Expanded Beam Optical (EBO) connector.

Advances ultra-dense, eye-safe optical interconnects for next-generation Ai data Centres.

The VersaBeam Mini, an ultra-compact, 16-fiber Expanded Beam Optical (EBO) connector that solves critical space, thermal and maintenance challenges in high-density Ai and hyperscale networks has been introduced by Molex. Building on the award-winning Molex VersaBeam EBO interconnect family, VersaBeam Mini combines expanded beam performance with a Very Small Form Factor (VSFF) to deliver the density required for next-generation Ai data centres and networking without compromising serviceability, safety or network uptime.

“As optical densities per rack grow exponentially, network architects are hitting hard physical walls in both scale-up GPU clusters and scale-out network fabrics,” said Trevor Smith, general manager, Optical Connectivity, Molex. “With VersaBeam Mini, we are providing a ‘less is more’ solution that pairs a VSFF footprint with zero-touch EBO technology, delivering less contamination risk, reduced downtime and a smaller blast radius without needing specialised technical expertise.”

Architectural agility and operational flexibility.
Designed for space-constrained co-packaged optics (CPO), optical backbones and front-panel switch applications, VersaBeam Mini packs 16 fibers into an ultra-compact 3.5 x 9 mm footprint. This precise form factor delivers a 3x density improvement over VersaBeam 16 connectivity, letting network architects scale up to 3,456 fibers in a standard 1RU panel. By maximising front-panel real estate while simplifying internal routing, VersaBeam Mini effectively addresses the ultimate bottlenecks in Ai data centre hardware—physical space on the panel and inside the chassis. In addition, support for 16-fiber granularity results in a 9x reduction in blast radius. This empowers technicians to isolate, re-route or hot-swap specific 16-channel lanes.

Additionally, an optional mass-insertion capability allows technicians to engage up to 9 VersaBeam Mini connectors (144 fibers total) with a single push. This unique feature accelerates turn-up speed during initial rack deployment, while preserving granular 16-channel serviceability later on. Molex maintains full 1RU packing density, enabling a modular approach to scaling and servicing ports without operational trade-offs.

VersaBeam Mini streamlines optical assembly for switch OEMs while removing operational hazards for field technicians. Leveraging the groove-based design of the 3M™ EBO Ferrule, VersaBeam Mini eliminates the need for guide pins and holes. This facilitates the use of high-speed robotic pick-and-place equipment to boost factory throughput during cable assembly. The need for fewer parts also translates into streamlined supply chain management and an overall reduction in bill of materials (BOM) costs.

Since its launch in 2025, the Molex VersaBeam EBO portfolio has been recognised for zero-touch EBO reliability, which expands the beam between connectors to reduce sensitivity to dust and debris. This dramatically lowers requirements for frequent cleaning and inspection, slashing deployment and maintenance overhead by up to 85% while enabling general technicians to service links without specialised optical equipment. Inherent laser eye safety helps protect field personnel from hazards during routine maintenance and system upgrades.

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@MolexConnectors @NapierPR #PAuto #Ai #DataCentres

Optimising thermal management strategy.

Molex has announced a strategic investment in CAEPlus, Inc., an early-stage company focused on the development of active liquid cooling technology designed to help data centres manage increasing heat loads driven by AI and High-Performance Computing (HPC) workloads. This investment advances Molex’s Data Center Thermal Management strategy by accelerating the innovation of CAEPlus’ BoundaryCool™ platform, a compact, active cooling architecture that addresses next gen GPU/ASIC thermal challenges.

“Advanced thermal management is becoming a critical enabler for the next wave of compute performance,” said Jairo Guerrero, VP and GM, Copper Solutions Business, Molex. “Our strategic investment in CAEPlus reflects Molex’s commitment to supporting innovations in liquid cooling while working with emerging technology leaders to help customers address rapidly evolving AI and compute-intensive data center requirements.”

The strategic collaboration will support continued advancements across the BoundaryCool platform, engineered to deliver significantly higher heat transfer performance and greater reductions in CPU/GPU/TPU chip temperatures compared to passive cold plate solutions while remaining compatible with legacy data centre architectures.

