Powered by their Hydra3D™+ CMOS image sensor, Perciva ToF combines 832 x 600 pixel resolution with patented HiRho technology, which increases FFxQE at near-infrared wavelengths while maintaining excellent MTF and modulation contrast. Its 10 µm three-tap pixel architecture captures more light, enabling longer operating distances, reliable detection of low-reflectivity materials, and motion-artifact-free imaging of fast-moving objects. This enables accurate, dependable 3D measurements, even in high-speed industrial applications.
Perciva ToF has been engineered to deliver robust performance in challenging conditions, including varying outdoor illumination and interference caused by other systems, without requiring interconnecting cameras. Factory calibration and embedded processing simplify system integration by providing depth maps and point cloud data directly through the camera’s GigE interface.
The camera's industrial design and embedded intelligence enable developers and system integrators to deploy 3D vision capabilities more quickly in applications requiring reliable depth measurement and real-time performance.
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