Connectors to FPGA and SoC FPAG standard.

A new product portfolio designed for the SGeT oHFM.c standard has been announced by Samtec. These connectors are based on the company's proven AcceleRate® HD and AcceleRate® HP high-density, high-performance product families.

oHFM™, or Open Harmonized FPGA Module, is the world’s first open modular FPGA standard. It addresses the common challenges of unique pinouts, custom form factors, and proprietary thermal concepts of FPGA and SOM development by providing a unified, scalable architecture. Ready-to-use building blocks and clear design rules reduce engineering time for faster time-to-market.

Connector-based SOMs defined by the oHFM.c standard are optimized for compact high-speed interfaces, mid- to high-end FPGAs, and in-field upgrades using 5 mm or 10 mm stack height Samtec connectors. Samtec’s oHFM.c connectors feature high-density channels on a 0.635 mm pitch with performance targets of 64 Gbps PAM4 or 112 Gbps PAM4. Inside each connector, the narrow edges of the Edge Rate® contact system are aligned with the connector body to reduce broadside coupling and crosstalk, optimizing signal integrity. The Edge Rate contact system also features a smooth, broad milled mating surface which reduces wear and increases durability for high-cycle applications. Samtec’s IPC Class 3-compliant solder column board termination technique is used to secure connectors to the printed circuit board. Solder column termination provides superior solder joint reliability and excellent insertion loss and return loss performance.

Designed to meet the evolving demands of FPGA-based compute platforms, Samtec’s interconnect solutions enable scalable, flexible, and reliable system architectures for next-generation embedded and edge applications.

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