Aluminium enclosures.

A wide range of aluminium enclosure types combining sturdy construction with environmental protection up to IP69 are manufactured by Bopla. Their enclosures stand out in the market with their simple or elegant designs, available in a wide range of sizes, offering designers flexible equipment housings.

These empty aluminium enclosures can be finished individually, using processes such as coating, laser marking or printing and a full custom design service is available. The following functional accessories are examples of what is available for a BOPLA aluminium enclosure:

• A range of end covers or mounting lids.
• Design seals in a range of colours.
• Wall fittings.
• Caps.
• Tip-up feet.
• Front panels.
• Battery compartments.

Highlights of the BOPLA aluminium enclosure range include: • BoVersa, a stylish, flexible and robust modular enclosure solution suitable for a wide range of applications such as IoT, wireless, measurement and control technology. 

Three-part enclosure structure (base, functional cover and design cover), can be combined as required, plastic and aluminum design. Ideal for wireless applications with cooling requirements. Lighting design accents thanks to transparent and translucent functional covers. Open variant for the integration of keyboards and displays and closed version for a clean look and individual designs. Plastic material PC UL 94 V0 is suitable for outdoor use.

• Alubos IP65 rated, universal aluminium profile enclosure, offering increased protection for sensitive electronic systems and available 5 profile variants and 10 profile cross-sections. Special lengths available at short notice, functional diecast aluminium end covers, good EMC shielding.

• BoCube Alu featuring innovative locking technology and elegant aluminium design for visually demanding projects. Available in 11 sizes, captive lid with smooth surface or recessed membrane keypad area, hinge integrated in the enclosure design, BA-S variant with screwed-on cover (both sides) and recessed area for membrane keypads.

• Euromas Alu a field proven classic design enclosure offering a robust, weatherproof and reliable general-purpose solution. Available in 3 sizes, versions with silicone lid seal with higher temperature resistance, crystal-clear lid and EMC set on request for increasing electromagnetic shielding levels.

• Alustyle with a sophisticated elegant design and construction and functional accessories. Available in 3 profile variants and 6 profile cross-sections, all with good EMC shielding

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Innovative new enclosure concept.

For Wireless, Embedded, and Instrumentation Systems in demanding indoor and outdoor applications.

BoVersa is an innovative new enclosure concept designed for next-generation wireless, embedded, and instrumentation systems from BOPLA. Combining modern design with robust engineering, BoVersa delivers maximum flexibility for equipment designers while ensuring long-term reliability, even in challenging outdoor environments.

It has been developed to meet the increasing demands of IoT, wireless, embedded, and instrumentation markets. The enclosure can be configured for hand-held, tabletop, wall, or pole-mounted applications, making it suitable for diverse fields such as security, measurement, and communication technology.

“With BoVersa, we are taking into account the growing requirements of users and expanding our portfolio in a targeted manner. We offer a holistic solution for numerous applications, developed on the basis of current market needs,” says Andreas Krömer, Head of Development at BOPLA.

A unique three-part enclosure structure—comprising a lower part, functional lid, and design cover—offers designers unprecedented flexibility. These components can be combined in various colours, with options for transparent or translucent lids, enabling lighting effects, visibility of displays, or a clean, closed design.

Optimised for wireless & cooling & harsh environments.
For wireless systems, BoVersa integrates a die-cast aluminium body with cooling fins combined with a plastic cover. This ensures both unhindered radio transmission and efficient thermal management, essential for electronics with high power density. The point-symmetrical fin design guarantees uniform airflow in both vertical and horizontal mounting positions. This maximises cooling efficiency, stabilises internal temperature distribution, and extends the service life of sensitive electronics.

The robust construction makes it suitable for outdoor deployment. With protection class up to IP66 / IP68 (1.2m for 2h, DIN EN 60529) and use of PC UL 94 V0 material, the enclosure withstands environmental stresses while ensuring safety and durability. Integrated options include a pressure equalisation diaphragm and direct mounting tabs.

Key Features of BoVersa:

• Transparent or translucent functional lids for displays and lighting effects
• Wide range of colour combinations for custom branding
• Open or closed versions for keyboards, displays, or seamless designs
• Hidden screws and optional die-cast aluminium covers for added stability
• Optional pole attachment accessory
• Integrated receptacle for pressure equalisation diaphragm
• Enhanced cooling fins with symmetrical airflow design

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Innovative enclosure design for wireless, embedded and instrumentation systems.

The innovative and advanced BoVersa enclosure concept from specialist manufacturer BOPLA offers customers an innovative modern design suitable for a wide range of applications. Flexible and customer-specific design options include a lighting concept, wireless communication and maximised cooling technology.

The new enclosure can be used for applications which require hand-held, tabletop, wall or pole mounting. The enclosure offers optimal conditions for instrumentation, security systems, IoT, wireless, embedded systems and more.

For wireless systems a die-cast aluminium enclosure body with moulded-in cooling fins can be combined with a plastic cover, allowing unhindered radio transmission while providing an optimal combination for wireless applications that require cooling.

For efficient heat dissipation, BoVersa has integrated cooling fins into the die-cast aluminium enclosure. The point-symmetrical design of the fins optimises airflow and ensures cooling of the enclosure when mounted horizontally or vertically. The uniform airflow maximises the efficiency of cooling and provides even and stable temperature distribution in the enclosure, increasing the service life and reliability of the built-in electronics.

BoVersa has a three-part enclosure structure consisting of a lower part, a functional lid and design cover which can be combined with each other as required. Colour accents can be added by combining enclosure parts in different colours to suit an application or branding requirement.

Key features of the new BoVersa enclosure system from BOPLA include:

• A transparent function lid providing a view inside the enclosure or built-in displays. The enclosure parts can be combined in different colours. 
• The transparent and translucent functional lids can also be used to set lighting design accents.
• Open version for integration of keyboards and displays or closed version for a clean look and individual designs.
• The closed design cover can change the appearance of the enclosure almost indefinitely through individual processing. No visible enclosure screws.
• The frame-shaped design cover is perfect for integrating keyboards and displays, while the closed version allows for a clean look or custom designs.
  - For applications with special mechanical stability requirements, a cover made of die-cast aluminium is also available - the cover screws are concealed under covers.
• The combination of high protection class and material properties enable use in outdoor areas. Plastic material PC UL 94 V0 is suitable for outdoor use, environmental protection to IP66 / 68 (1.2m - 2h) DIN EN 60529 
• A pole attachment is available as an optional accessory.
  - Mounting tabs are directly moulded on the aluminium lower part and can be retrofitted separately on the plastic lower part.
  - The lower part has a moulded-in receptacle for a pressure equalisation diaphragm that can be "activated" at the factory.
• The point-symmetrical design of the cooling fins allows for optimal airflow in horizontal and vertical mounting positions.

Equipment designers can create a bespoke enclosure solution by selecting the required components from the wide range of standard options.

BOPLA can offer customers full box-build services such as:

• Mechanical processing
• Print on
• Engrave
• Lacquer finishing
• Full assembly, including automated PCB pick and place
• Custom colours
• Custom design sample service.

"With BoVersa we are taking into account the growing requirements of users and expanding the portfolio in a targeted manner. We offer a holistic solution for numerous areas that we have developed on the basis of current market requirements," says Andreas Krömer, Head of Development at BOPLA.

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