Exceptional electronics Distributor in Europe.

The 2024 Full Service Distributor of the Year and 2024 Semiconductor Distributor of the Year awards are a testament to the outstanding partnership between TTI Europe and Vishay, which has resulted in the delivery of top-tier products and services to customers.

Philippe Masson, Senior Director Sales Distribution EMEA (Vishay), Felix Corbett, Director Supplier Marketing (TTI), Annika Schneider, Key Account Manager Sales Distribution (Vishay), Markus Walz,Business Development Manager & Jörg Frödl - Director Product Marketing Europe (TTI)

“TTI Europe’s dedication to providing comprehensive services across our entire portfolio, including semiconductors and passives, has significantly enhanced accessibility and competitiveness,” says Philippe Masson, Senior Director of Sales Distribution at Vishay. “We sincerely thank the entire TTI Europe team for its exceptional support and are thrilled to present them with the 2024 Full Service Distributor of the Year award.”

“Furthermore, TTI Europe’s outstanding achievements in distributing our MOSFETs, diodes, and optoelectronics have been remarkable,” continues Masson. “Their expertise and dedication have greatly contributed to our success, and we are proud to honour them with the 2024 Semiconductor Distributor of the Year award.”

“It is a great honour to receive these two important awards from Vishay,” says Felix Corbett, Director Supplier Marketing Passives & Discretes, TTI IP&E Europe. “The awards recognise the close collaboration and engagement between our two companies in providing best-in-class products and services to our customers.”

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@ttiinc @VishayIndust @Publitek #Electronics #Europe

Best new product promoter.

Mouser Electronics has been named the Best New Product Promoter for 2024 by Diotec Semiconductor, the leading manufacturer of diodes, transistors, MOSFETs, and voltage regulators for automotive-, commercial- and industrial-grade applications. Mouser was awarded this accolade for significant growth in buyers, lines and part counts.

"We are very pleased to present Mouser with the Best New Product Promoter award," said Dr. Saverio Barboni, chief marketing and sales officer of Diotec Semiconductor. "Mouser's distribution is a key part of our channel strategy, and we look forward to many more years of successful collaboration."

"We are delighted to win this prestigious award from Diotec Semiconductor," said Kristin Schuetter, Mouser Senior Vice President of Products. "We greatly value our business partnership with Diotec and look forward to continuing to provide their products to design engineers and purchasing professionals around the world."

After signing a global distribution agreement with Diotec in 2022, Mouser Electronics received their Top Sales Partner Award for the same year. Mouser also received Diotec's Best Distributor Award for 2023. With over 5,000 Diotec parts available to order, Mouser offers an ever-widening selection of the newest solutions from the manufacturer, constantly adding new products to meet customers' needs.

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@MouserElecEU  @DiotecSemi @Publitek #Electronics #PAuto

Innovation award in nanoelectronics and digital technology.

Johny Srouji, Apple’s senior vice president of hardware technologies, is to receive the 2025 imec Innovation Award*. The award recognises Srouji’s pivotal role in shaping Apple’s technology roadmap through his leadership in the development of Apple silicon. In doing so, he has not only redefined Apple’s products, but has also had a major impact on the broader semiconductor ecosystem, spurring the advancement of chip technology that elevates features, experiences, and AI to new heights. Johny Srouji will receive the imec Innovation Award at the ITF World conference in Antwerp (b) next May.

Since joining Apple in 2008 to lead the development of the A4 chip – the company’s first in-house designed system on a chip (SoC) – Johny Srouji has built and led a world-class team of engineers driving innovation across Apple’s hardware technologies. Their work has fueled major advancements in Apple silicon, batteries, cameras, storage controllers, sensors, displays, and other critical components that define Apple’s product lineup.

After consistently leading the smartphone market with SoC designs prioritizing performance per watt, Srouji and his team brought their scalable architecture to the Mac, offering faster performance, enhanced capabilities, and category-leading battery life. Earlier this year, Apple launched C1, its first ever cellular modem system delivering excellent 5G and satellite connectivity while being far more energy efficient. Across all these innovations and more, the discipline to create and maintain a scalable architecture has yielded enormous benefits, and Apple’s chip designs are driving new strategies in the industry.

