Cameras for challenging lighting conditions.

Design-to-cost single-board cameras for integration in machines, devices and embedded systems with a wide range of sensors and lenses

Whether in quality assurance, medical technology or automation - industrial image processing places high demands on precision and reliability, even under difficult conditions. IDS Imaging Development Systems  is therefore expanding its portfolio of cost-optimised project cameras from the GigE uEye LE series with state-of-the-art Sony Starvis 2 sensors from the end of June 2025. These deliver impressive image quality even in low ambient light.

The new single-board cameras are GigE Vision-compliant, space-saving and designed for high-volume applications. Thanks to their attractive price-performance ratio, they are suitable for cost-critical industrial projects. With the IMX675 (5 MP), IMX676 (12.5 MP) and IMX678 (8 MP) sensor variants, IDS will soon be able to offer further high-performance options for a wide range of requirements. The 12.5 megapixel version with its square 1/1.6" sensor is ideal for use in microscopy applications, for example.

The Sony Starvis 2 sensors utilise the latest CMOS technology, which impresses with excellent light sensitivity, low noise and an extended dynamic range. They were developed for applications where the highest image quality is required and guarantee detailed pictures even in difficult lighting conditions.

The introduction of the new models strengthens IDS's position as a supplier of versatile, powerful and economical image processing components - "Made in Germany". Like all members of the GigE uEye LE family, they follow the design-to-cost principle and are aimed specifically at users who want to efficiently integrate camera technology into machines, devices or embedded systems.

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@IDS_Imaging @mepaxIntPR #Pauto Manufacturing #Vision

3D sereo vision camera.

Combines short working distance, large field of view and high depth of field.

A new 3D camera in the Ensenso product line has been introduced by IDS Imaging Development Systems. With its compact, industrial-grade design and the combination of a very short working distance and a large field of view, the Ensenso B is particularly suitable for bin picking applications. Thanks to its high depth of field, it is able to capture objects over a large area and to localize all parts in a container at once, for example. This optimizes the pick-and-place process and facilitates emptying of containers. The stereo vision camera is now available in series production.

The great strength of Ensenso B lies in the very precise detection of objects at close range. It provides a wide field of view and an impressively high depth of field. More specifically, this means that the area in which an object is sharply imaged is unusually large. At a distance of 30 centimetres between the camera and the object, the Z-accuracy is approx. 0.1 millimetres. The maximum working distance is 2 meters.

The housing, which accommodates two 5 MP colour cameras from IDS, a pattern projector and all the electronics, is completely enclosed. This simplifies the cabling. Ensenso B complies with protection class IP65/67, which is an advantage in demanding operating conditions. With dimensions of just 120 x 56 x 104 millimetres, the new 3D camera's design is also very space-saving. This makes it ideal for use on a robot arm, for example (pic right).

The Ensenso B will play an important role in the next video session on the company's own Vision Channel, which addresses the topic of "Full-featured 360° 3D point clouds using a multi-camera setup" on 24 September 2024.

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@IDS_Imaging @mepaxIntPR #Pauto #Vision

2D vision with the generation of 3D depth.

The Topaz5D™, a full-HD CMOS image sensor designed to combine 2D vision with the generation of 3D depth maps has been announced by Teledyne e2v. A single Topaz5D sensor used in challenging lighting conditions delivers 3D object visualisation based on the contrast detected, ideal for various logistics applications, AR/VR headsets, access control devices, household vacuum robots, and Autonomous Mobile Robots (AMR).

Topaz5D combines a small 2.5 µm global shutter pixel with a post-processing diffraction layer to create angular sensitive pixels. This enables 3D angular signal raw data to be generated and then processed by a 5D compatible SDK. Topaz5D is a 3D-enabled variant of Teledyne e2v’s popular Topaz 2M, which is widely used in logistics/retail markets and smart factories.

Topaz5D has a 2 megapixel (1,920 x 1,080) resolution and is currently available in both monochrome and color. Its tiny form factor (7.65 mm x 4.45 mm) makes it easy to integrate into space-constrained optical engines or modules and it consumes only 200 mW of power to run at full frame rate. It generates 3D depth maps and displays the contrast details of any kind of object, even black or very shiny ones, or those seen through sheets of glass or transparent organic material (e.g., plexiglass or plastic bottles).

Unlike other 3D technologies, which rely on illumination of the scene, Topaz5D can be used in very diverse operating conditions, including indoor lighting or direct sunlight. Compared to a stereoscopy solution, only a single sensor plus a lens is required, without the need for complex dual-lens system alignment and there is no risk of optical occlusion. In addition, Topaz5D delivers an unmatched cost of ownership compared to other competitive 3D vision technologies.

