Showing posts with label Electronics. Show all posts
Showing posts with label Electronics. Show all posts

Wednesday, 30 September 2026

Ultra-high-resolution imaging.

Teledyne DALSA has released the new Linea™ ML 32K line scan camera. Designed for ultra-high-resolution imaging in semiconductor wafer and electronics inspection, the Linea ML 32K camera joins the existing Linea ML family, delivering exceptional image quality with 2.5 µm pixels and a maximum line rate of 150 kHz.

The Linea ML family features a multiline CMOS sensor, available in 8k, 16k, and now 32k resolutions, with optimized quantum efficiency to meet the rigorous demands of current and future machine vision applications. Its multiline sensor architecture enables configuration for single-line, dual-line, trilinear color, or quadlinear multispectral imaging, depending on application requirements. Unique features such as sequential exposure provide versatility and flexibility to meet a variety of demanding requirements.

The small 2.5 µm pixel size makes the Linea ML 32K particularly well suited for inspecting entire 300 mm wafers using a single camera. Features such as HDR and sequential exposure significantly improve the detectability of small defects. The camera also includes Camera Link HS® CX4 connectors for Active Optical Cables, providing complete EMI immunity.


@TeledyneDALSA  @TeledyneVisInd @TeledyneVisSci #PAuto #Electronics

Tuesday, 29 September 2026

Swiss innovation in sensors.

Sensirion ranks third among the top 100 most innovative companies in Switzerland in 2027. Innovation has been part of the company's DNA ever since its founding. The company’s commitment to innovation has now been confirmed by the ranking of “Top 100 Innovative Companies Switzerland 2027.” With its third-place ranking, Sensirion has been recognised as one of the most innovative companies in the country. The award from Bilanz, PME and Statista* is based on a comprehensive analysis of innovation achievement, patent strength and innovation culture. The top-three ranking underscores Sensirion’s leading role as an innovation partner for sensor solutions worldwide.

Being named the third most innovative company in Switzerland confirms Sensirion’s consistent focus on innovation and the continuous development of trailblazing sensor solutions. Sensirion invests in research and development to support customers around the world with precise and reliable technologies for applications in industry, medical technology, consumer electronics and automotive industry.

The Top Innovative Companies Switzerland 2027 ranking was conducted by Bilanz, PME and Statista and is based on a multi-stage assessment process. The analysis incorporated the assessments of employees, evaluations by external innovation experts and the strength of a company’s patent portfolio. In total, more than 5,000 people were surveyed and around 20,000 company evaluations were carried out. The patent data was provided by LexisNexis Intellectual Property Solutions and rated using the Patent Asset Index, which considers both the technological relevance and the economic significance of the patents.

The evaluation was based on three equally weighted innovation dimensions: product innovation, process innovation and innovation culture. It took into account the development of new products and technologies, the continuous improvement of processes and digital solutions, and a working environment that fosters creativity, entrepreneurship and the implementation of new ideas.

With its third place in the ranking, Sensirion is one of the companies that not only drive innovation through technological excellence, but make this ethos an integral and enduring part of their processes and corporate culture. This result underscores the company’s ambition to create long-term added value for customers, partners and society through continuous innovation.


* More information on the top 100 most innovative companies in Switzerland.

@sensirion @BILANZ #Electronics #PAuto #Switzerland


Monday, 21 September 2026

Outstanding performance in electronic components.

Anglia Components, one of Europe’s longest-established, independent, authorised distributors of electronic components, has won the Eaton Electronics Division’s UK Distribution Partner Award 2025, in recognition of outstanding performance for the Eaton Electronics Division component product range.

Presenting the award, Stefan Busse, Eaton’s EMEA Distribution Manager said: “This achievement truly highlights the dedication and expertise demonstrated by the Anglia Components team in the UK. Your commitment to excellence, partnership, and consistently delivering exceptional results has set a remarkable standard. This milestone is a testament to the hard work and collaboration of the entire team. Thank you for your continued efforts and congratulations on this well-deserved recognition.”

Replying, John Bowman, Anglia’s Marketing Director added: “It’s an honour to receive this prestigious award. At Anglia we work very hard to build and grow real, effective partnerships with our supplier partners, and this award is a vindication of this philosophy.”


@eatoncorp @angliaComponent @angliaLive @BWW_Comms #Electronics #Pauto #Britain

Tuesday, 28 July 2026

Response to recent mergers and acquisitions activity in component market.

Blurred lines can lead to lack of transparency and independence.

Anglia Components which is one of Europe’s longest-established, independent, authorised distributors of electronic components, has warned of a looming potential imbalance in the supply chain, where traditional lines may become blurred, leading to a lack of transparency and compromised independence.

Steve Rawlins
Steve Rawlins, Anglia’s CEO reasons: “Last week, the news sneaked out that one of the leading electronic component brokers had been bought by a major CEM, confirming rumours that had been floating about for months. This is concerning because it places too much buying power in the control of one organisation, leaving the supply chain at risk. If this were to become a trend, with other Tier 1 CEMs buying brokerage companies, it could easily result in artificial shortages and price hikes.”

Anglia is speaking from experience. 25 years ago, the company set up its own CEM operation, which was in Rawlins words ‘a disaster’ as customers were confused and worried by the potential conflict. The experiment was swiftly terminated.

The issue really centres on how increasingly blurred lines between manufacturing, distribution, and open-market sourcing affect company governance. Anglia believes in forging strong, three-way supply chain partnerships between component manufacturer, the customer and the distributor. “We operate with full transparency in the best interests of our customers”, concludes Rawlins.


• See also: Warning: Chip shortage. (29/6/2026); Guarding against inventory disruption. (18/1/2019).

@angliaComponent @angliaLive @BWW_Comms #Electronics #PAuto

Monday, 13 July 2026

Power line filters.

Deliver high-performance EMI/RFI suppression for critical power applications. 

EMIS has introduced the SMF911 and TMF911 series of Single Phase and Three Phase Common Mode Facility Power Line Filters, engineered to provide exceptional electromagnetic interference (EMI) and radio frequency interference (RFI) suppression for industrial, commercial, defence and mission-critical power installations.

Designed to ensure the reliable operation of sensitive electronic equipment, the SMF911 (Single Phase) and TMF911 (Three Phase) filter series provide high-performance noise attenuation across a broad range of AC and DC power applications. With current ratings extending from 6 A to 3000 A, the filters can be deployed in applications ranging from compact control panels through to large-scale power distribution systems.