“As artificial intelligence integrates into nearly every aspect of modern technology – from personal planning tools to digital assistants – the demand for high-performance, energy-efficient and battery-powered hardware such as smartphones, tablets, laptops and smartwatches has never been greater. Meeting this demand requires advanced semiconductor technologies and architectures that deliver superior performance while minimizing power consumption. Johny’s vision in leveraging deeply scaled semiconductor technology to achieve this is driving the next wave of chip architectures that will revolutionize consumer electronics and edge computing. For these contributions, Johny Srouji is a deserving recipient of this year’s Innovation Award,” said Luc Van den hove, CEO of imec. “It is a great honor to be recognized by imec and receive its most prestigious Innovation Award, which I humbly share with my colleagues at Apple,” said Johny Srouji. "Our goal is always to create differentiated technologies to enable the world’s best products. Creating and incorporating bleeding-edge advancements while maintaining our intense focus on power efficient performance, we look forward to solving hard problems and unlocking new possibilities through our continued partnership with imec and collaboration across the industry."

Before joining Apple, Johny Srouji held senior positions at Intel and IBM, where he contributed to processor development and design.

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*Since its launch in 2016, the imec Innovation Award has become a prestigious recognition for pioneers in the semiconductor industry. 

@imec_int @Apple @MarcomWittig #AI #Automation #Computers

Changes at semiconductor leader company.

It has been announced that Richard C. Puccio, Jr. is to join Analog Devices as Executive Vice President and Chief Financial Officer . In this role he will set ADI’s financial strategy and lead the company’s global finance operations. He will report to CEO and Chair Vincent Roche.

Richard Puccio

“Rich brings tremendous experience and capability from his more than three decades of leading financial advisory and high-growth business operations activities in complex technology sectors, and this makes him a great addition to ADI’s leadership team. We welcome Rich’s sharp business acumen to enable ADI to accelerate the effectiveness of our operations in a world of increasing opportunity and complexity,” said Vincent Roche, ADI’s CEO and Chair. “I would also like to thank Jim Mollica for his partnership and contribution as interim CFO, and I look forward to Jim’s continued leadership in ADI’s finance organization,” continued Mr. Roche.

Mr. Puccio joins ADI from Amazon Web Services (AWS), the leading global cloud and technology services provider, where he served as CFO. In his role at AWS, Mr. Puccio partnered closely with the business to manage more than 200 fully featured services, including compute, storage, databases, robotics, machine learning and artificial intelligence (AI), Internet of Things (IoT), mobile, and security, among many other technologies. Prior to his role at AWS, Mr. Puccio was at PricewaterhouseCoopers (PwC) for nearly 29 years, where he served as a partner for over two decades. During his tenure at PwC, Mr. Puccio primarily served clients in the global technology, semiconductor, and semiconductor capital equipment industries.

“With its innovative spirit, amazing talent, and dedication to enriching lives and the world around us, ADI has exceptionally strong growth potential. I’m delighted to be joining ADI as the company’s new CFO and look forward to bringing my digital, software, and platform experience to the company as we play an increasingly important role in creating the Intelligent Edge and driving new levels of shareholder value,” said Mr. Puccio.

Mr. Puccio earned his AB in Economics from Harvard University and his MBA from Boston University.

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@ADI_News #PAuto #AI

Next generation semiconductor R&D and manufacturing facility.

Facility intended to help accelerate advances in cutting-edge applications, including digital biology, electric vehicles, and robotics. 

 

  Analog Devices has announced a new €630 million investment at its European regional headquarters in the Raheen Business Park in Limerick (IRL). The investment enables the construction of a new, state-of-the-art, 45,000 sq-ft Research & Development and manufacturing facility.

“Since 1976, Ireland has been a critical innovation centre for ADI, thanks to its strong academic and research organisations, business ecosystem, and progressive government leadership,” said ADI CEO and Chair Vincent Roche (right) “This next-generation semiconductor manufacturing facility and expanded R&D team will further extend ADI Limerick’s global influence. Through organic R&D and close collaboration with our customers and ecosystem partners, we are striving to solve some of the world’s greatest challenges and enable a more efficient, safer, and sustainable future.”