Laurent Appercel, Senior Marketing Manager at Teledyne e2v, said, “Topaz5D has the unique ability to deliver crisp 2D images in full-HD, along with detailed contrast-based 3D depth maps in real time, at high frame rates, and without latency. 5D processing SDK integration on several SoC vendor platforms is also readily available. All these unmatched benefits come from a single sensor which can be deployed with lower costs, minimal power consumption, no illumination and with simplified hardware and software.”

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@e2vteledyne #PAuto #Manufacturing

Image sensors.

The Flash™ CMOS image sensor family from Teledyne e2v, has been expanded with the introduction of Flash 2K LSA, which has been specifically adapted for laser profiling applications requiring the use of a Large Scheimpflug Angle (LSA).

Teledyne e2v’s Flash family of CMOS image sensors are specifically tailored for 3D laser profiling/displacement applications and high speed/high resolution inspection. Flash 2K LSA is a derivative of the popular Flash 2K sensor for applications requiring large Scheimpflug angles, with an angular response that has been multiplied more than four times for 30° angles and more than seven times for 40° angles. In addition to improving image quality, this sensor enables the power of the laser line at system level to be optimized when large Scheimpflug angles are used.

Flash 2K LSA shares the same 6 µm CMOS global shutter pixel as the other members of the Flash family, which effectively combines high resolution and fast frame rates. It also has the same application-based features such as HDR modes up to 100 dB, multiple Regions of Interest and frame-to-frame on-the-fly changes.

Yoann Lochardet, Marketing Manager for 3D at Teledyne e2v said, “We are very pleased to announce this new version of Flash 2K, designed to enable easy and cost-effective integration, so that our customers can have a camera portfolio for all Scheimpflug angles, using the same CMOS sensor for all versions. This minimizes camera redesigns and simplifies the supply chain.”

Flash is also available in 2K (2K x 1K, 1,500 fps full frame) and 4K (4K x 1K, 1,800 fps full frame), with or without standard micro-lenses, and combined with or without a glass lid.

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@e2vteledyne #PAuto #Manufacturing

Emerging Image Sensor Technologies 2024-2034.

Dr Miguel El Guendy, Technology Analyst at IDTechEx, discusses technological innovations in next-generation image sensors.

The new IDTechEx report, "Emerging Image Sensor Technologies 2024-2034: Applications and Markets", explores a diverse range of image sensing technologies capable of resolutions and wavelength detection far beyond what is currently attainable. IDTechEx expects that the growing importance of autonomous technologies will lead the emerging image sensor market to over US$739 million (€693m) by 2034.

Emerging image sensor technologies covered in IDTechEx's "Emerging Image Sensor Technologies 2024-2034: Applications and Markets”.

There are several unique selling points to adopting these types of image sensors, one of which is the broadening of the spectral coverage over the commonly used CMOS RGB sensors.

CMOS detectors are highly effective and reliable for visible light image capture and are widely used in robotics, industrial inspections, and consumer electronics applications. Their cost-effectiveness and ease of implementation into a variety of applications ensure successful adoption in the market. Nevertheless, with a growing need to visualize a wider range of frequencies in the electromagnetic spectrum comes a new market opportunity with immense potential.

One of the areas of interest is capturing images in the short-wave infrared (SWIR) region (1000-2000nm). The autonomous vehicle industry, for instance, is particularly invested in technologies operating in this region, as visible light image capture is less effective in foggy/misty/dusty/dark conditions. Similarly, industrial inspections could benefit from SWIR imaging as this region has different absorption ratios that can help distinguish materials that look the same in the visible spectrum.

The main challenge, however, is lowering the costs associated with the existing technologies in this space. The dominant technology in this sector is based on indium gallium arsenide (InGaAs), and while these devices perform well and have high sensitivity in these frequency ranges, they are also costly, with average pricing approximating US$20,000 (€18.8k). As a result, they are used on very specialized applications and remain inaccessible for autonomous driving and consumer electronics, for instance.

Dr Miguel El Guendy - IDTEx

The potential demand for more affordable SWIR image sensors has triggered the emergence of novel technologies that are determined to fill this customer need. These include hybrid image sensors, where organic semiconductors or quantum dots are placed above a CMOS readout integrated circuit (ROIC), and extended silicon, where the physical properties of silicon are altered, enabling its absorption range beyond its bandgap capabilities. Despite promises of performance enhancement, these technologies require further maturity to compete with InGaAs.