The filters deliver insertion loss performance of up to 100 dB across a wide frequency range, effectively suppressing conducted EMI and RFI that can compromise equipment performance, signal integrity and system reliability. Standard models provide attenuation from 100 kHz to 18 GHz, while extended-range versions offer enhanced suppression from 10 kHz to 40 GHz for applications requiring the highest levels of electromagnetic protection. Developed for demanding environments, the SMF911 and TMF911 series are particularly suited to military power supply applications, where high current capability, rugged performance and stringent EMC requirements are essential. The filters are designed in accordance with recognised standards including MIL-STD-220C, MIL-PRF-15733J, UL 1283 and IEC 60939, supporting their use in critical infrastructure and defence-related systems.

Safety and system protection are integral features of the design. Built-in discharge resistors safely dissipate stored capacitor energy after power removal, reducing maintenance risks and improving operator safety. Optional integrated 40 kA (8/20 μs) surge suppression using MOV technology provides additional protection against lightning-induced surges and power switching transients, helping to improve overall system resilience.

By reducing electrical noise and transient disturbances, the SMF911 and TMF911 facility power line filters help minimise communication errors, prevent equipment malfunction, reduce downtime and extend the service life of connected electrical and electronic systems.

Applications.
The SMF911 and TMF911 series are designed for a wide variety of high-performance power environments, including:

  • MRI scanner rooms – Installed at power entry points to prevent external electromagnetic interference from affecting image quality and diagnostic accuracy.
  • Shielded rooms – Providing clean power while maintaining the electromagnetic integrity required for secure communications, defence and research facilities.
  • Radar power supplies – Delivering stable, low-noise power to support signal accuracy, reliability and operational performance.
  • EMC test chambers – Preventing external interference from affecting compliance testing while controlling internally generated emissions.
  • Command and control centres – Protecting critical communication, surveillance and control systems against power-line disturbances.
  • Data centres – Improving power quality for servers, networking equipment and UPS systems while enhancing infrastructure reliability.
  • Combat and tracked vehicles – Suppressing conducted EMI to ensure dependable operation of communications, navigation, electronic warfare and control systems in demanding field conditions.
  • MIL-grade power panels – Providing advanced EMI filtering and surge protection for defence power distribution systems requiring stringent EMC performance.
  • Laboratories and test facilities – Creating low-noise electrical environments for precision measurement, calibration and research.

With their combination of high-current capability, wide-frequency suppression, surge protection options and compliance with demanding EMC standards, the SMF911 and TMF911 facility power line filters provide engineers with a robust solution for protecting sensitive electronics in the most challenging operating environments. EMIS aims to offer an end-to-end solution to meet industry’s ongoing EMI Challenges. With a robust global supply footprint across eight industry segments, EMIS is continuously investing in technology and skills to deliver its promise of efficiency with seamless customer support.

EMI Solutions has been designing and manufacturing EMI filters for more than 40 years and is a global source for efficient EMI and EMC solutions across all industries, applications and the frequency spectrum. Products available include EMI/EMC Components, Feedthrough Components, Power Quality, Military Grade Filters and Surge Protection. Customers are supported by a very experienced consulting team, a fully equipped Pre-Compliance Lab and a huge safety certified standard product offering of over 2500 part-numbers produced in their own very efficient facility.


@proactivefleet #EMIS #PAuto #Electronics


Tuesday, 7 July 2026

Diagnosing your electronics issues.

Connector Clinic is a free remote diagnosis service designed to support engineers and companies that are facing interface, pinpoint, wiring, assembly and interconnect challenges just launched by Inelco Hunter.

This service gives engineers quick, practical guidance on issues such as sourcing alternatives, pin-out matching, environment sealing, continuity concerns and compliance considerations. Drawings, photos or a brief description of the problem can be submitted for a brief review with the Inelco Hunter team. The service supports interconnect challenges across industrial, high power and high current, EV, and harsh environment applications where connector selection or integration can slow development. Support includes reviewing likely failure modes, assessing materials and standards suitability, and highlighting practical options for moving forward.

“Engineers often need quick, informed guidance when interconnect issues arise,” says David Bushnell, Inelco Hunter MD. “The Connector Clinic provides fast, focused support based on proven solutions from Amphenol Ltd, LTW and Anytek portfolios, as well as other compatible technologies where appropriate.” 

The Connector Clinic is a brand-neutral specialist service, designed for engineers working with a wide range of connector technologies, including those looking for alternatives to their current solution. The aim is to give engineers a clearer understanding of the issues and options available.

Open to OEMs, design houses and engineering teams working on new or existing designs, upgrades or troubleshooting tasks. Sessions can be booked by contacting Inelco Hunter directly.


@InelcoHunter #PAuto

Monday, 22 June 2026

New generation for electronic testing marks decade start.

Seica is celebrating its 40th anniversary with the launch of OPERA Series, a new-generation platform designed to deliver greater flexibility, scalability, and long-term value to electronics manufacturers worldwide.

As the company enters its fifth decade, the launch of OPERA Series marks the beginning of a new era focused on open architectures, collaborative innovation, and sustainable technological advancement. Building on forty years of expertise and customer partnerships, Seica remains committed to helping manufacturers worldwide meet the challenges of tomorrow's electronics industry.

The announcement was made during Seica's annual international Summer Meeting, which brought together employees, subsidiaries, sales representatives, and business partners from across Europe, North America, Asia, and the Middle East. The event marked not only an important company milestone, but also the beginning of a new chapter in Seica's technological evolution.

OPERA, which stands for Open Platform ERA, represents far more than a new product family. It embodies the philosophy that has guided Seica throughout four decades of innovation: openness to customer needs, openness to new technologies, and openness to building solutions that evolve alongside changing manufacturing requirements.

At the heart of the OPERA concept is Seica's long-standing strategy of developing technology through modular building blocks fully compatible with its VIP platform architecture. This approach enables the company to develop new solutions more rapidly, preserve compatibility across generations of products, protect customer investments, and extend system lifecycles.

Introducing the new platform, Barbara Duvall, CEO of Seica, emphasized the broader meaning of openness within the company's culture and strategy. "OPERA stands for Open Platform ERA, but for us, openness extends far beyond technology. Being open means listening to customers, understanding their challenges, and building the future together. Many of our most successful solutions were born from customer insight, real-world production experience, and ideas developed together with our global sales and support teams."