Taoiseach (Head of Government) Leo Varadkar TD said: “This is a really significant announcement for Limerick and the Mid-West region, which marks a new chapter in the longstanding relationship between ADI & Ireland. This massive investment is great news for local employment with lots of jobs being created during the construction phase, and 600 high-end graduate jobs. It means a signifi-cant expansion in the size and scale of ADI’s research, innovation, and devel-opment, leading to new, highly innovative products. This investment is further evidence of the Government’s commitment to bringing jobs to the region Most IDA jobs created in recent years have been outside of Dublin, and Limerick has done particularly well with its deep talent pool, universities, airport, and infrastructure. This investment will also mean lots of spin-off jobs and contracts for local SMEs and Irish-owned businesses. ADI’s investment is part of Ireland’s commitment to develop Important Projects of Common European Interest, IPCEIs, and will contribute to Europe’s broader micro-electronics sector. The future is digital. There can be no such future without microchips and it’s great that Ireland is such an important player in the supply chain.” Minister for Enterprise Trade & Employment Simon Coveney said: “This is a much welcome announcment from Analog Devices and a great vote of confidence in Limerick and the Mid-West. It’s also noteworthy that it’s the latest in a series of major job announcements outside of Dublin. I’m struck not only by the scale of the investment, but also the high quality positions that will result. I’ll be visiting Analog Devices in Boston during a trade mission this week where we’ll be looking forward to many more years of doing business in Ireland.” IDA Ireland CEO Michael Lohan said: “The technology that ADI will develop at this facility in Limerick is at the very forefront of innovation and has the potential to revolutionise the lives of billions of people across the world. This investment by ADI is intended to strengthen our supply chain resilience for advanced semi-conductor processes. We wish continued success to ADI and look forward to our continued partnership. This is a transformational investment for the Limerick site, for the Mid-West region, and for the semiconductor industry in Ireland. IDA Ireland is committed to supporting investments of scale that impact positively on Europe’s semiconductor industry.”

The new facility is to support ADI’s development of next-generation signal processing innovations designed to accelerate the digital transformation of Industrial, Automotive, Healthcare, and other sectors. It is expected to triple ADI’s European wafer production capacity and aligns with the company’s goal of doubling its internal manufacturing capacity to enhance the resiliency of its global supply chain and better serve customer needs. This investment is expected to grow ADI’s employment footprint in the mid-west region of Ireland by 600 new positions, a significant increase to ADI’s current 1,500 employees in Ireland and 3,100 employees in Europe as a whole.

Today’s announcement comes a year after ADI announced a separate investment of €100 million in ADI Catalyst, its 100,000 sq-ft custom-built facility for innovation and collaboration at its Limerick campus. Ireland is also home to ADI’s main European Research and Development Center, which has generated more than 1,000 patents since its inception and has seeded ADI R&D sites throughout Europe in Spain, Italy, UK, Romania, and Germany.

The new investment is planned as part of a collaboration within the European Union’s Important Projects of Common European Interest on Microelectronics and Communication Technologies (IPCEI ME/CT) initiative, and will support cross-border collaborative research. ADI’s IPCEI application – Ireland’s first since the inception of the Important Projects of Common European Interest (IPCEI) initiative – is subject to final approval from the European Commission, and is supported by the Irish Government through IDA Ireland.

@ADI_News @DeptEnterprise @merrionstreet @IDAIRELAND #Electronics #Automation

Chip verified for WiFi.

Anritsu Corporation and MediaTek have successfully verified the performance and functions of MediaTek’s Filogic chip for IEEE802.11be wireless LAN (WLAN) by testing RF characteristics with the network mode.

Takeshi Shima, Director, Senior Vice President, Test & Measurement Company President at Anritsu stated, “The synergy between Anritsu’s leading-edge test solutions and MediaTek’s leading wireless technology creates a new user experience leading to developments in a wide range of businesses, including IoT, automotive, smartphones, etc., supporting a secure, safe and rich global society.”

The IEEE802.11be (Wi-Fi 7) wireless communication standard being developed by the Institute of Electrical and Electronics Engineers is the successor to the IEEE802.11ax¹ (Wi-Fi 6/6E) WLAN standard. The new standard is proposed to achieve a transmission speed of 30 Gbps or more, which is much faster than Wi-Fi 6/6E. In addition to extending conventional technologies, including 4096 QAM, 320 MHz channel bandwidth, and Multi-RU, it also adopts new technologies such as Multi-Link Operation² (MLO) enabling a device to simultaneously send and receive data across different frequency bands and channels.

Development of IEEE802.11be is expected to be completed in 2024 and devices using chips based on the draft standard are already appearing to support the latest applications and services, such as ultra-high-definition video streaming and AR/VR.

The network mode emulates real operation to evaluate RF characteristics. Its uses the data link layer communication protocol implemented in both the chip and tester to establish communication. In addition to evaluating RF characteristics using conducted tests, the network mode is especially useful for Over-The-Air³ (OTA) wireless performance tests – including antenna characteristics – of finished products.

MediaTek has released its Filogic 880 and Filogic 380 with world-leading high performance, low power, and high reliability for Wi-Fi 7 platforms. Due to the seamless, stable, high connectivity of MediaTek’s chips, their RF characteristics were evaluated jointly under actual operating conditions by using Anritsu’s network mode technology to establish and maintain the wireless communications. This evaluation of IEEE 802.11be RF characteristics with the network mode marks a world-first in wireless testing.