Nevertheless, there is more innovation happening in the image-sensing space. Companies are not solely looking at expanding the spectral range; there is also ongoing work in imaging over a larger area whilst increasing temporal resolution and dynamic range. An example of this is event-based vision, where each pixel in the sensor detects changes in intensity and sets a timestamp reporting this change. Rather than using a frame-based approach that would require extensive computational processing, this method increases the temporal resolution for a fraction of the computation.

The growth of the Internet of Things (IoT) and smart consumer electronics is driving another phenomenon in the image sensor sector, which is the miniaturization of these sensors to conform within the smallest form factor devices. Miniaturized spectrometers, for instance, target these applications and aim to deliver sufficiently small and low-cost solutions to the market.

There is one main trend that remains consistent irrespective of the frequency sensitivity ranges, and this is cost. While CMOS sensors are already relatively mature and affordable, there is ample opportunity to deliver similar products for other frequencies in the electromagnetic spectrum. The challenge consists in lowering the cost of manufacturing and the form factor whilst replicating or even surpassing the performance of CMOS in the visible light region for other frequency ranges in the electromagnetic spectrum. IoT devices are getting increasingly smaller, and thus, sensors fitted into these devices should conform to their shape and draw minimal power, which is also an added difficulty, considering many high-resolution image sensors have high computational requirements associated with them.

The world of image sensors has enormous potential and could impact multiple industries, from autonomous vehicles to industrial inspections and agriculture. The fulfillment of its potential is dependent, however, on its cost and performance, and while there are currently many technological players in the running for dominance in the sector, the technology that delivers on these points most suitably will earn a significant share of this large market, that in the future will supply to autonomous vehicle manufacturers and IoT providers in the consumer electronics space.

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@IDTechEx #PAuto #IoT

Potential of thin-film sensors in infrared imaging.

Thin-film pinned photodiode integrated into superior short-wave-infrared imaging sensors.

The successful integration of a pinned photodiode structure in thin-film image sensors has been presented by Imec^*. With the addition of a pinned-photogate and a transfer gate, the superior absorption qualities of thin-film imagers -beyond one µm wavelength- can finally be exploited, unlocking the potential of sensing light beyond the visible in a cost-efficient way. Detecting wavelengths beyond visible light, for instance infrared light, offers clear advantages. Applications include cameras in autonomous vehicles to ‘see’ through smoke or fog and cameras to unlock your smartphone via face recognition. Whilst visible light can be detected via silicon-based imagers, other semiconductors are necessary for longer wavelengths, such as short-wave infrared (SWIR).

Pawel Malinowski, imec Program Manager ‘Pixel Innovations’ adds: “At imec, we are at the forefront of bridging the worlds of infrared and imagers, thanks to our combined expertise in thin-film photodiodes, IGZO, image sensors and thin-film transistors. By achieving this milestone, we surpassed current pixel architectural limitations and demonstrated a way to combine the best performing quantum-dot SWIR pixel with affordable manufacturing. Future steps include optimization of this technology in diverse types of thin-film photodiodes, as well as broadening its application in sensors beyond silicon imaging. We are looking forward to further these innovations in collaborations with industry partners.”

Use of III-V materials can overcome this detection limitation. However, manufacturing these absorbers is expensive, limiting their use. In contrast, sensors using thin-film absorbers (such as quantum dots) have recently emerged as a promising alternative. They have superior absorption characteristics and potential for integration with conventional (CMOS) readout circuits. Nonetheless, such infrared sensors have an inferior noise performance, which leads to poorer image quality.

Already in the 1980’s, the pinned photodiode (PPD) structure was introduced for silicon-CMOS image sensors. This structure introduces an additional transistor gate and a special photodetector structure, by which the charges can be completely drained before integration begins (allowing reset operation without kTC noise nor the effect of the previous frame). Consequently, because of lower noise and improved power performance, PPDs dominate the consumer market for silicon-based image sensors. Beyond silicon imaging, incorporating this structure was not possible up until now because of the difficulty of hybridizing two different semiconductor systems.

Now, imec demonstrates successful incorporation of a PPD structure in the readout circuit of thin-film-based image sensors; the first of its kind. A SWIR quantum-dot photodetector was monolithically hybridized with an indium-gallium-zinc oxide (IGZO)-based thin-film transistor into a PPD pixel. This array was subsequently processed on a CMOS readout circuit to form a superior thin-film SWIR image sensor. “The prototype 4T image sensor showed a remarkable low read-out noise of 6.1e-, compared to >100e- for the conventional 3T sensor, demonstrating its superior noise performance” stated Nikolas Papadopoulos, project leader ‘Thin-Film Pinned Photodiode’ at imec. As a result, infrared images can be captured with less noise, distortion or interference, and more accuracy and detail.