“CAEPlus was founded to address the rapid pace of change in data center cooling requirements by enabling an entirely new class of active liquid cooling solutions,” said Milad Bashirzadeh, founder and CEO, CAEPlus, Inc. “In addition to its investment, Molex brings deep engineering expertise and a strong track record of helping scale innovative technologies. We are excited to work together in advancing our proprietary cooling technology and meet unrelenting industry requirements for higher levels of performance and efficiency.”

The addition of CAEPlus technology to Molex’s comprehensive thermal management portfolio offers data centre customers a broader range of solutions engineered to address the most demanding computing requirements. As part of the agreement, Molex retains exclusive licensing to apply CAEPlus technology to the Molex portfolio of pluggable I/O solutions. 

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@MolexConnectors  @NapierPR #CAEPlus #PAuto

Interconnect platform.

Vertical and right-angle orientations optimise internal space utilisation, minimise cable strain and accommodate diverse layout requirements.

Molex has unveiled MiniMix Hybrid Power and Signal Connectors, a purpose-built interconnect platform designed to solve manufacturing and packaging challenges in next-generation humanoid robotics, autonomous mobile robots (AMRs) and advanced industrial automation systems. Combining 15.0A power and high-speed Ethernet communication within a single, ultra-compact interface, MiniMix streamlines installation in space-constrained joints, actuators and robotic mechanisms, reducing connector count, cabling complexity and assembly effort.

“Humanoid robot manufacturers are rapidly moving from prototype builds to commercial mass production, but traditional joint wiring methods create major manufacturing bottlenecks," said Brian Hauge, president and SVP, Consumer and Commercial Solutions, Molex. “MiniMix replaces tedious manual assembly with an integrated solution for power and signal transmission, freeing robotics designers to build sleeker, lighter and more responsive autonomous systems at scale.”

Overcoming manufacturing obstacles.
Integrating power and signal connectivity into increasingly compact joints, actuators and articulated mechanisms without sacrificing performance is a major hurdle for the robotics industry. Design engineers face severe space and assembly constraints in multi-axis articulated joints—such as wrists, elbows, knees, ankles and neck assemblies—where actuator motion systems must route high power and high-speed control data through extremely tight channels.

Traditional approaches using separate power and signal connectors are typically too bulky and heavy to fit in these confined spaces, forcing manufacturers to thread bare wires manually and hand-solder terminals during final assembly, which introduces potential failure points and slows production output.

The Molex MiniMix Hybrid Power and Signal Connectors resolve these manufacturing challenges by consolidating up to 15.0A power contacts and 1Gbps 1000BASE-T1 Ethernet communication into a single integrated interface. Featuring an ultra-compact 5.65mm routing profile, MiniMix is the industry’s smallest hybrid connector, requiring up to 50% less routing area than alternative options. This enables pre-terminated cable assemblies to pass smoothly through narrow internal actuator channels, articulated limbs, robotic joints and end-effectors.

Offered in vertical and right-angle mating orientations, the Molex MiniMix Hybrid Power and Signal Connectors can accommodate diverse layout requirements while optimising space utilisation and reducing cable strain. Furthermore, its robust, vibration-resistant mechanical design withstands continuous motion and constant flexing, ensuring reliable electrical performance and long-term durability across repeated movement cycles.

Purpose-built for next-gen robots.
The Molex MiniMix Hybrid Power and Signal Connectors offer wire-to-board connector and cable assembly solutions that are ideally suited for evolving robotic applications where space, weight and reliability are crucial. According to a 2026 supply chain analysis by McKinsey & Company, joint actuator systems represent 40% to 60% of a humanoid robot’s total bill of materials (BOM), intensifying requirements to optimise sub-assembly space and eliminate manual cabling labor. As robots scale to include approximately 50 articulated joint actuators, integrated connectivity solutions like the Molex MiniMix Hybrid Power and Signal Connectors will play a pivotal role in facilitating plug-and-play assembly, reducing harness weight and minimising potential failure points across next-generation humanoid robotic architectures.