With support for both conducted and OTA network-mode connectivity tests, Anritsu’s WLAN tester will help assure the success of products using MediaTek’s IEEE802.11be chip. Alan Hsu, corporate vice president and general manager of the Intelligent Connectivity business at MediaTek, stated, “Our collaboration with Anritsu helps further our mission of bringing the most advanced wireless connectivity technologies to market, and represents MediaTek’s commitment to meet the industry’s growing demands for fast, reliable, and always-on connected experiences with MediaTek’s Filogic solution inside.”

Anritsu continues to develop advanced test solutions assuring successful deployment of future WLAN products.

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Technical Terms
¹ IEEE 802.11ax Wireless LAN standard defined by IEEE supporting theoretical maximum speeds up to 9.61 Gbps.
² Multi-link Operation (MLO) Technology enabling one device to simultaneously send and receive data across different frequency bands and channels.
³ Over-The-Air (OTA) Tests Tests for accurately evaluating wireless device reliability, efficiency, and performance by sending/receiving over-the-air radio waves. This is especially useful for comprehensively evaluating the wireless communications performance of equipment including antennas.

@Anritsu @AnritsuEMEA @NapierPR @MediaTek #Standards #WiFi #WLan

Pure & ultrapure water analysis.

A new compact version of its Swan Analytical's AMI LineTOC monitor for pure and ultrapure water applications has been launched.

“This new instrument is simple to install and run; fully compliant with industry standards, and suitable for the continuous monitoring of medical water for injection and pure water in pharmaceutical and related industries, as well as ultrapure water in the semiconductor industry,” explains Sales Manager for Britain, John Saxton. “The new compact version retains a user-friendly design which allows easy access to system components, in a format that lends itself to installations in common mounting spaces on water purification or distribution skids.”

The AMI LineTOC Compact Version provides reagent-free measurement of total organic carbon (TOC) by UV oxidation and differential conductivity detection. With a fast response time of under two minutes, the device offers a wide measurement range from 0 to 1000 ppb with a resolution of 0.01 ppb in its lowest range.

Organic contaminants in pure and ultrapure water represent a significant threat to product quality and process efficiency in a wide variety of industries. If undetected, organic contaminants can also encourage the growth of microorganisms. In the semiconductor industry, organic contamination causes defects in sensitive photolithographic processes which damage wafers and reduce yield. In the pharmaceutical industry, the effects of organic contamination can range from troublesome to potentially lethal defects.

TOC derived from organics is frequently the largest source of contamination in UPW systems. Contamination may result from sources present in the supply water and not removed by the purification process. However, contamination may also arise from within the high purity water system itself. Sources include piping, filters, adhesives, process gases, ion-exchange resins and thermoplastic breakdown products created during sterilisation procedures. Continuous monitoring and a fast response time are therefore essential – to monitor trends and raise alarms.

Compliance is assured by the AMI LineTOC Compact with a fully integrated and automatic system suitability test (SST) according to USP <643> and Ph. Eur 2.2.44. An optional validation package is also available for hassle-free instrument qualification during commissioning. In addition, the instrument’s firmware provides access protection and an audit trail with event logging.

Summarising John says: “Working closely with customers, we developed the AMI LineTOC Compact Version to meet their specific needs. For example, an on-board pump stabilises flow and minimises the potential for sample contamination, so that the instrument is not reliant on sample flow rate. In addition, with a built-in cooler, hot samples can be handled with ease.

“Other small but important features include simple access to grab samples, and an optional removeable stainless-steel cover. However, the most important deliverables from the AMI LineTOC Compact Version are reliable regulatory compliance from an instrument that is simple to install, operate, calibrate, and maintain, which means that users can protect water quality and minimise operational costs.”

@_Enviro_News @swan_usa #PAuto #Water

Semiconductor leader appoints new chief.

Haviv Ilan is to be the next president and chief executive officer (CEO) of Texas Instruments. A 24-year veteran of TI, Haviv succeeds current president and CEO, Rich Templeton, who will remain chairman of the board.

Haviv Ilan

“Haviv is an inspiring leader who is widely respected amongst our customers, employees and shareholders,” Rich said. “He has a proven track record of delivering results, an intense focus on innovation and a passion to win, all of which make him an exceptional leader. The board and I are confident that Haviv is the right person to serve as TI’s next CEO and further strengthen the company for the long term.”

The transition is a well-planned succession that follows Haviv’s promotion to senior vice president in 2014, executive vice president and chief operating officer in 2020, and election to the board of directors in 2021.

Haviv has served in a variety of senior management roles at TI, including leading businesses in both analog and embedded processing. He joined TI in 1999 through the acquisition of Butterfly, a wireless start-up company in Israel. Haviv earned bachelor’s and master’s degrees in electrical engineering from Tel Aviv University. He also earned a Master of Business Administration from the Joint International Executive MBA Program at Northwestern University’s Kellogg School of Management and Tel Aviv University’s Leon Recanati Graduate School of Business Administration.