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*The findings are published in the August 2023 edition of NatureElectronics ‘Pinned photodiode for monolithic thin-film image sensors’. Initial results were presented at the 2023 edition of the International Image Sensors Workshop.

@imec_int @NatureElectron #ThinFilm #InfraRed

Making laboratory miniaturized spectral sensing affordable.

Unsatisfied with smartphone camera color reproduction? Would it be useful for a user to detect different materials or even assess the freshness of food using a phone or other household appliance? The emerging technology of miniaturized spectrometers and multispectral cameras holds the solution. By detecting spectral information rather than just simple RGB color coordinates, these affordable devices can reveal previously available information via specialist equipment.

Acquiring spectral information with affordable sensors is part of a growing trend to detect optical information beyond what the eye can detect. As machine vision capabilities improve, algorithms demand more comprehensive input data than conventional RGB sensors can provide.

IDTechEx’s report, “Emerging Image Sensor Technologies 2023-2033: Applications and Markets”, covers a wide range of these emerging image sensor types, including shortwave infrared (SWIR) sensors based on organic semiconductors, quantum dots or germanium, event-based vision, hyperspectral imaging, quantum imaging and more.

Application Opportunities.
The desire to add more functionality in pursuit of differentiation means that spectral image sensors are in demand for smartphones. In 2021, German research center Fraunhofer ENAS announced its objective to produce infrared spectrometers for smartphone integration that weigh 1 gram and cost just US$1. This is a substantial improvement on the classic infrared spectrometers that weigh several kilograms and cost thousands of dollars. Fraunhofer’s low-cost spectrometer will be able to detect fake medicine and drugs, test air quality, and analyze food decomposition.

A notable player commercializing affordable spectral sensing is Spectricity, an early-stage Belgian company. Earlier this year, it announced its first product – a miniaturized multispectral image sensor that can detect 16 color channels within the visible region. The greater spectral resolution compared to conventional sensors enables more accurate color reproduction, with smartphones the target market given that camera quality is determining factor for many consumer purchase decisions.

Another consumer application that can benefit from spectral sensing is wearable health monitoring. While smartwatches can already track heart rate, oxygen levels, sleep patterns and respiration rates using LED light sensors, but more sophisticated sensors would provide greater functionality. Spectrally resolving wavelengths beyond 1000 nm, for example, by using one of the emerging SWIR (short wave infrared) detection technologies such as quantum dots, enables the detection of biomarkers undetectable by visible and NIR light. Wearable devices could then monitor glucose, lactate, hydration, and alcohol levels, broadening their appeal and providing a source of differentiation amongst the current field of smartwatches with increasingly similar capabilities.

Along with consumer electronics, miniaturized spectrometers and multispectral cameras are expected to gain traction for industrial inspection and robotics since lightweight permits integration into existing equipment. The most promising tasks are object recognition and distinguishing between different materials. Spectral resolution is especially valuable when aiming to distinguish visually similar materials such as different plastics or oil/water.

Outlook.
Due to their compact nature and affordability, miniaturized spectrometers and multispectral sensors promise to bring new capabilities to handheld devices, portable electronics, and industrial imaging inspection equipment. Capabilities that were once the preserve of the laboratory can now be applied to smartwatches, smartphones, and even robotic vacuums.

Miniaturized spectral sensing market in 2033 – by application and detection range

IDTechEx’s report “Emerging Image Sensor Technologies 2023-2033: Applications and Markets” explores a diverse range of image sensing technologies capable of resolutions and wavelength detection far beyond what is currently attainable. Many of these emerging technologies are expected to make waves within numerous sectors, including robotics, industrial imaging, healthcare, biometrics, autonomous driving, agriculture, chemical sensing, and food inspection. IDTechEx expects that the growing importance of autonomous technologies will lead the emerging image sensor market to over US$500 million (€471m) by 2033.

@IDTechEx @AgilityPRS #PAuto #Laboratory #Food

Emerging image sensors.

The new IDTechEx report, “Emerging Image Sensor Technologies 2023-2033: Applications and Markets”, explores a diverse range of image sensing technologies capable of resolutions and wavelength detection far beyond what is currently attainable. Many of these emerging technologies are expected to make waves within numerous sectors, including healthcare, biometrics, autonomous driving, agriculture, chemical sensing, and food inspection, among several others. IDTechEx expects that the growing importance of autonomous technologies will lead the emerging image sensor market to over US$500 million (€552m) by 2033.