Duvall continued: "Our goal is not simply to sell machines. We act first as consultants, helping customers identify their real needs and guiding them toward the solution that fits them best. We deliver scalable, reconfigurable systems that grow with their business, and we support them worldwide throughout the life of their investment. This combination of expertise, flexibility, and long-term partnership is what truly differentiates Seica."

This solution-oriented approach has enabled Seica to establish itself as a trusted technology partner for manufacturers operating in highly demanding industries, where production requirements continue to evolve and flexibility has become increasingly important.

Antonio Grassino, President and Co-Founder of Seica, reflected on the company's journey from its founding in 1986 to its current position as a global reference in electronic test technology. "Forty years ago, Seica was founded on a passion for technology and a determination to tackle challenges that others considered impossible. Today, we operate worldwide, yet our spirit remains unchanged: to innovate, experiment, and create solutions that generate real value for our customers."

Grassino also highlighted the role of continuous innovation in sustaining long-term growth. "Our history demonstrates that innovation is not a single event but a continuous process. We have consistently invested in research, people, and new technologies while maintaining a long-term vision. This continuity has enabled us to grow successfully and adapt to the evolution of global markets."

Seica's success has been built on innovation and commitment. Continuous investment in research and development is complemented by a strong culture of collaboration, knowledge sharing, and customer focus. Together, these values have enabled the company to build a global reputation for reliability, technical excellence, and innovation.

The company sees OPERA Series as a foundation for future growth. Designed around openness, compatibility, and long-term customer value, the platform reflects Seica's commitment to developing solutions that can adapt to future technologies and evolving manufacturing environments.


@seica #Electronics #TandM

Thursday, 12 March 2026

Closing the gap from virtual training to real-world deployment.

NVIDIA Omniverse libraries is being integrated into ABB Robotics’ RobotStudio® to help manufacturers deploy physical AI in real world robotics applications.

The collaboration focuses on combining ABB Robotics’ software programming, design and simulation suite, RobotStudio, with the physically accurate simulation power of NVIDIA Om-niverse libraries to close technology's long-standing 'sim-to-real’ gap. Developers can simulate robots in digi-tal twins and generate synthetic data to train their physical AI models, enabling businesses of all types and sizes to deploy AI-driven robotics for various industrial workflows.

“Today, using NVIDIA accelerated computing and simulation technologies, we have removed the last barriers to making industrial and physical AI a reality at a global scale by closing the sim-to-real gap,” said Marc Segura, President of ABB Robotics. “For more than 50 years, ABB Robotics has led the evolution of intelligent industrial automation, from pioneering the first generation of fully electric industrial robots to advancing digital twin simulation through RobotStudio® and shaping a new area of autonomous and versatile mobile robots. Today’s announcement with NVIDIA brings physical AI to industry at scale.”

Called RobotStudio HyperReality, the resulting physically accurate simulations and foundation models are endlessly optimised with real-world data feedback continuously improving the system. These models can be used to train any number of ABB robots, anywhere in the world, with the reliability and accuracy demanded by industry.  

“The industrial sector needs physically accurate simulation to bridge the gap between virtual training and the real-world deployment of AI-driven robotics at scale,” said Deepu Talla, vice president of robotics and edge AI at NVIDIA. “Integrating NVIDIA Omniverse libraries into RobotStudio brings advanced simulation and accelerated computing to ABB Robotics’ unique virtual controller technology, accelerating how manufac-turers of all sizes bring complex products to market.”   

Closing the ‘sim-to-real’ gap.
 The long-standing deficit between simulation accuracy and real-world lighting, materials and environments is known as the ‘sim-to-real’ gap. For decades, this gap has limited the ability of manufac-turers to design and develop advanced manufacturing processes in the virtual world.  

By integrating NVIDIA Omniverse libraries into RobotStudio, ABB Robotics will deliv-er unprecedented robotics simulation and synthetic data generation capabilities that will allow intelligent robots to bridge this gap with up to 99 percent accuracy. ABB is the only robot manufacturer with a virtual controller running the same firmware as the hardware, ensuring near perfect correlation between simula-tion and real world performance. Combined with ABB Robotics’ Absolute Accuracy technology, which reduces positioning errors from 8–15 mm to around 0.5 mm, ABB delivers unmatched precision in both virtual and physical environments, making it suited to high-precision industrial-grade applications.

This innovation enables manufacturers to design, test, and optimise production lines virtually, cutting setup and commissioning times by up to 80 percent, reducing costs by up to 40 percent by eliminating the need for physical prototypes, and accelerating time-to-market for complex products such as consumer electronics by 50 percent1.

ABB Robotics is also assessing the potential to integrate the NVIDIA Jetson edge computing platform into its Omnicore controller to achieve real-time AI inference at the edge for its extensive robot portfolio. Today’s announcement builds upon ABB Robotics’ long-standing work with NVIDIA, including the previous integration of NVIDIA Jetson into ABB Robotics’ VSLAM autonomous mobile robots as well as the development of gigawatt-scale AI data centers.

RobotStudio HyperReality will serve industrial clients at any scale, across a breadth of industries and applica-tions, with select customers already testing its capabilities ahead of a full release to ABB Robotics’ 60,000 RobotStudio customers worldwide in the second half of 2026.

Foxconn, the world’s largest electronics contract manufacturer, is piloting the first joint use case in consumer electronics assembly. Automating the assembly of a tiny piece in consumer electronics is challenging, as multiple device variants require different production methods and the delicate metal structure requires precise pick-and-place and assembly control, as well as fine-tuned setup, often demanding additional debugging time and engineering resources. Using RobotStudio HyperReality, Foxconn’s assembly robots are trained virtually, using synthetic data to perfect multiple real-world production processes in various scenarios, before moving them to the production line with 99 percent accuracy. By optimising production lines virtually, Foxconn will reduce set-up times and costs by eliminating physical training and tests, and accelerate time-to-market for consumer electronics.

“Precision is everything in consumer electronics manufacturing and until now, this level of accuracy and fidelity just wasn’t possible in simulation and digital twins,” said Dr. Zhe Shi, Chief Digital Officer of Foxconn. “We’re incredibly excited by the potential of ABB Robotics and NVIDIA’s collaboration, which enables parallel engineering for better designs, faster production ramp‑up and greater product evolution through advanced AI inference and understanding.”