“I am honored to lead TI during this amazing time for our company and our industry,” said Haviv. “The combination of our broad portfolio of products, strong foundation of manufacturing and technology, reach of market channels and diverse and long-lived positions all put TI in a unique class of companies. Our ambitions and values will continue to be integral to how we build TI stronger and when we are successful, our employees, customers, communities and shareholders all benefit.”

"I have had the privilege of working closely with Rich throughout my time at TI. He’s transformed the company into what it is today, and he’s led with an unwavering commitment to TI and our people,” said Haviv. “I look forward to continuing to work with him as chairman.”

During his nearly two decades leading the company, Rich helped define and execute TI’s strategy to focus on semiconductors for signal processing and guided the company during this transformation. His strategic actions included the acquisition of National Semiconductor and the successful wind down of the company’s wireless operations, which led TI to become a global leader in analog and embedded processing. Rich directed the company’s strategic investments to strengthen research and development, expand manufacturing and build closer direct customer relationships. Under his leadership, TI emerged stronger, with better technological and product positions.

“TI’s strategy, operations and financial discipline set the company apart from others in the industry. The company is well-positioned for growth thanks to Rich’s vision and leadership during his 18-year tenure as CEO. Rich transformed the company by reshaping the focus to analog and embedded processing,” said Pam Patsley, lead director of the TI board and chair of the compensation committee. “He leaves an incredible legacy at TI and across the industry, and we look forward to continuing to benefit from his leadership and insights as executive chairman.”

In addition to his leadership of TI, Rich has carried forward the TI legacy of giving back that began with the founders. He has a passion for building strong communities and has been an advocate for STEM education and a champion of research and innovation. "This philanthropic spirit has inspired TIers around the globe to make the company one we’re personally proud to be a part of and that we would want as our neighbor."

@TXInstruments #Electronics

Powering semiconductor automatic optical inspection.

Facing Automated Optical Inspection (AOI) applications relating to, and caused by the shortcomings of consumer DRAM.

The recent launch of Innodisk AI provides a complete AI solution for industrial integrators, DDR5 series DRAM plays a key role for a variety of applications, including Automated Optical Inspection solutions. With the rise in demand for semiconductors, and the trend towards smaller and smaller processes, the need for automatic systems to detect semiconductor production defects has grown significantly. AOI systems are now used at every step of the semiconductor manufacturing process, and their stability is paramount to production efficiency.

Modern AOI systems face three core issues that Innodisk’s DDR5 RDIMM (registered memory) help to solve: memory bandwidth, accuracy, and high temperatures.

Memory Bandwidth.
Due to the high memory bandwidth needed for training models, AOI systems often struggle when lower capacity modules are used. Innodisk’s DDR5 RDIMM solves this issue with large capacities, including 32GB and 64GB modules.

Accuracy.
Due to semiconductor processes going down to the nanometer level, the resolution requirement and accuracy requirements for AOI systems has increased. Innodisk’s DDR5 RDIMM features a new dual 40-bit sub-channel architecture, and supports rigorous side-band ECC, which can handle AOI’s high-accuracy detection demands.

High Temperatures.
The high-speed and high-precision inspection that AOI systems provide generates high amounts of heat at the DRAM level, and this can cause overall system temperatures to rise sharply. Innodisk’s DDR5 RDIMM solves these heat concerns via a two-pronged strategy, involving an integration of both hardware and software. Two thermal sensors on the modules detect ambient temperatures, and two software tools: iCAP (Innodisk Cloud Administration Platform), and iSMART monitor temperatures and send warning messages.

Although memory technology is constantly being updated, Innodisk’s observation of the industry's current situation shows that customers' demands for new technologies vary greatly.

@Innodisk_Corp @mepaxIntPR #PAuto #Manufacturing

Moisture in semiconductor sector.

Next generation in moisture analysis to meet all the moisture monitoring needs of the semiconductor industry

With trace-level moisture analysis and next generation reliability, the Servomex SERVOPRO DF-700 Series delivers accurate Tunable Diode Laser moisture measurements trusted by UHP gas producers globally, with industry-leading lower detection limits. It now introduces an all-digital gas analysis platform, with a bigger screen and increased functionality, more reliable filter, and a solid-state storage drive that offers ultimate reliability. Inside the more efficient design there are fewer components which provides more room as and when services are required, with an improved assembly.

The result is a more reliable product, preventing downtime and reducing service time as well as costs.