Broadening Spectral Range.
Conventional CMOS detectors for visible light are prevalent within robotics, industrial image inspection, and consumer electronics; however, there is extensive opportunity for more complex image sensors that offer capabilities beyond that of simply acquiring red, green and blue (RGB) intensity values. Extensive effort is currently being devoted to developing emerging image sensor technologies that can detect aspects of light beyond the visible range into the short-wave infrared (SWIR, 1000nm – 2000 nm) range. Extending wavelength detection into the SWIR range presents many benefits as it enables the differentiation of objects and materials that appear visually similar or identical within the visible range. This substantially improves recognition accuracy and paves the way for better and more functional image sensing.

Key Questions Answered in the IDTechEx Report “Emerging Image Sensor Technologies 2023-2033: Applications and Markets” Include: What technology readiness level are these emerging image sensing technologies at? What disruptive technologies are on the horizon? Which companies are exploring emerging image sensing technologies Which applications are expected to benefit the most? How can autonomy be improved by image sensors? What are the difficulties in commercializing these emerging technologies?

A particularly important trend is the development of much cheaper alternatives to very expensive InGaAs sensors for imaging in the short-wave infrared (SWIR, 1000 – 2000 nm) spectral region, which will open this capability to a much wider range of applications. This includes autonomous vehicles, in which SWIR imaging assists with distinguishing objects and materials that appear similar in the visible spectrum while also reducing scattering from dust and fog.

There are several competitive emerging non-InGaAs SWIR technologies. These include hybrid image sensors where an additional light-absorbing thin film layer made of organic semiconductors or quantum dots is placed on top of a CMOS read-out circuit to increase the wavelength detection range into the SWIR region. Another technology is extended-range silicon, where the properties of silicon are modified to extend the absorption range beyond its bandgap limitations. Currently dominated by expensive InGaAs sensors, these new approaches promise a substantial price reduction, and that is expected to encourage the adoption of SWIR imaging for new applications such as autonomous vehicles.

New Capabilities Enabled by Emerging Image Sensors.
In addition to imaging over a broader spectral range, further innovations include imaging over a larger area, acquiring spectral data at each pixel, and simultaneously increasing temporal resolution and dynamic range. On this front, a promising technology is event-based vision. With conventional frame-based imaging, a high temporal resolution produces vast amounts of data that requires computationally intensive processing. Event-based vision resolves this challenge by presenting a completely new way of thinking about obtaining optical information, in which each sensor pixel reports timestamps that correspond to intensity changes. As such, event-based vision can combine greater temporal resolution of rapidly changing image regions with much-reduced data transfer and subsequent processing requirements.

Another promising innovation is the increasing miniaturization and conformality of sensor technology, making it easier than ever to integrate a sensor into a robotic arm, industrial inspection machinery, or consumer electronics. These are an application the burgeoning market of miniaturized spectrometers is targeting. Driven by the growth in smart electronics and Internet of Things devices, low-cost, miniaturized spectrometers are becoming increasingly relevant across different sectors. The complexity and functionalization of standard visible light sensors can be significantly improved through the integration of miniaturized spectrometers that can detect from the visible to the SWIR region of the spectrum with high spectral resolution. The future being imagined by researchers at Fraunhofer is a spectrometer weighing just 1 gram and costing a single dollar. Miniaturized spectrometers are expected to deliver inexpensive solutions to improve autonomous efficiency through enhanced material, object, and color differentiation.

@IDTechEx @AgilityPRS #PAuto #Imagr

Image processing examined.

For the successful implementation of image processing applications, it is not only important to choose the right camera and a suitable image sensor. In order to capture light without interference and convert it into usable information, suitable optics and high-quality filter glasses also play a decisive role. 

The focus event "Capture the Light" on June 24th at 2 p.m. BST addresses this topic in three exciting sessions. Over the course of around 90 minutes, participants can expect an introduction to the possibilities of modern sensor technologies; in addition, there will be an explanation of the options available when every single pixel is needed for an extremely clean image and what should be considered when choosing the right lens. IDS specialists will be available to answer individual questions between the sessions and in a panel round at the end. Registration and participation is free of charge via the IDS Vision Channel.

With the IDS Vision Channel, camera manufacturer IDS created an online platform at the beginning of the year for sharing knowledge on industrial image processing topics. The company regularly offers virtual live events where speakers pass on their expertise to participants free of charge. Particularly convenient: at various virtual tables, participants can get in touch directly with the specialists, ask questions or exchange experience with other participants. Anyone who has missed a session can simply view the recording in the media library at a later date.