Samples and functional evaluation assemblies of the Molex MiniMix Hybrid Power and Signal Connector family are available now for customer design-in and joint evaluation, with full commercial production scaling slated for late 2026. Molex connects humanoid robotic systems.

The MiniMix Hybrid Power and Signal Connectors are the latest Molex solution to meet the demands of next-gen robots, AMRs and advanced industrial automation systems. .

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@MolexConnectors @NapierPR #PAuto #Robotics

Fibre optic cable agreement.

Delivers increased supply chain optionality and resilience through diversified sourcing for fibre connectivity deployments.

Molex has announced a long-term supply agreement with Prysmian, the world’s largest cable solutions provider, to address the surging demand for fibre optic connectivity inside data centres. Fueled by rapid AI-driven data centre expansions, Prysmian will supply optical cables to Molex for a period of up to 10 years, ensuring increased supply capacity for customers building and expanding next-generation digital infrastructures. 

This agreement will extend production of optical cables and fibre in plants across the U.S., including the glass preform stage, doubling Prysmian’s domestic fibre capacity, and is expected to result in over 1,000 jobs created by Prysmian worldwide, including 600 jobs across U.S. manufacturing sites.This investment is a key part of Molex’s U.S. expansion and represents one pillar of the company’s broader global strategy to scale fibre cable supply.

“We’re excited about this long-term agreement with Prysmian because it enables us to better support our mutual customers,” said Joe Nelligan, CEO of Molex. “For Molex, this represents a strategic expansion in the U.S., bringing increased capacity to support the growing demand for data centre solutions with the quality and reliability our customers expect.”

Increased access to expanded fibre-optic cable capacity helps hyperscalers and data centre architects secure a reliable supply through Molex, supporting continuity as market conditions change. By pairing Molex’s data centre connectivity expertise with Prysmian’s manufacturing scale and technology leadership, both organizations are uniquely positioned to help customers reduce risk, improve lead-time reliability and support long-term planning for critical deployments.

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@MolexConnectors @Prysmian_ @NapierPR #PAuto #USA #DataCentre

Fibre to chip connectivity specialist company acquired.

The acquisition of Teramount Ltd., the developer of detachable fiber to chip connectivity solutions optimised for high volume Co Packaged Optics (CPO) and other silicon photonics applications, has been completed by Molex.

“Teramount’s passive, detachable coupling approach supports large assembly tolerances and semiconductor grade wafer level processes—filling a critical gap in the optical stack,” said Aldo Lopez, president, Datacom Solutions, Molex. “By integrating this unique technology into our optical interconnect portfolio, Molex offers a more seamless path from early-stage prototypes to high-volume CPO and other silicon photonics architectures required for the AI era.”

Teramount will continue to operate as a design and engineering hub in Jerusalem (IL), supported by Molex’s global optical capabilities. It will become part of the Optical Connectivity segment within the Optical Solutions Business at Molex.

Financial terms of the transaction were not disclosed.

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See also: Agreement for fibre-to-chip connectivity (15/4/2026)

@MolexConnectors  @TeramountLTD @NapierPR #PAuto

Agreement for fibre-to-chip connectivity.

An agreement to acquire Teramount Ltd., the developer of detachable fibre-to-chip connectivity solutions optimized for high-volume Co-Packaged Optics (CPO) and other silicon photonics applications has been announced by Molex. Teramount’s TeraVERSE® platform, based on its universal photonic coupler and wafer-level self-aligning optics, provides a pragmatic, field-serviceable interface between optical fibre and silicon photonics chips and was recently announced as part of the Molex one-stop CPO solution at OFC 2026. TeraVERSE is an innovative, passively-aligned solution that enables faster data rates necessary to support AI adoption while consuming less energy to reduce power and cooling demands in hyperscale data centers.

“Teramount’s TeraVERSE technology fills a crucial gap in the CPO stack, offering an advantaged and strategic complement to our optical solutions portfolio. With a practical, detachable fibre-to-chip interface we are afforded a foundational element to realize mainstream CPO adoption,” said Aldo Lopez, president, Datacom Solutions, Molex. “Combining Teramount’s IP and engineering talent with Molex’s innovative portfolio, manufacturing scale, supply-chain expertise and systems know-how gives customers an integrated, high-volume path to deploy scalable CPO.”