Mike Proctor, Business Unit Director – Purity & Speciality Gases, said: “Our SERVOPRO DF-700 Series of analyzers is well-known for its industry-leading performance in trace and ultra-trace moisture measurement.
“We’ve designed the latest version with dependability in mind, ensuring rock-solid reliability without compromising its sensing capabilities.
“Using non-contact Tunable Diode Laser sensor technology, it delivers the lowest available lower detection limits for moisture in UHP gases. The result is a next-generation analyzer that meets all the moisture monitoring needs of the semiconductor industry, with reliability built-in.
“Get proven, superior performance, combined with the confidence of a system ready to face future challenges for years to come.”

Several models are available, to ensure the optimum moisture measurement solution for a variety of UHP gas analysis applications. Each has low lifetime maintenance requirements and zero-drift stability, greatly extending calibration intervals.

Photonics and microelectronic device packaging.

Palomar Technologies are offering a webinar achieving die bonding flexibility for the next-generation of photonics packaging currently in development. (28th Apl 2021)

Much of the semiconductor packaging industry is engaged in an exciting and growing photonics ecosystem. Anticipating a seven percent CAGR over the next five years, this clearly outpaces most other manufacturing sectors. The associated challenges of photonics packaging, specifically relating to optical transceivers, include meeting anticipated performance gains while squeezing large package functionality into smaller, more thermally efficient footprints.

Palomar Technologies’ 3880 Die Bonder provides the flexibility and versatility to handle the many challenges present in both the current and next generation of photonics packaging. Not only is the 3880 capable of a diverse range of processes from epoxy dispense, to UV snap cure, to eutectic die attach, but can scale with production volume for low volume process development to full-scale high volume production. 

In this webinar, Kyle Schaefer, Palomar Product Marketing Manager reviews the challenges of photonics packaging and visits Live with Martyn Davies, New Business Development from Palomar Technologies UK, at the Palomar Demo Lab in the EPIC Center in Paignton (GB).  Martyn will provide a live overview of the Palomar 3880 capabilities for photonics packaging.

@PalomarTech #PAuto #Packaging 

Suppliers honoured.

Analog Devices (ADI) recently hosted its inaugural Supplier Day event to honour and recognise its suppliers. Held in Boston (MASS USA), the event brought together 100 of the semiconductor company’s top suppliers for a day of recognition, celebration and relationship building. A total of 18 awards were presented for outstanding performance and contributions.

National Instruments CEO Alex Davern (centre) accepts the Supplier of the Year Award from John Hassett (right), Senior Vice President Global Operations and Technology at Analog Devices. Also in pic is Kevin Bisking, Global Account Manager for NI.

The first event of its size and scope for ADI, Supplier Day 2019 was hosted by John Hassett, Senior Vice President Global Operations and Technology at ADI, alongside key leaders from the Global Operations and Technology group. In his opening address, Hassett shared ADI’s business strategy and its impact on the supply chain, and discussed the challenges the company faces as it continues to strengthen its core business while extending its value.

“Each of our suppliers plays a critical role in ADI’s overall strategy by offering differentiated, reliable and cost-effective solutions,” said Hassett. “This year we’ve recognised a number of our supplier partners, who have individually and collectively done a tremendous job of enabling ADI’s strategic objectives and providing outstanding support to our team as we compete, thrive and grow as a solutions company to stay ahead of what’s possible.”

The awards recognised excellence across five categories, including Quality, Delivery, Service/Responsiveness, New Product Time to Revenue and Corporate Social Responsibility. National Instruments Corp. was awarded Supplier of the Year for its exceptional performance in the development and delivery of innovative test equipment and solutions, supporting test for many of ADI’s existing and emerging product requirements.

The Awardees:

Supplier of the Year
National Instruments Corp.

Top Performer Contracted Manufacturing – Front End
Taiwan Semiconductor Manufacturing Co., Ltd.

Top Performer Contracted Manufacturing – Back End
Advanced Semiconductor Engineering, Inc.

Top Performer Equipment & Services – Front End
Evatec AG

Top Performer Equipment & Services – Back End
National Instruments Corp.

Top Performer Materials – Front End
GlobalWafers Singapore Pte. Ltd.

Top Performer Materials – Back End
C-Pak Pte Ltd.

Outstanding Support for ADI/LTC Integration
United Test & Assembly Center, Ltd.

Outstanding Support for ADI/LTC Integration
Vanguard International Semiconductor Corp.

Best in Quality – Established Supplier
Tokyo Electron, Ltd.

Best in Quality – Niche / Developing Supplier
Chipbond Technology Corp.

Best in Delivery – Established Supplier
Coilcraft, Inc.

