, wave soldering, or hand soldering off-line.

If a relay must be replaced while the board is in service, the P6K socket permits rapid removal without desoldering thereby easing repair and quickly restoring operation. Relays can be replaced remotely in the field if necessary, as minimal tooling is required.

The socket design ensures low contact resistance with relay pins when inserted, confirmed as 30mΩ in standard tests. Durability is also ensured, with no resistance increase recorded after 50 insertion/removal cycles. The sockets can handle up to 1A maximum current per contact, with insulation resistance of 1,000MΩ (min. at 500V DC), and operate in ambient temperature from -40°C to 85°C.

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@OmronEurope @OmronComponents @napierPR  #PAuto #Manufacturing

Rugged interconnectors.

Production quantity of Samtec's new line of rugged, multi-port SMPM solutions that feature threaded coupling for high thermal shock and vibration environments commonly found in  aerospace and communication applications is now available. Their rugged, threaded-SMPM solutions provide high-frequency performance up to 65 GHz with excellent reliability in high-density applications.

SMPM multi-port mated sets with the new -S Screw option for threaded coupling are part of Samtec’s Magnum RF® product line. Cable assemblies are available with .047” diameter low-loss flexible cable (GC47 Series) or with .086” diameter low-loss flexible cable (GC86 Series). While both cable diameters are small and lend themselves to smaller bundle sizes for weight savings and increased airflow for cooling, there are different advantages for each. GC47 with .047” diameter cable offers greater flexibility with a 0.125” (3.18 mm) minimum bend radius and a higher maximum operating frequency.

GC86 with .086” diameter cable, while still high-performance, operates at a slightly lower frequency but with improved, lower insertion loss. Mating board connectors are available with a stub launch surface mount board termination (GPPC-ST-SL) or edge mount board termination (GPPC-EM). Optional in-line channel counts are 2, 4, 6, 8 and 10 on a high-density .140” (3.56 mm) pitch. Combining multiple channels into a single housing provides 40-percent greater density, less processing time and better positional alignment.

Rugged, threaded SMPM Magnum RF interconnects are in stock directly from Samtec. As part of the Sudden Service® culture, Samtec makes designing-in a product easy by offering free 3D model downloads and product samples while also ensuring prints, product specifications and test reports are readily available.

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@SamtecInc @TechWireIntl #Electronics #TandM  #Aerospace

Clamping spindle with automatic changeover.

Self-locking clamping spindle with high clamping forces.

Workpieces measuring up to approximately 50cm are typically clamped manually and mechanically using three- or four-jaw chucks, or automatically through pneumatic or hydraulic means. However, when dealing with larger workpieces, planar disks come into play. These disks securely hold much larger parts in place using jaw boxes and tensioning spindles. Users can select from 7 standard thread sizes ranging from TR 50 to TR 200, allowing clamping forces of up to 500 kN to be achieved thanks to the proven wedge clamping system, ensuring self-locking in each clamping position and a high level of stiffness. Equipped with an internal switchover for external and internal clamping, the MSP/MSPD power clamping spindles from JAKOB Antriebstechnik offer impressive clamping forces, a wide clamping range, and straightforward operation and assembly, ensuring maximum operational safety.

To ensure this safety over the long term, JAKOB recommends regular spindle inspections, typically once or twice a year depending on the frequency of clamping cycles. JAKOB's force measuring systems, such as the hydraulic, standalone force transducer HMD, offer simplicity in this regard. The intelligent clamping claw FMS even enables constant clamping force control during workpiece machining, with data transmission wirelessly to handheld display devices or PCs. If clamping forces deviate from the stated nominal values by approximately 25% to 30%, an overhaul is advised, which can be conducted directly by JAKOB. Additionally, JAKOB provides training courses to certify participants as operating or maintenance personnel, facilitating future installation and maintenance within the company's own operations.

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@PresseBox #jakobantriebstechnik #PAut0