WORKR, a California based robotic workforce company that delivers robotic manufacturing solutions to in-dustry, is extending the reach of this technology to small and medium manufacturers across the United States. At NVIDIA GTC 2026 (March 16-19, San Jose, CA USA), WORKR is to demonstrate AI- powered robotic systems built on ABB technology, trained with synthetic data using NVIDIA Omniverse libraries, and deployed without operators needing to know any programming. By combining ABB's industrial grade robotics with its proprie-tary WorkrCore™ AI platform, the company is helping manufacturers address critical labor shortages with its robotic workforce that can learn new tasks in minutes and be operated by anyone.

"This collaboration is about making industrial AI deployable today,” said Ken Macken, CEO & Founder of WORKR. “Together with ABB and NVIDIA, we're proving that advanced automation can work for manufactur-ers of any size."


@ABBRobotics @nvidia @ABBgroupnews @abb_automation @HonHai_Foxconn @workr_official #PAuto #Robotics  

 

Wednesday, 3 December 2025

FeedThrough capacitors and filters.

Providing high frequency noise suppression and improved system EMI performance.

A range of FeedThrough components from EMIS, are designed to pass conductors through a grounded barrier while providing high‑frequency noise suppression and improved EMC performance.

FeedThrough Capacitors are a single capacitor mounted through a metal panel or chassis, allowing a signal or power conductor to pass while shunting high‑frequency noise to ground.​ This is highly effective at suppressing high‑frequency interference from approximately the kilohertz region up to the gigahertz range, depending on the construction and installation.​

The component provides a low‑impedance path to ground for unwanted high‑frequency signals, improving insertion loss at higher frequencies compared with standard two‑lead capacitors.​ It helps prevent radio‑frequency interference (RFI) from entering or leaving shielded equipment and enclosures.​

The design offers high reliability and mechanical robustness, suitable for harsh environments such as aerospace, military, industrial, and medical systems. Components are usually threaded for bulkhead mounting, ensuring a secure mechanical fit and a low impedance ground connection to the chassis or panel. The capacitor shell must be bonded firmly to the metalwork to maintain effective high frequency noise suppression; poor grounding significantly reduces performance.

Key features of FeedThrough Capacitors include:

  • Typical current ratings to approximately 200 A and AC voltages up to 250VAC, depending on type and size.
  • Capacitance values are available from approximately 2.2nF to 4700nF to support a wide range of impedance and attenuation requirements
  • Devices are designed in accordance with IEC/EN 60384‑14 for safety‑related capacitors.
  • Specified torque should be applied to threaded terminals and nuts to avoid mechanical damage and to guarantee stable contact resistance over lifetime.
  • Versions are available that meet EMC and safety‑relevant capacitor classes (Y2) and/or specific pulse‑test or surge requirements.

    A FeedThrough filter integrates capacitors and inductors, and in some design’s resistors, into a single housing to provide broadband attenuation of conducted noise Compared to a single FeedThrough capacitor, it offers higher insertion loss over a wider frequency range, often extending to lower frequencies where line impedance dominates.

    Key features of FeedThrough filters include:
    • Typical electrical ratings cover up to approximately 200A and AC voltages up to 250VAC, depending on the selected series.​
    • Capacitance options generally range from about 10nF to 4700nF to optimise performance across different load conditions and noise spectra.​
    • Designs comply with standards such as UL 60939‑3, IEC 60939‑1&2 and CSA C22.2 No. 8 for passive EMC filter components

FeedThrough EMC Components have a wide range of applications such as:

  • RF & Communication Systems: preventing RF coupling through control and power penetrations in RF circuits, RF communication equipment, telecom base stations.​
  • Power & Energy: reduce conducted emissions and improve immunity in switched‑mode power supplies, UPS systems, battery charging equipment, and electrical machines and drives.
  • Aerospace: where high reliability FeedThroughs are required at bulkhead interfaces for avionics, radar, communication and mission‑critical electronics.
  • Digital & Control Systems: High‑speed digital electronics, motor drives, robotics, PLC panels, as well as analogue and digital I/O lines that cross shielding boundaries.​
  • EMC & Interference Protection: Broadband interference suppression for equipment needing stringent EMC compliance, including use in EMC chambers and shielded rooms.​
  • Medical Devices: Implantable and external medical devices such as pacemakers and neurostimulators, where low leakage and high reliability are critical.​
  • Noise Reduction in Panels: Suppression of noise on sensor, actuator, and control wiring routed near motors, inverters, and other high‑power switching elements.​
  • Environmental Protection: Sealed bulkhead FeedThroughs are used to maintain environmental integrity while providing EMC filtering in harsh or outdoor conditions.​
  • Networking & Communication: Where interfaces must pass through shielded enclosures without degrading EMC performance.​

EMIS aims to offer an end-to-end solution to meet industry’s ongoing EMI Challenges. With a robust global supply footprint across eight industry segments, EMIS is continuously investing in technology and skills to deliver its promise of efficiency with seamless customer support.


@proactivefleet #EMIS #PAuto #Electronics

What has Ai got in store for industry in 2026?

Here are ten connectivity and electronics design predictions.

Our friends at Molex are predicting that artificial intelligence (Ai) will continue to transform every major industry sector over the next 12 to 18 months, driving exponential demand for computational resources while causing major bottlenecks in both compute power and connectivity. Ai-driven data proliferation and processing are creating new opportunities and obstacles for design engineers across fast-growth sectors, including automotive, aerospace, consumer electronics, data centres, industrial automation and MedTech.

“Ai models in every industry—from autonomous vehicle sensors and high-resolution medical imaging to real-time control systems on factory floors—generate massive amounts of data while requiring high-speed connectivity, advanced power delivery and efficient thermal management,” said Aldo Lopez, SVP and president, Datacom and Specialty Solutions, Molex. “In 2026, we will remain steadfast in helping remove critical bottlenecks in compute power and connectivity while working with customers, suppliers and partners worldwide to develop future-ready, Ai-driven infrastructures.”

Top 10 Predictions for 2026

1. High-speed interconnects remain essential to delivering the speed and density to enable Ai/Machine Learning workloads in modern hyperscale data centres.
Communication between major compute elements, like GPUs and Ai accelerators within a data-centre server or chassis, necessitates a mix of high-speed backplane and board-to-board solutions designed for 224Gbps PAM-4 speed, along with high-speed pluggable I/O connectors that support aggregate speeds up to 400/800Gbps while providing a path to 1.6T.

2. Energy consumption hampers data-centre scaling, propelling advancements in thermal management.
The heat generated by high-performance servers and systems needed to scale generative Ai applications while supporting the transition to 224Gbps PAM-4 has exceeded traditional solutions relying on air-cooling technology. Developments in liquid cooling, including direct-to-chip cooling, immersion cooling and passive components that enhance active cooling, will continue to gain traction and exploration over the next 12 to 18 months.