Best in Delivery – Niche / Developing Supplier
ASTI Telford and Reel Service Group

Best in Service & Responsiveness – Established Supplier
ASM Pacific Technology, Ltd.

Best in Service & Responsiveness – Niche / Developing Supplier
Vanguard International Semiconductor Corp.

Best in New Product Support – Established Supplier
Photronics, Inc.

Best in New Product Support – Niche / Developing Supplier
Compass Technology, Inc.

Corporate Social Responsibility Award
Taiwan Semiconductor Manufacturing Co., Ltd.

 @ADI_News #Semiconductors #USA

New premises for semiconductor-based technology solutions leader.

Analog Devices has opened the doors of its new British headquarters office in Hayes, London, a location which will strengthen its ability to connect customers with the best engineering talent at home and abroad.

By locating its new office in London, close to a fast Elizabeth Line link to the city centre, Analog Devices has made itself accessible to the capital’s huge pool of talent - not only software and hardware engineers, but also a vibrant community of entrepreneurs and start-up workers, as well as skilled staff in non-engineering disciplines.

Close to Heathrow airport, the new HQ office is also a convenient hub for the company’s domain specialists located in other Analog Devices locations such as Munich, Germany, Boston, US and Limerick, Ireland. These technology and applications experts will now more easily be able to take part in British customer meetings hosted by Analog Devices.

The new office, which has a distinctly contemporary look in contrast to the bland aesthetic commonly adopted by many engineering companies, underpins Analog Devices’ ambitious plans for growth in the territory: it easily accommodates all the staff who previously worked at Analog Devices and legacy Linear Technology offices in Weybridge and Marlow, with a generous additional floating capacity to accommodate customer meetings, visits by field engineers, training facilities and an expanding staff headcount.

The site of the new office used to be a vinyl record factory at which discs from the likes of the Beatles and Rolling Stones were once pressed - a link to Britain’s long audio engineering heritage which is mirrored in the decoration of the new office. Mike Britchfield, Analog Devices’ European Vice President of Sales, said: ‘Our new UK office beautifully combines the past and the future - the site’s history as a record factory is appropriate given our many customers in the UK’s renowned audio equipment manufacturing industry. But we are also excited to be at the heart of London’s newest technology cluster, which gives us the opportunity to build our diverse, creative and talented workforce.’

The development of the new office and the transfer of staff from the previous Marlow and Weybridge sites has been masterminded by Alastair Boyd, Sales Director for Northern Europe and Shalini Palmer, EMEA Sales Director for Mobility. Alastair said that he was proud that Analog Devices, a global giant of the semiconductor industry, has committed to a large long-term investment in the that country's electronics sector. Shalini said: ‘The UK is a hub of innovation and knowledge with many world-class companies in specific technology domains - the market is large, but fragmented. That means you have to have a prominent and enduring presence in the country if you are going to be successful here. This beautiful and impressive new office is a signal to the UK market that Analog Devices is in the UK for the long term and committed to providing all the technology and applications support that British customers need.’ 

@ADI_News #Electronics #Britain

Selecting semiconductors!

A new Discrete Semiconductor Selection Guide has been released by Anglia, guiding customers through the vast range of industry standard discrete devices available. The interactive guide is Internet-linked – each product category has an associated Website Data Reference which takes customers straight to the associated page on Anglia Live.

David Pearson, Technical Director of Anglia commented at the launch, “We have expanded our range of discrete semiconductors and it is now more extensive than ever before. We’ve created this guide to show the breadth of product now available and to help customers locate the right part for their design quickly and easily, and then take them straight to the website for comprehensive data and to order samples. This is the latest in a series of Guides published by Anglia to support customers designing with our products.”

Published in PDF and paper form, the Guide lists all the industry standard discrete and small signal semiconductors available from Anglia and the leading manufacturers it represents. It provides a quick and easy to use overview of the extensive range of industry standard part numbers from the wide variety of manufacturers available from Anglia. Products covered include small signal diodes, standard rectifier diodes, Zener diodes, Schottky diodes, fast recovery diodes, bridge rectifiers and transistors all available in a selection of industry standard packages to suit a wide range of designs.

Many of the devices included in the Guide are supported through Ezysample, a free online sampling service. Anglia has made many products including discrete semiconductors more accessible to design engineers working on prototypes with price breaks and smaller pack quantities to support customers in the design and prototype phases of a project.

The guide is designed to be used in conjunction with Anglia Live where customers can view all the options, brands, full data sheets, stock and pricing all in one place. Each page offers a Website Data Reference Code, which links direct to the relevant page on Anglia Live in the interactive PDF version of the Guide. Users of the print edition can simply enter this code into the search box on Anglia live.

@angliaLive #Electronics

Product Manager for industrial gas and semiconductor sectors.