The focus event "Capture the Light" will first deal with the topic of "Inside sensor technology", followed by a discussion of the maximum possible image cleanliness in "When clean is not enough". Before the final panel discussion, "Would you like a lens with that?" will question selection criteria when buying lenses. To participate, all that is required is a free registration in the IDS Vision Channel. Afterwards, all upcoming events can be conveniently added to one’s own calendar and past sessions can be accessed in the media library.

@IDS_Imaging @mepaxIntPR #PAuto 

Image processing for AI applications.

Release 2.0 of Abaco Systems' powerful, flexible ImageFlex image processing and visualization toolkit has been released. Leveraging the enormous power of GPU technology, ImageFlex provides an easy-to-use API framework to considerably speed and simplify the development, optimization and maintenance of advanced AI applications – especially those targeted at autonomous vehicles.

ImageFlex enables developers of image/video processing and visualization applications on GPUs to be substantially more productive by hiding the complexity of the underlying software layers, while maintaining high performance. By providing an OpenGL® abstraction layer (no OpenGL experience is required) it can reduce the number of lines of code required by a factor of five, radically reducing the effort and time needed in order to create, test and maintain the application. This means faster time-to-market as well as lower development cost.

New features for ImageFlex Release 2.0 include:

• Tools and reference examples enabling AI-based applications to be deployed on Abaco’s NVIDIA®-based GPU products.
• Provision of a reference target tracking example - a core building block for tracking applications.
• High quality, GPU-optimized image stabilization.

ImageFlex is highly complementary to Abaco’s NVIDIA GPU-based GVC1000 and GVC2000 hardware platforms, which use the NVIDIA Jetson supercomputer on a module for AI computing at the edge. This allows the creation of complete solutions for Degraded Visual Environment (DVE), 360° situational awareness, helmet mount sight processing, target identification and tracking and other EO/IR processing applications. It is portable across a range of graphics processing architectures and operating systems, and is potentially safety certifiable.

“ImageFlex significantly reduces our customers’ software engineering effort in the development and deployment of applications for EO/IR platforms and autonomy, and is unique in its ability to do so,” said John Muller, Chief Growth Officer at Abaco Systems. “Combined with our powerful, flexible hardware platforms, ImageFlex is evidence not only of our experience and expertise in AI-based graphics, video and visualization applications, but also of our commitment to providing our customers with more complete solutions.”

The ImageFlex API provides functions for a range of image processing operations from simple image transformations through to more complex lens distortion correction and image morphing. It includes optimized, high quality image fusion, stabilization, tracking and distortion correction algorithms, as well as a comprehensive set of reference application examples that provide core software building blocks. ImageFlex also provides tools and reference examples demonstrating how to integrate with sensors and deploy artificial intelligence-based applications such as object detection and recognition.
In addition, ImageFlex provides an innovative, high performance image fusion function that can fuse image data from multiple sources of different resolutions. The algorithm adaptively adjusts to pull through the regions of highest contrast in each source to a produce a fused result, enabling an observer or processing stage to act on the combined information of the sources.

@AbacoSys #PAuto  

Image sensor manufacturer appoints Director of Business Development for America!

CMOSIS has announced additional resources for America. The Belgian based company assigned Bruce Bradford as the new Director of Business Development based in Cary, (NC USA) to manage CMOSIS operations and growth in America.

Bruce Bradford

“We are extremely delighted with this important step in the further development of CMOSIS as a leading player in advanced CMOS image sensors,” said Lou Hermans, Chief Operating Officer, CMOSIS. “We are investing in establishing CMOSIS America and the assignment of Bruce Bradford to support our existing customer base and to pursue new relationships and opportunities. We are delighted to have Bruce Bradford joining our team as the newly appointed Director of Business Development. We see America as an important region with lots of opportunities for our business. Bruce’s long history with CMOS sensors, CCD’s and camera systems marketplace will bring our business in America to the next level. A local, US presence was the logical step to achieve this.”

Bruce Bradford brings in 30 years of cultivating successful business partnerships and developing sales growth in the high technology marketplace. His vast experience in the imaging market with companies such as Fairchild Imaging and e2v will be invaluable in developing new opportunities in machine vision, broadcast, industrial, biometrics, security and barcode applications served by CMOSIS’ products today.

