Showing posts with label Teledyne e2v. Show all posts
Showing posts with label Teledyne e2v. Show all posts

Wednesday, 23 September 2026

Shutter sensors for machine vision.

Nexora™ is a new family of CMOS image sensors from Teledyne e2v, that delivers high sensitivity, high-speed imaging and low power consumption for demanding machine vision applications.

Rafael Romay, President of Teledyne Vision Solutions, said: “With Nexora, we focused on giving camera manufacturers a new platform that balances image quality, speed and integration simplicity. The result is a sensor family that can support a wide range of current and emerging machine vision applications.”

Available in 12 MP (4,096 by 3,072) and 16 MP (4,096 by 4,096) resolutions, in both monochrome and color versions, Nexora is designed for applications that require sharp images at very high speeds. These include high-resolution machine vision, intelligent traffic systems, and outdoor surveillance.

At the heart of Nexora is Teledyne e2v’s proprietary backside-illuminated (BSI) pixel technology. By positioning the photodiode closer to the incoming light and maximizing the light-sensitive area of each pixel, the sensor achieves higher light-collection efficiency than conventional front-side illuminated (FSI) architectures. This results in quantum efficiency (QE) of up to 73% at 550 nm and 15% at 940 nm, improving performance in challenging lighting conditions and near-infrared applications.

The Nexora family also features Teledyne e2v’s 3D-stacked sensor architecture, which integrates multiple functions within a compact, multilayer structure. This approach increases design flexibility while helping camera manufacturers develop smaller, higher-performance imaging systems.

It incorporates a versatile LVDS interface that is compatible with a wide range of FPGAs and image signal processors. It is housed in a compact 23 by 21.5 mm package that is compatible with 29 by 29 mm² cameras and standard C-mount optics.


 @e2vteledyne #PAuto  #machine_Vision

Tuesday, 15 September 2026

Industrial-grade 3D vision with on-camera processing.

Teledyne e2v has announced Perciva™ ToF, its new industrial grade 3D Time-of-Flight (ToF) camera. Designed for reliable operation in demanding environments, Perciva ToF combines high-performance depth sensing, on-camera processing, and flexible integration for a wide range of applications, including logistics, robotics, inspection, and surveillance.


Powered by their Hydra3D™+ CMOS image sensor, Perciva ToF combines 832 x 600 pixel resolution with patented HiRho technology, which increases FFxQE at near-infrared wavelengths while maintaining excellent MTF and modulation contrast. Its 10 µm three-tap pixel architecture captures more light, enabling longer operating distances, reliable detection of low-reflectivity materials, and motion-artifact-free imaging of fast-moving objects. This enables accurate, dependable 3D measurements, even in high-speed industrial applications.

Perciva ToF has been engineered to deliver robust performance in challenging conditions, including varying outdoor illumination and interference caused by other systems, without requiring interconnecting cameras. Factory calibration and embedded processing simplify system integration by providing depth maps and point cloud data directly through the camera’s GigE interface.

The camera's industrial design and embedded intelligence enable developers and system integrators to deploy 3D vision capabilities more quickly in applications requiring reliable depth measurement and real-time performance.


@e2vteledyne #PAuto #Security #3D_Vision

Thursday, 5 March 2026

5D vision camera.

The Perciva™ 5D camera, a breakthrough imaging innovation designed to make high‑quality short‑range 3D vision cost-effective, reliable, and easy to integrate has been launched by Teledyne e2v.

Most industrial cameras only capture 2D images, yet many applications increasingly require depth perception at close and very‑close distances. Perciva 5D delivers this capability through a unique Angular Sensitive Pixel technology and advanced on‑board processing, enabling real-time 2D and 3D image fusion at the calibrated working distance range. Perciva 5D also features a powerful Neural Processing Unit (NPU), enabling Artificial Intelligence models to run on-device and be customized to each customer’s specific requirements.

Perciva 5D generates 2D and 3D data from a single CMOS sensor, free from optical occlusion, producing time-aligned 2D frames alongside pixel‑aligned 3D depth maps. With comprehensive 3D processing built directly into the camera, users benefit from immediate depth maps or point‑cloud outputs. Perciva 5D operates using ambient light, indoors or outdoors, eliminating the need for an external NIR source while maintaining reliable performance and minimizing overall system costs. Designed for challenging environments, it offers plug‑and‑play integration through its GenICam‑compliant, GigE Vision interface and robust IP6x‑rated housing with industrial M12 connectors.

Factory calibrated and weighing just 230 grams, Perciva 5D operates at less than 5 W, and is ideal for robotics (arms, cobots and humanoids), retail self-checkout solutions, and 3D industrial process monitoring. It supports user-adjustable frame rates or triggered acquisition and multiple power options. Using GenDC / GenTL the camera integrates seamlessly with Teledyne’s Spinnaker® 4 API and SpinView® for 2D / 3D visualisation, as well as leading machine‑vision software platforms.


@e2vteledyne #PAuto

Tuesday, 24 September 2024

2-megapixel vision and 3D depth data.

The new Optimom™ 5D turnkey imaging module has been announced by Teledyne e2v. The new imaging module features the recently developed Topaz5D™ image sensor, a compact board, standard connector, and a pre-assembled lens. This comprehensive board-level vision extension seamlessly integrates full-HD 2D vision with the generation of 3D depth data. It excels in challenging light conditions enabling the delivery of 3D objects or human visualisation based on the detected contrast.