Servomex, the world leader in gas analysis, has appointed Douglas Barth as Senior Global Product Manager, based at the US Technical Center (US TC).

Douglas Barth

Douglas will be responsible for Servomex US TC products in the industrial gas and semiconductor markets, using his extensive knowledge and experience in those sectors to assist customers worldwide with their complex application needs.

He will support the SERVOPRO MonoExact DF150E and MonoExact DF310E, as well as the newly released AquaXact 1688, and will be instrumental in the development and release of future industrial gas analyzer platforms like the SERVOPRO MultiExact 4100.

Speaking about his new role, Douglas said: “I’m ecstatic to join the Servomex team that has been the market leader for many years. We will continue to put the customer first, produce cutting edge technology, and build successful, long-standing global partnerships.”

Douglas joins Servomex from Pall Corporation, where he served as the Strategic Marketing Manager for the Microelectronics Group – Instrumentation Business. He also spent many years in the energy, pharmaceutical and industrial markets, working as an environmental scientist/engineer before transitioning to marketing and sales.

With a master’s degree in Environmental Sciences from The Ohio State University, Douglas’s areas of expertise include X-ray Fluorescence, Quantitative Aerosol Generation and Micro-electrical-mechanical Systems (MEMS).

He will report to, and work closely with, Servomex Sector Manager James Belanger, who said: “Douglas brings with him a wealth of application knowledge and experience which will directly benefit customers looking for the right solution for their process.

“This understanding will also help us to continue developing the right products to meet customer needs. We’re delighted to welcome him to the team, and wish him every success in his new role.”

 @Servomex  #Pauto 

Semiconductor Data Book!

The latest Diotec Semiconductor Data Book and Selection Guide is now available from Transonics plc.

The Diotec Data Book Edition 24 covers the full range of semiconductors available from Diotec and many new products including;

• Schottky Diodes with 150V reverse voltage withstand and up to 175°C junction temperature
• TVS Diodes having 3000W peak pulse power
• Axial Diodes offering 25A capability at up to 2000V
• Schottky Diodes in a Power SMD package rated at 5, 10 and 15A at up to 100V
• Superfast-Efficient Rectifier having rated at 1, 4 and 8A and up to 600V

Diotec Semiconductor AG is a specialist manufacturer of diodes and rectifiers with their HQ in Heitersheim, Germany and with additional manufacturing facilities in Europe, China and India. Applications for Diotec products include rectifiers in power supplies, diodes for signal processing and circuit protection devices; all critical components in modern electronic products.

The new Diotec semiconductor selection guide includes diodes and rectifiers, bridge rectifiers, diacs and HV-diodes, diodes and rectifiers in power packages and SMT mounting options, transistors and small signal diodes. The guide also includes a useful case cross-reference guide.

Daniel French, Managing Director of Transonics, comments, “Diotec is a high quality source for semiconductors and a very important franchise for Transonics. It forms a major part of our very wide component offering for the power conversion market which included microcontrollers, inductors and transformers, connectors and PCBs."

FAB growth!

The Fab Owners Association (FOA), the association of semiconductor device manufacturers and suppliers, has announced that its membership grew by 14% since the beginning of 2011 and now totals 74 members. 

The new members are device-makers Globalfoundries and LFoundry GMBH.  New associate members include Macquarie Electronics USA, M&W U.S., Inc, RED Equipment Pte Ltd., SigmaTech, Inc., Mattson Technology, Inc., ePAK, Rite Track and ASML.  With the addition of companies based in Europe and Asia, the FOA has further broadened its international scope.

L.T. Guttadauro, executive director of the FOA stated, “Device manufacturers continue to be attracted by the opportunity to share common goals in an unbiased setting. Through collaboration and tools like our manufacturing benchmark studies, working groups and aggregate purchasing programs, members are better prepared to predict demand, product cycles and material requirements.  Associate members are attracted by the growing marketing opportunities presented through their membership.”

The FOA’s device-maker members are: Anadigics Inc., Atmel Corporation, Austriamicrosystems AG, Avago Technologies, Fairchild Semiconductor, Freescale Semiconductor, GLOBALFOUNDRIES, Infineon Technologies AG, International Rectifier, Intersil Corporation, Jazz Semiconductor, LFoundry GmbH, Micrel Semiconductor, Microchip Technology, ON Semiconductor, Philips Lumileds, Skyworks Solutions, Spansion LLC, SVTC Technologies, Telefunken Semiconductor, TriQuint Semiconductor, and X-FAB Texas.

They represent approximately 1.6 million eight-inch- equivalent monthly wafer starts and approximately US$30 Billion in annual revenues.