Ultra-high-resolution imaging.

Teledyne DALSA has released the new Linea™ ML 32K line scan camera. Designed for ultra-high-resolution imaging in semiconductor wafer and electronics inspection, the Linea ML 32K camera joins the existing Linea ML family, delivering exceptional image quality with 2.5 µm pixels and a maximum line rate of 150 kHz.

The Linea ML family features a multiline CMOS sensor, available in 8k, 16k, and now 32k resolutions, with optimized quantum efficiency to meet the rigorous demands of current and future machine vision applications. Its multiline sensor architecture enables configuration for single-line, dual-line, trilinear color, or quadlinear multispectral imaging, depending on application requirements. Unique features such as sequential exposure provide versatility and flexibility to meet a variety of demanding requirements.

The small 2.5 µm pixel size makes the Linea ML 32K particularly well suited for inspecting entire 300 mm wafers using a single camera. Features such as HDR and sequential exposure significantly improve the detectability of small defects. The camera also includes Camera Link HS® CX4 connectors for Active Optical Cables, providing complete EMI immunity.

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