3. Demand escalates for Co-Packaged Optics to support “scale-up” architectures.
Co-Packaged Optics (CPO) is considered essential for handling GPU-to-GPU interconnectivity in AI-driven architecture. Designed to deliver ultra-high bandwidth density directly at the chip edge, CPO enables much higher interconnect density while reducing power consumption and electrical signal loss. The focus on CPO is expected to intensify in the coming year, as it has been developed specifically to address the massive power and bandwidth demands of hyperscale data centres and Ai/ML clusters.

4. Specialty fibre optics accelerate MedTech and aerospace and other innovations.
Specialty fibre optics offer high-precision links with immunity to Electromagnetic Interference (EMI). No wider than human hair, optical fibre increasingly powers high-resolution imaging equipment, like MRI and CT scanners, while delivering concentrated laser energy for non-invasive therapeutic treatments. fibre optics also address engineering challenges in satellite and space systems to transmit vast volumes of data over long distances with minimal signal degradation.

5. Rugged, reliable and miniaturised solutions gain momentum across every major sector.
The use of compact, durable connectors that thrive in harsh environments has long dominated automotive as well as aerospace applications. Pushing boundaries for greater reliability in very small form factors has now permeated consumer electronics (e.g., fitness trackers, smartwatches and smart home devices); industrial automation (e.g., warehouse robots, touchscreens and sensors); as well as medical devices (e.g., endoscopes, insulin pumps and wearable health monitors).

6. Electrification continues to accelerate, driving demand for high-speed, high-power connectivity.
Electrification trends in military land systems are gaining ground, with growth in Electric Vertical Take-off and Landing (eVTOL) systems, which need lightweight, miniaturised and rugged MIL-SPEC connectors and cables. An early proponent of zonal architecture for next-gen electrified vehicles, Molex connects multiple sensors, cameras, radar, LiDAR and other technologies while prioritising the role of hybrid or mixed connectors needed to handle power and high-speed signals associated with in-vehicle networks.

7. Mandates for modular solutions and open standards grow across most industry sectors.
An active participant in the Open Compute Project (OCP), Molex is developing next-generation data centre cooling technologies and modular hardware specifications to enhance hyperscale system performance, efficiency and modularity. Close alignment with industry standards groups in aerospace also empowers Molex to focus on reducing size, weight, power and cost (SWaP-C).

8. 48V architecture gains traction as universal standard for power efficiency.
48V architecture is rapidly becoming the universal standard for power efficiency in AI-driven data centres and next-gen vehicles. A power architecture enabler, Molex drives innovation in 48V technology to solve thermal density challenges and reduce cabling weight in automobiles while addressing power spikes caused by generative Ai workloads in data centres in support of the OCP Open Rack v3 (ORV3) standard.

9. Personalisation continues to shift, thanks to emergence of agentic Ai.
Agentic Ai adapts readily to changing conditions, aiding real-time decision making and personalisation. In automotive, this translates to advances in autonomous driving and in-cabin experiences that function more like a third living space. In consumer electronics and MedTech wearables, greater personalisation optimises product usage while real-time diagnostics improve wellbeing. On factory floors, real-time access to data and adaptive human-machine interfaces improve productivity and operational efficiency.

10. Demands for supply optionality and regional manufacturing grow amid global trade volatility.
Investments in AI-driven data ecosystems will propel digital supply chain intelligence to support demands for new, regional supply networks and localised manufacturing amid shifting trade policies. The result requires increased supply chain resilience amid growing demands for increased predictive procurement intelligence. 

Supporting Resources.
You might like to dive deeper into these 2026 predictions and hear from Molex industry experts as they explore how engineering ingenuity and emerging technologies are shaping the future. Watch their videos here to discover their views on what’s in store across key industries in 2026.


@MolexConnectors @mepaxIntPR #PAuto #Communications

Monday, 22 September 2025

Precision electronic components and sensors landmark.

The 50th anniversary of Rhopoint Components is being celebrated this September. Since its founding in 1975, the company has established a reputation for design-led distribution, delivering engineering solutions that meet the most demanding requirements across aerospace, oil, gas, EV, automotive, medical, energy and industrial markets.

(L to R) Jenny Trunwitt, Business Development Manager, Dawn King, Marketing Director, Omer Mirza, Joint Managing Director and David Beatson, Joint Managing Director, Rhopoint Components

The company was named Rhopoint* to highlight their competence in the ever-evolving world of precision resistors. The first product sold in 1975 was a high-precision wire-wound resistor from General Resistance. These products still represent part of the Rhopoint portfolio today.

Over the past five decades, Rhopoint Components has grown from a British supplier into a trusted international partner with a strong European presence served by German subsidiary, Rhopoint Components GmbH. The company is part of the Rhopoint Group and represents some of the world’s most innovative manufacturers, including long-standing partnerships with Isabellenhütte, VPG Foil resistors , SRT Microcéramique, and many others.

"Reaching our 50th year is a major milestone and a testament to the trust our customers and suppliers have placed in us," said Omer Mirza, Joint Managing Director of Rhopoint Components. "Our commitment to quality, service, and engineering-led support has allowed us to grow consistently while staying focused on the specific technical needs of our customers."

David Beatson, Joint Managing Director, shared his forward-looking vision: "As we look to the future, we see tremendous opportunities in emerging technologies and evolving customer needs. Our investment in expanded product ranges positions us perfectly to support the next generation of engineering innovations. We're committed to being at the forefront of technological advancement while maintaining the technical understanding of customer applications that has always been our hallmark."

The company continues to invest in people, partnerships, and platforms to support the evolving needs of design engineers and procurement professionals. From ultra-precision resistors and high-reliability capacitors to pressure sensors and custom solutions, the company’s product portfolio reflects a clear focus on performance-critical applications.

Mrs Dawn King, Marketing Director at Rhopoint  says, “Rhopoint has become a major player in the component distribution market by offering a winning combination of in-house expertise and careful selection of key, global suppliers that can support the most demanding requirements. Some of our internal sales team have been with the company 25+ years and have more familiarity with a manufacturer’s products than the actual manufacturer! As a specialist distributor we can function as a multiplier for supplier, designer and buyer, bringing together a wide range of components from qualified suppliers and facilitating the supply of application specific and custom products where required.”