Their passive, detachable coupling approach supports large assembly tolerances and semiconductor-grade wafer-level processes. Compared with active alignment methods, passive alignment is materially more scalable as CPO moves toward volume production. Molex will combine Teramount’s IP and engineering expertise with its optical capability and global manufacturing scale to deliver industry-leading performance specifications and accelerate production of TeraVERSE.

“Harnessing Molex’s global scale and system-level expertise with Teramount’s innovation expertise and detachable, wafer-level coupling technology creates a real pathway for scalable, high-density CPO,” said Hesham Taha, CEO and co-founder of Teramount. “Joining forces with Molex will enable us to accelerate delivery of a manufacturable, serviceable fibre-to-chip interface that meets the pressing needs of AI and hyperscale data centers.”

The addition of TeraVERSE to Molex’s comprehensive optical interconnect portfolio provides customers with greater support across their CPO and silicon photonics architectures. As a leader in high-speed communications interconnects, Molex is uniquely positioned to deliver industry-leading copper and optical solutions.

Teramount will remain a design and engineering center in Jerusalem (IL) supported by Molex’s global optical capabilities. The acquisition is expected to close in the first half of 2026, subject to regulatory approvals and other customary closing conditions. 

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@MolexConnectors  @TeramountLTD @NapierPR #PAuto

Portfolio of high-reliability connectivity solutions expanded.

Acquisition assures more localised design and engineering support across North America, Europe and Asia

The acquisition of Smiths Interconnect, a subsidiary of British-based Smiths Group plc, has been completed by Molex. This marks "a major milestone in Molex’s vision to enable technology that is transforming the future and improving people’s lives." Smiths Interconnect brings a diverse portfolio of complementary products and advantaged capabilities in ruggedised custom connectors, contacts, RF components and optical transceivers for harsh environments. Smiths Interconnect also brings leading semiconductor test capabilities that complement Molex’s data communications and data center solutions to support growth in AI, along with a strong medical interconnect capability to support Medtech customers.

“We are excited to finalise the Smiths Interconnect acquisition, which expands our portfolio and engineering expertise worldwide,” said Joe Nelligan, CEO, Molex. “Along with their products and technology, we are excited about the Smiths Interconnect’s global team and the strong customer relationships that they have established.”

As the largest acquisition in Molex’s history, the addition of Smiths Interconnect positions Molex to drive innovation across the high-reliability interconnect market—encompassing aerospace and defense, space exploration, industrial, medical and semiconductor test industries. The combination of Smiths Interconnect’s capabilities with Molex’s global footprint, engineering strength, culture and financial strength enables Molex to deliver increased value to customers around the world.

“This acquisition reinforces Molex’s position as a leader across every sector where high reliability is critical,” said Michael Cole, SVP and president, Aerospace and Defense Solutions Division, Molex. “By unifying these high-reliability solutions under the Molex banner, we provide a borderless platform that enables engineers to leverage ruggedised, precision-engineered connectivity.”

The Smiths Interconnect acquisition expands Molex’s global footprint to over 90 plants across 22 countries, and its global headcount to over 55,000 employees. The integration creates strong design and technical alignment to enhance innovation and solution capabilities to provide more value to customers.

This news builds upon the November 2024 acquisition of AirBorn by Molex, a foundational milestone in serving customers in the aerospace and allied sectors.

“The integration of Smiths Interconnect into the Molex engineering ecosystem is a significant win for the global design engineering community,” said Lew LaFornara, SVP, Global Interconnect Business Strategy, TTI. “As a prominent Smiths Interconnect distributor, we are excited to continue offering our customers access to a robust line of mission-critical solutions—spanning aerospace and defense, medical, industrial and semiconductor test—all backed by Molex’s world-class logistics and technical support."

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@MolexConnectors  @smithsinterconn @NapierPR #PAuto 

Benchmark for Test & Measurement.

Engineered to solve complexities of multi-channel signal routing in complicated test environments.