“CMOSIS is a top notch high-tech company that has developed many high performance CMOS sensors meeting the increased demand of existing and emerging imaging applications. I am very excited to join the team and manage the new operations of CMOSIS in America. It is very motivating to see CMOSIS’ commitment to innovate new image sensor technologies that the market demands in America. The investment in the new entity shows the dedication to support the business in the region”, Bruce Bradford said.

Medical packaging inspection!

Stemmer will be showing the Contact Image Sensor (CIS) from Mitsubishi Electric at this years MEDTECH Ireland (Galway, 1-2 Oct 2014). This is the latest in document reading technology and can be used to scan labels, instruction leaflets and medical packaging in full colour to check for print defects, colour defects or logo defects.

Image formation in the CIS is achieved via a double-row lens array, using gradient index rod-lenses, matched to a colour tri-linear CMOS sensor. Each individual lens captures an image of a very small region of the target. Thanks to some overlap in the individual images, a clear, sharp, combined image with virtually no distortion is produced along the narrow line of the sensor with a resolution of 600 dpi.

CIS combines high data rates, high sensitivity, excellent colour rendition and resolution without any additional effort in set-up, camera alignment or calibration. Image data output is provided via standard industrial CameraLink interfaces. Built-in timing control includes encoder inputs and light control. Two sets of integral white LED lighting can be varied in intensity and controlled independently. CIS products are available in three different lengths, offering scan widths of 309, 617 and 926 mm.

More news on Bloodhound!

First phase of Bloodhound rocket plume imaging tests conducted

We have already reported on the Bloodhound Project in two posts last year, World land speed record attempt, (May 2013) and High speed cameras for high speed attempt! (Dec 2013). We now have news on how the project is progressing with reports on recent tests!

Pic: Siemens NX

The first phase of rocket plume imaging tests for the Bloodhound-SSC project has been conducted by Dr. Adam Baker at Kingston University (GB) in conjunction with Stemmer Imaging in order to determine the optimum wavelength range for imaging. Tests were carried out using cameras sensitive to the infrared, visible and UV regions of the spectrum, and the results can be seen on the Stemmer YouTube video. (right)

Monitoring the output of the rocket plume is expected to play an important role in the optimisation of the rocket and jet engine-powered Bloodhound vehicle as it is developed for its world land speed record attempt. Initial expectations that UV imaging would prove more useful than IR imaging were confirmed during the tests.

The plume from a small hybrid rocket burning PMMA (acrylic) in a stream of oxygen was imaged using a Teledyne DALSA Genie M640 colour camera for the normal visible wavelength range; a JAI CM140GE UV camera for UV wavelengths and an AVT Goldeye P032 IR camera for infrared wavelengths. The cameras were linked to an Adlink EOS embedded vision system equipped with an Intel Core i7 processor. Video was recorded using a custom version of the Vision Experts’ Gecko recording software, which also performs real-time video compression.

Further tests are likely to involve the construction of a small rocket set to allow the testing of multiple rocket nozzles from simulated angles. This will help to determine the best position for integrating the camera into the car.

More applications for measuring image dimensions

By drastically reducing measurement times, Keyence's IM Series Image Dimension Measurement System has revolutionised full-part inspection. Now with a twice as large field of view (200 × 100 mm) and new illumination options, it can handle larger and more complex targets.

The IM Series measures dimensions in seconds both reliably and with greater accuracy. Simply place a target on the stage and press the button. Up to 99 points are measured in a matter of seconds with a high degree of accuracy. The system simplifies measurement procedures. In addition to recognising and measuring shapes automatically, it features an autofocus complete with a motorised Z-stage with a 30 mm travel range and distortion adjustment. Lastly, it offers the advantage of eliminating inter-operator variability problems and makes managing measurement records easy.

A broad range to cover a maximum of applications.
The IM-6600 controller can be used with four different head units — the IM-6015/IM-6025 (general-purpose models), the IM-6140 (high-precision model, 0.1 µm repetition accuracy) and the all-new IM-6120 (200 mm wide-field model). The IM-6120 features a 200x100mm stage yet still has a remarkably small footprint.

Four types of illumination are now available — backlighting, epi-illumination (for measuring non-through dimensions), ring epi-illumination (for measuring shiny targets or tapered surfaces such as conic sections) and grazing illumination (for measuring targets with uneven surfaces or contours that are hard to delineate due to the diffusion of light).

Plastic cap/Mouldedcapacitor.
Ring epi-illumination makes measuring non-through dimensions on bottle caps and other targets with raised surfaces possible. This high-intensity ring of white LED light is cast onto the circumference of the lens. The ring is divided into four parts that are individually turned on and off to obtain the sharpest image. These settings are retained for each specific target to be measured.