*The Rhopoint name originates from two ideas. Firstly, the Greek letter ρ (pronounced rho). This is the symbol that represent electrical resistivity; the fundamental property of a material that quantifies how strongly it resists or conducts electrical current. Secondly the word “point,” in the context of measurement, is defined as a definite measurable position in a scale, thereby signifying precision.

@Rhopoint_Gloss #Electronic #PAuto 

Thursday, 14 August 2025

Circular connectors.

Ruggedised for use in extreme industrial applications.

The availability of Weald Electronics's LMG Heavy Duty range of circular connectors* has been announced. The connectors are designed for use in harsh or hazardous environments such as geophysical, mining, marine and petrochemical applications and other heavy industrial applications where key priorities are high resistance to vibration and the ingress of liquids, combined with very rugged construction.

LMG Heavy Duty circular connectors are built around a rugged brass or stainless-steel shell, are environmentally sealed from IP67 to IP69K and can come as standard with 6 contact arrangements with from 2 to 19 contacts. Two connector types are available, threaded coupling in brass only, and staple coupling in brass or stainless-steel construction. The rugged sealed design is very robust and is able to withstand high levels of shock and vibration in demanding operational environments.

Key standard features:

  • Tried and tested military contact technology.
  • High shock and vibration capabilities
  • Environmentally sealed from IP67 to IP69K
  • Brass or Stainless-Steel shells
  • In-line, panel and cable mounting styles.
  • 5 to 19A current rating
  • Wide range of backshells available

Accessories available include a backshell outlet accessory set for screened and unscreened multicore cable or cables with an inner collective screen, protective caps, staples and assembly spanners.

The conventional screw coupling versions offer a coarse ribbed coupling nut that can be easily gripped with protective gloves, while the staple coupling versions work in a similar way to typical hydraulic connectors where a large metal staple is used to quickly lock and secure the connectors together when mated. The staple provides a very quick coupling (often secured with a hammer) and it can easily be seen whether locked or not, even under adverse conditions.


*All Weald Electronics products are available from their leading franchised distributor Lane Electronics and available to order online 24/7. 

@FC_Lane @proactivefleet #Weald #PAuto #Electrical

Tuesday, 1 July 2025

Innovative enclosure design for wireless, embedded and instrumentation systems.

The innovative and advanced BoVersa enclosure concept from specialist manufacturer BOPLA offers customers an innovative modern design suitable for a wide range of applications. Flexible and customer-specific design options include a lighting concept, wireless communication and maximised cooling technology.

The new enclosure can be used for applications which require hand-held, tabletop, wall or pole mounting. The enclosure offers optimal conditions for instrumentation, security systems, IoT, wireless, embedded systems and more.

For wireless systems a die-cast aluminium enclosure body with moulded-in cooling fins can be combined with a plastic cover, allowing unhindered radio transmission while providing an optimal combination for wireless applications that require cooling.

For efficient heat dissipation, BoVersa has integrated cooling fins into the die-cast aluminium enclosure. The point-symmetrical design of the fins optimises airflow and ensures cooling of the enclosure when mounted horizontally or vertically. The uniform airflow maximises the efficiency of cooling and provides even and stable temperature distribution in the enclosure, increasing the service life and reliability of the built-in electronics.

BoVersa has a three-part enclosure structure consisting of a lower part, a functional lid and design cover which can be combined with each other as required. Colour accents can be added by combining enclosure parts in different colours to suit an application or branding requirement.

Key features of the new BoVersa enclosure system from BOPLA include:

  • A transparent function lid providing a view inside the enclosure or built-in displays. The enclosure parts can be combined in different colours. 
  • The transparent and translucent functional lids can also be used to set lighting design accents.
  • Open version for integration of keyboards and displays or closed version for a clean look and individual designs.
  • The closed design cover can change the appearance of the enclosure almost indefinitely through individual processing. No visible enclosure screws.
  • The frame-shaped design cover is perfect for integrating keyboards and displays, while the closed version allows for a clean look or custom designs.
    - For applications with special mechanical stability requirements, a cover made of die-cast aluminium is also available - the cover screws are concealed under covers.
  • The combination of high protection class and material properties enable use in outdoor areas. Plastic material PC UL 94 V0 is suitable for outdoor use, environmental protection to IP66 / 68 (1.2m - 2h) DIN EN 60529 
  • A pole attachment is available as an optional accessory.
    - Mounting tabs are directly moulded on the aluminium lower part and can be retrofitted separately on the plastic lower part.
    - The lower part has a moulded-in receptacle for a pressure equalisation diaphragm that can be "activated" at the factory.
  • The point-symmetrical design of the cooling fins allows for optimal airflow in horizontal and vertical mounting positions.

Equipment designers can create a bespoke enclosure solution by selecting the required components from the wide range of standard options.

BOPLA can offer customers full box-build services such as:

  • Mechanical processing
  • Print on
  • Engrave
  • Lacquer finishing
  • Full assembly, including automated PCB pick and place
  • Custom colours
  • Custom design sample service.

"With BoVersa we are taking into account the growing requirements of users and expanding the portfolio in a targeted manner. We offer a holistic solution for numerous areas that we have developed on the basis of current market requirements," says Andreas Krömer, Head of Development at BOPLA.


@proactivefleet #Bopla #PAuto #Electronics

Monday, 30 June 2025

Price rises cause "Supply Chain Chaos!"

Distributor advises ‘lead times likely to move out rapidly’ as market picks up.

Concerns in the market that lead times are predicted to move out rapidly later in the year now that the market appears to be picking up have been voiced by Anglia Components. News from many sources confirm that the excess inventory which has built up over the past two years has mostly been consumed, and at least one major supplier, Texas Instruments, has announced global price increases covering over 3,300 analogue product SKUs*.

Analyst company, Bernstein noted that the majority of the price hikes are below 30%, targeting general-purpose analogue components where competition is fierce…a smaller portion of high-precision ADC/DAC chips, will see price increases exceeding 100%.

John Bowman, the Anglia’s Marketing Director with Anglia commented, “All the signs are showing that the market is picking up rapidly, and the theme from many suppliers at our recent sales conference centred on their concerns that if customers do not start placing backlog now, they will run into problems later this year as lead-times are forecast to quickly lengthen.”

In order to protect themselves from the inevitable supply chain chaos this will cause, Anglia is advising customers to be vigilant and requests that they place forward orders as soon as possible.


* TI stock rating maintained amid price hike strategy (Investing.com)

@angliaComponent @TXInstruments #Electronics #PAuto

Thursday, 12 June 2025

Precision, speed, and efficiency for industrial automation.