Teledyne e2v’s Optimom 5D imaging module features an innovative 2 Megapixel resolution, 2.5 µm global shutter pixel image sensor with unique angular sensitive pixels. It is the first commercially available module to affordably offer this new type of 3D vision technology. With a compact 25 x 25 mm footprint and low power consumption, it includes a fast lens (45° horizontal field of view) and operates from 40 cm to 140 cm. Depth data processing generates detailed 3D depth maps and can see through sheets of glass or transparent organic material (e.g. plexiglass or plastic bottles). Real-time 3D depth map processing can be performed using dedicated Software Development Kits run on a host processor.

Optimom 5D excels in diverse operating and lighting conditions serving applications such as smart factories and industrial robotics (including AMR’s), logistics and warehouse automation, 3D facial modeling for anti-spoofing, and many other applications. Unlike stereoscopy, it avoids optical occlusion at short distances. Optimom 5D also comes fully calibrated for its operating range, ensuring easy setup for the end-user.

Laurent Appercel, Senior Marketing Manager at Teledyne e2v said, “Optimom 5D marks a significant advancement in the adoption of angular sensitive pixel technology. As a turnkey 3D vision solution, it features a standard MIPI-CSI2 interface and requires no additional calibration. In real-time, this module provides sharp 2D full-HD images (in mono or color) alongside contrast-based 3D depth maps, all at 30 frames per second with minimal latency.”


@e2vteledyne #PAuto #Manufacturing

Tuesday, 26 March 2024

2D vision with the generation of 3D depth.

The Topaz5D™, a full-HD CMOS image sensor designed to combine 2D vision with the generation of 3D depth maps has been announced by Teledyne e2v. A single Topaz5D sensor used in challenging lighting conditions delivers 3D object visualisation based on the contrast detected, ideal for various logistics applications, AR/VR headsets, access control devices, household vacuum robots, and Autonomous Mobile Robots (AMR).

Topaz5D combines a small 2.5 µm global shutter pixel with a post-processing diffraction layer to create angular sensitive pixels. This enables 3D angular signal raw data to be generated and then processed by a 5D compatible SDK. Topaz5D is a 3D-enabled variant of Teledyne e2v’s popular Topaz 2M, which is widely used in logistics/retail markets and smart factories.

Topaz5D has a 2 megapixel (1,920 x 1,080) resolution and is currently available in both monochrome and color. Its tiny form factor (7.65 mm x 4.45 mm) makes it easy to integrate into space-constrained optical engines or modules and it consumes only 200 mW of power to run at full frame rate. It generates 3D depth maps and displays the contrast details of any kind of object, even black or very shiny ones, or those seen through sheets of glass or transparent organic material (e.g., plexiglass or plastic bottles).

Unlike other 3D technologies, which rely on illumination of the scene, Topaz5D can be used in very diverse operating conditions, including indoor lighting or direct sunlight. Compared to a stereoscopy solution, only a single sensor plus a lens is required, without the need for complex dual-lens system alignment and there is no risk of optical occlusion. In addition, Topaz5D delivers an unmatched cost of ownership compared to other competitive 3D vision technologies.

Laurent Appercel, Senior Marketing Manager at Teledyne e2v, said, “Topaz5D has the unique ability to deliver crisp 2D images in full-HD, along with detailed contrast-based 3D depth maps in real time, at high frame rates, and without latency. 5D processing SDK integration on several SoC vendor platforms is also readily available. All these unmatched benefits come from a single sensor which can be deployed with lower costs, minimal power consumption, no illumination and with simplified hardware and software.”


@e2vteledyne #PAuto #Manufacturing

Tuesday, 12 March 2024

Image sensors.

The Flash™ CMOS image sensor family from Teledyne e2v, has been expanded with the introduction of Flash 2K LSA, which has been specifically adapted for laser profiling applications requiring the use of a Large Scheimpflug Angle (LSA).

Teledyne e2v’s Flash family of CMOS image sensors are specifically tailored for 3D laser profiling/displacement applications and high speed/high resolution inspection. Flash 2K LSA is a derivative of the popular Flash 2K sensor for applications requiring large Scheimpflug angles, with an angular response that has been multiplied more than four times for 30° angles and more than seven times for 40° angles. In addition to improving image quality, this sensor enables the power of the laser line at system level to be optimized when large Scheimpflug angles are used.

Flash 2K LSA shares the same 6 µm CMOS global shutter pixel as the other members of the Flash family, which effectively combines high resolution and fast frame rates. It also has the same application-based features such as HDR modes up to 100 dB, multiple Regions of Interest and frame-to-frame on-the-fly changes.

Yoann Lochardet, Marketing Manager for 3D at Teledyne e2v said, “We are very pleased to announce this new version of Flash 2K, designed to enable easy and cost-effective integration, so that our customers can have a camera portfolio for all Scheimpflug angles, using the same CMOS sensor for all versions. This minimizes camera redesigns and simplifies the supply chain.”

Flash is also available in 2K (2K x 1K, 1,500 fps full frame) and 4K (4K x 1K, 1,800 fps full frame), with or without standard micro-lenses, and combined with or without a glass lid.


@e2vteledyne #PAuto #Manufacturing