Statistical processing of data has also been improved with a new application that extracts measurement data so that it can be imported into conventional spreadsheet software. Users can choose from a set of document templates and customise each layout with a logo or other visual element. The trend graph/histogram function allows on-site analysis of production trends and variations and can help to reduce rejection rates.

Strategic partnership in imaging!

Mitsubishi Electric Europe has chosen Stemmer Imaging as strategic partner for the distribution of Mitsubishi Electric Europe's Contact Image Sensors (CIS) throughout Europe. Stemmer showed a first demo system with a CIS product at VISION 2012 last week.

For many years Mitsubishi Electric Europe has offered cost-effective and easy to use solutions for the development of compact optical colour readers, mainly for high end document scanning with the highest scan rates. The new KD series of contact image sensors feature a CameraLink interface, increased working distance and higher speeds and are the first sensors Mitsubushi Electric Europe have produced targeted at the machine vision industry.

Samples of the new KD series will be available before the end of this year with mass production starting in the 2nd Quarter of 2013. The colour quality in combination with the very high scan rates of this system is impressive and clearly suggests that this technology is a promising solution for demanding applications. Applications for the CIS technology can be found in all areas where flat objects and materials are to be tested quickly and with high resolution, e.g. for the inspection of printed circuit boards, printed matter or LCD panels.

The products feature scan widths of 309, 617 and 926 mm and have a colour resolution of 600 dpi and a working distance of 12 mm. The line rate of 23 kHz allows scan rates of 960 mm/s equivalent to 44 µs/line. The Contact Image Sensors supply data in both 8- or 10-bit formats over a configurable Camera Link output. The use of the integrated tri-linear sensors with filter-on-chip and white LED illumination is unusual in industrial CIS products but is proven in existing line scan cameras.

The recently signed agreement appointed STEMMER IMAGING as the distribution channel for the Mitsubishi Electric CIS KD series in all European countries starting from 1 October 2012. "Mitsubishi Electric Europe´s Contact Image Sensors complement our product portfolio in a very useful, powerful way," emphasises Peter Keppler, Machine Vision Sales Manager at STEMMER IMAGING. "With Mitsubishi Electric Europe, we now have a very reliable partner supplying this type of product for which we see a significant number of appropriate applications."

Image sensor family

CMOSIS has introduced a 20-Megapixel image sensor for demanding, industrial applications. With the introduction of the CMV20000, CMOSIS broadens its current CMV portfolio of high-performing global shutters CMOS image sensors addressing the high-resolution segment of the industrial vision applications as well.

The unique properties and features such as high resolution, high dynamic range and global shutter, are a perfect fit for high-end industrial imaging systems, automation systems and medical applications.

The CMV20000 image sensor features a 20 Megapixel (5,120 x 3,840) resolution with 6.4 um sized square pixels resulting in an active sensor area of 32.8 x 24.6 mm (35 mm film optical format). Peak quantum efficiency reaches up to more than 45 percent resulting in a superb responsivity of 8.29 V/lux.s in combination with an excellent dynamic range of 66 dB. By means of correlated double sampling in global shutter mode, the patented 8-transistor pixel cell architecture reduces any dark noise and FPN non-uniformity of the sensor matrix. The sensor also offers an excellent shutter efficiency, a common feature of the CMV image sensor family.

At full 20 Megapixel resolution and with a 12-bit ADC resolution the CMV20000 delivers 30 full frames per second. This is achieved by using 16 LVDS outputs running at 480 Mbit/s each. Lower frame rates can be supported by multiplexing to 8 output channels only. Partial read out, windowing and subsamples modes, can be programmed to support higher frame rates. At full resolution and frame rate, the power dissipation is 1.1W. This power consumption can be dynamically controlled when lower frame rates are used.

Driving and programming the on-chip features such as HDR (High Dynamic Range) modes, offset and gain programming and power dissipation control is done over a 3-wire read-write SPI control.

The monochrome variant of the CMV20000 image sensor is in production today. A color variant, with RGB Bayer CFA filter, will be introduced to the market in Q4 2012. It is housed in a ceramic 143-pin PGA package and can be operated in the -20 to +70 ºC temperature range. This extended temperature range makes the CMV20000 perfectly suited for most demanding and robust industrial applications.

The CMV20000 was originally developed as a customized, exclusive product aimed at complex traffic management applications. An agreement with the original customer allows CMOSIS to offer this imager to third parties for applications outside the traffic field.