A new interactive eBook in collaboration with TDK has been announced by Mouser Electronics. This explores the challenges of efficiency, safety, and sustainability in advanced automation applications.

Modern Industrial Technologies: Driving Efficiency and Innovation gives a deep dive into the ever-increasing demands for precision, speed, and efficiency in modern industrial automation, robotics, energy and sensor technology and how TDK's technology portfolio empowers engineers to overcome these challenges. With TDK's solutions already deployed across multiple industrial automation disciplines, this eBook gives insights into various considerations vital to a whole range of automation activities, from simple voltage and current measurements to complex navigational signal analysis and system diagnostics. The eBook highlights many of TDK's products that help bridge these challenges:

The ERUC23 SMT flat wire coupled inductors feature low-loss ferrite, high-saturation currents, and low DC resistance, offering self-leaded construction with flat wire winding and lead-free tinned terminals for 48Vinto 12Vout hybrid converters and dual-phase buck, boost, and buck-boost converters. The ERUC23 inductors also provide reduced ripple with improved efficiency in a compact package. The ERUC23 series is RoHS compatible and AEC-Q200 qualified.

The B43659 ultra-compact snap-in capacitors provide high reliability and high ripple current capability for power supplies, frequency converters, uninterruptible power supplies (UPS), medical appliances, and solar inverters. These extremely high CV products feature snap-in solder pins, an aluminium case, and both two-terminal and three-terminal versions to ensure correct installation. The B43659 series is RoHS compliant and offers a rated voltage of 450VDC and a capacitance range of 140µF to 1030µF with ±20% tolerance and operating in a -40°C to +105°C temperature range.

EPCOS / TDK's PiezoHapt™ and PowerHap™ actuators are ideal for providing haptic feedback to user actions in smartphones and touchpad displays, car navigation systems, controllers, household appliances, industrial equipment, and medical devices. The PiezoHapt actuators consist of a vibration unit with a multilayer piezoelectric element and vibration plate, while the PowerHap version has multilayer piezo plates with copper inner electrodes. These devices are RoHS compatible and have an operating temperature range of -10°C to +60°C or -40°C to +85°C.

The FLECLEAR Ag-Stacked Film Sheets feature a thin, transparent, conductive Ag alloy layer that is deposited on a film substrate, ideal for light control windows (smart windows) and organic photovoltaics (OPVs), flexible displays and lighting, or transparent electrodes of wearable devices.


@MouserElecEU @TDK_Corporation @Publitek #Electronics #PAuto


Monday, 2 June 2025

Exceptional electronics Distributor in Europe.

The 2024 Full Service Distributor of the Year and 2024 Semiconductor Distributor of the Year awards are a testament to the outstanding partnership between TTI Europe and Vishay, which has resulted in the delivery of top-tier products and services to customers.

Philippe Masson, Senior Director Sales Distribution EMEA (Vishay), Felix Corbett, Director Supplier Marketing (TTI), Annika Schneider, Key Account Manager Sales Distribution (Vishay), Markus Walz,Business Development Manager & Jörg Frödl - Director Product Marketing Europe (TTI)

“TTI Europe’s dedication to providing comprehensive services across our entire portfolio, including semiconductors and passives, has significantly enhanced accessibility and competitiveness,” says Philippe Masson, Senior Director of Sales Distribution at Vishay. “We sincerely thank the entire TTI Europe team for its exceptional support and are thrilled to present them with the 2024 Full Service Distributor of the Year award.”

“Furthermore, TTI Europe’s outstanding achievements in distributing our MOSFETs, diodes, and optoelectronics have been remarkable,” continues Masson. “Their expertise and dedication have greatly contributed to our success, and we are proud to honour them with the 2024 Semiconductor Distributor of the Year award.”

“It is a great honour to receive these two important awards from Vishay,” says Felix Corbett, Director Supplier Marketing Passives & Discretes, TTI IP&E Europe. “The awards recognise the close collaboration and engagement between our two companies in providing best-in-class products and services to our customers.”


@ttiinc @VishayIndust @Publitek #Electronics #Europe

Thursday, 22 May 2025

Solutions for electronics cooling.

The Chomerics Division of Parker Hannifin has released an updated version of its catalogue for thermal interface materials (TIMs). Providing a comprehensive overview of Parker’s solutions for electronics cooling applications, the latest catalogue includes all recently released TIMs, as well as a new dispensing guide to help customers ensure a correct and consistent application.

Many new-generation electronic products offer higher power in a smaller package, intensifying thermal management challenges for OEM and CEM electronics companies in the telecommunications, IT, consumer, power conversion, medical device, defence and transportation markets. To help engineers overcome these issues, Parker Chomerics showcases a wide range of TIMs in its updated catalogue.

For example, Parker Chomerics’ gap fillers (THERM-A-GAP™ series) come in two different types: gels and pads. Gels are low-closure-force, electrically isolating, fully cured materials that users dispense into place, while gap filler pads are highly conformable to accommodate an even wider gap range.

The updated catalogue also features Parker Chomerics’ THERMFLOW® phase-change materials. OEMs and CEMs can place these thin pads between a heatsink and semiconductor where they change phase into a liquid at higher temperatures to achieve a very thin bond line.

THERMATTACH® thermal tapes have adhesive on both sides to hold a heatsink in contact with an IC component without the need for mechanical fasteners, while another focus product in the updated catalogue is the THERM-A-FORM™ range of potting and underfill materials. Users can dispense these one- or two-component silicone elastomer materials prior to subsequent curing in place, whereas thermal gap filler gels are already cured when dispensed.

Other solutions highlighted in the updated publication include:

  • The CHO-THERM® series of dielectric pads. As well as offering thermal conductivity, CHO-THERM higher-closure-force pads for discrete power devices are electrically isolating.
  • Parker Chomerics’ heat spreaders (T-WING® range), which utilise two different thermal transfer methodologies: conduction to remove heat from an integrated circuit and convection air flow over the product to remove that heat from the assembly. These thin heat spreaders are suitable for use in restricted spaces.
  • Thermal greases (T series), silicone-based pastes with a thermally conductive filler material that draws heat away from a heat-generating component on a circuit board while filling very thin bond lines.

To complement the products, the updated catalogue offers added value to engineers with its new dispensing guide for thermally conductive gels, cure-in-place potting compounds and thermal greases. There is also a section on heat transfer fundamentals, ensuring readers fully understand this key electronics application before formulating ideas about the optimal solution.


@ParkerChomerics @ParkerHannifin @NapierPR #PAuto #Electronics

Wednesday, 7 May 2025

Low skew cable.

Cable specifically developed for 224 Gbps PAM4 systems.

Samtec has expanded its Eye Speed cable family to include Eye Speed Hyper Low Skew Twinax cable optimised for 224 Gbps PAM4 applications. Samtec is currently offering 32 AWG Eye Speed Hyper Low Skew Twinax for inside-the-box cable solutions, with 27 AWG in development for longer reach cabled backplane systems.

Skew is a major design concern for 224 Gbps PAM4, manifesting as delay differences within a differential pair (due to physical and electrical construction in the channel). Samtec has engaged in significant R&D as regards to the impact of skew, resulting in the development of Eye Speed Hyper Low Skew Twinax cable.

Tightly coupled, twinax cable that is co-extruded with drainless shield construction, like the Eye Speed product family, has superior skew performance (as well as impedance and insertion loss stability) even under realistic bending conditions, allowing skew to be completely under the implementer’s control. This is in contrast to other manufacturing techniques for twinax cables that are not co-extruded.

Eye Speed Hyper Low Skew Twinax was specifically developed to target applications where designers need optimal high-speed performance out to 60+ GHz Nyquist frequencies. By holding a maximum intrapair skew of 1.75 ps/m, and offering extreme signal stability, Samtec’s Hyper Low Skew Twinax has the best digital differential pair transmission line performance in the industry.

This Cable Technology includes 4 varieties: Eye Speed Twinax (3.5 ps/meter max skew; 28-36 AWG); Eye Speed Thinax (40% smaller diameter than Eye Speed Twinax, same performance; 34 AWG); Eye Speed Hyper Low Skew Twinax (1.75 ps/meter max skew; 32 AWG with 27 AWG in development); and Eye Speed ThinSETM (thin micro-coax with 0.024” outer diameter cable).

As part of Samtec’s Sudden Service® initiative, Eye Speed cables take a mix-and-match approach with Samtec’s most popular connectors. In other words, a designer can specify what connector is part of each end of the cable assembly. Some of the more popular mixed-end designs include ExaMAX® to AcceleRate® and FQSFP-D8 to NovaRay® connectors. For 224 Gbps applications, a designer could choose Si-Fly® HD Co-Packaged CPX Substrate Connector over Eye Speed Hyper Low Skew Twinax cable® to a Flyover® OSFP 224 Gbps Panel Assembly, for example.

The mix-and-match strategy allows system architects to specify Samtec high-speed cable solutions for mid-board to mid-board applications, or near-chip/on-chip to front panel, or ASIC-adjacent to the backplane. Whether PCB-attach or Direct-attach type cable assemblies, Samtec’s HDR Group


@SamtecInc @TechWireIntl #Electronics #Transport

Thursday, 24 April 2025

Best new product promoter.

Mouser Electronics has been named the Best New Product Promoter for 2024 by Diotec Semiconductor, the leading manufacturer of diodes, transistors, MOSFETs, and voltage regulators for automotive-, commercial- and industrial-grade applications. Mouser was awarded this accolade for significant growth in buyers, lines and part counts.

"We are very pleased to present Mouser with the Best New Product Promoter award," said Dr. Saverio Barboni, chief marketing and sales officer of Diotec Semiconductor. "Mouser's distribution is a key part of our channel strategy, and we look forward to many more years of successful collaboration."

"We are delighted to win this prestigious award from Diotec Semiconductor," said Kristin Schuetter, Mouser Senior Vice President of Products. "We greatly value our business partnership with Diotec and look forward to continuing to provide their products to design engineers and purchasing professionals around the world."

After signing a global distribution agreement with Diotec in 2022, Mouser Electronics received their Top Sales Partner Award for the same year. Mouser also received Diotec's Best Distributor Award for 2023. With over 5,000 Diotec parts available to order, Mouser offers an ever-widening selection of the newest solutions from the manufacturer, constantly adding new products to meet customers' needs.


@MouserElecEU  @DiotecSemi @Publitek #Electronics #PAuto

Cyber reliance complience.

The SoMLabs i.MX8Mmini System-on-Modules (SoMs, marketed by Inelco Hunter, are “CRA ready” i.e. conform to the EU Cyber Resilience Act which came into force on 10th December 2024. The Act’s aim is to enhance the cybersecurity of products with digital elements sold or manufactured in the EU. The i.MX8Mmini System-on-Modules are CRA Ready - they are ready to be integrated into the customer's electronic product with the knowledge that the requirements of the Act have been met with the SOMLabs module. To quote EU Commission President van der Leyen in outlining the necessity of this act, "If everything is connected, everything can be hacked." (2021)

The VisionSOM-8Mmini family is a SODIMM-sized SoM based on the NXP iMX8Mmini application processor which features a heterogeneous quad cores ARM Cortex-A53 together with an ARM Cortex-M4 cor, as well as an advanced 3D Graphics Processing Unit (GPU) Open GL 2.0 ES compatible and VPU (encoder/decoder) HD1080p60 H.264, HD1080p60 H.265.

The quad Cortex-A53 and single Cortex-M4 based VisionSOM provides full flexibility to support real time application while supporting Linux and advanced HMI. These compact and yet very powerful Mini SoMs will have a very wide range of applications in applications such as manufacturing, aerospace, medical, transport, retail, IoT.

The VisionSOM-8Mmini is a general-purpose highly integrated SoM (System on Module). The module is featuring high computation power. The option is fully certified Wi-Fi (802.11b/g/n) and Bluetooth (BLE 5.1) module. This module simplifies the carrier board design and is ideally suited for wireless application. The VisionSOM-8Mmini provides a variety memory configuration, including flexible range of LPDDR4, eMMC and SD memory card.

The VisionSOM-8Mmini supports connections to a variety of interfaces: two high-speed USB on-the-go with PHY, 1Gbit Ethernet, audio, advanced Full HD display with 3D coprocessing and VPU encoder/decoder, touch panel and serial interfaces.

With over 30 years of expertise, Inelco Hunter continues to provide industry-leading engineering support, helping customers rapidly implement solutions and speed up time-to-market. Unlike a lot of traditional distributors, Inelco Hunter offers in-depth technical assistance, ensuring that clients receive tailored, high-quality support throughout the lifecycle of their projects.


@InelcoHunter @EURLex #PAuto #Electronics