An industry benchmark for Test and Measurement (T&M) has been claimed with the introduction of Molex Cardinal Multi-Port High-Frequency Coaxial Assemblies. Supporting frequencies up to 145 GHz, this product represents a strategic expansion of the Cardinal family, evolving its proven mechanical integrity into the high-bandwidth spectrum required to validate the next generation of AI-driven architectures and 6G wireless infrastructure.

“The expansion to 145 GHz represents a natural evolution of the Cardinal product line, which was built to solve the growing need for increased port density without compromising signal integrity,” said Roman Buff, general manager, RF, Molex. “This new high-speed solution integrates high-frequency contact technology in the Cardinal multi-port housing, empowering engineers to bridge the gap from AI to 6G and test the silicon of tomorrow using the infrastructure of today.”

Testing ahead of the curve.
While 110 GHz has been the benchmark for high-performance testing, the surge in 6G research and AI backhaul demands a raised ceiling. The new 145 GHz Cardinal product from Molex characterizes signals that were previously beyond the reach of standard coaxial interfaces. The new assemblies deliver phase-matched, high-precision connections up to 145 GHz, optimized for minimal insertion loss and superior return loss at extreme frequencies.

This latest Cardinal solution also supports data characterization rates up to 448 Gbps, enabling use with next-generation devices and systems. By pushing the measurement envelope, this versatile product helps engineers meet today's standards while validating the silicon and networking protocols that will define the next decade of global connectivity.

The multi-port design of the Cardinal assemblies supports simultaneous, high-density testing in a compact footprint, accelerating research and development cycles. Designed for seamless integration across the Cardinal product ecosystem, the new assemblies provide a high-performance connectivity solution for a broad spectrum of industries, encompassing next-gen AI clusters, 5G/6G infrastructure, satellite communications, mmWave radar and the emerging requirements of terahertz imaging.

Molex consolidates multiple RF connectors into a single, multi-port housing, reducing testing cycles and total cost of ownership (TCO). The high-performance RF connectors and compression-mounted, solderless Printed Circuit Board (PCB) attachment elevate testing flexibility while reducing installation and rework time. The integration of high-frequency contact technology into the multi-port assemblies provides engineers with a smooth upgrade path and trouble-free transition from 110 GHz testing to 145 GHz capabilities.

A hallmark of the Molex Cardinal assemblies is connector repeatability, which is crucial in test environments where connectors are mated and unmated frequently. Cardinal Multi-Port High-Frequency Coaxial Assemblies are rated for reliable performance over 500 cycles. Most important, however, is that Molex uses highly precise connectors for greater repeatability, assuring consistent, repeatable performance from the first to the 500th measurement. This high-density PCB connector minimizes board real estate, allowing smaller evaluation boards to further reduce costs.

These Multi-Port High-Frequency Coaxial Assemblies are available now, with the Cardinal 145 GHz assemblies joining the existing lineup of 67 GHz Precision Coaxial Assemblies and 110 GHz Precision Coaxial Assemblies. Cardinal assemblies also offer versatile connector options, including vertical, right-angle and edge-mount PCB terminations, along with scalable, multi-port configurations, including 1x4, 1x8 and 2x8 for high-density setups.

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@MolexConnectors @mepaxIntPR  #TandM

Modular Wire-to-Wire Connectors.

Cut cost and complexity of automotive wiring harness and zonal architecture applications.

The MX-DaSH Modular Wire-to-Wire Connectors have been introduced by Molex. These, the newest additions to its award-winning MX-DaSH family of data-signal hybrid connectors unify power, signal and high-speed data connectivity in a single connector system. These Modular connectors utilise multiple, versatile cartridges incorporated into a single housing system to simplify wiring and harness architecture while improving automotive design flexibility, adaptability and scalability across multiple vehicle models and applications.

“MX-DaSH Modular Wire-to-Wire Connectors solve some of the biggest pain points in today’s automotive design processes, caused by constant and rapid change in electrical and electronic requirements,” said Scott Whicker, SVP, president, Transportation Innovative Solutions, Molex. “Our cartridge-based design makes it easy to mix-and-match functions and reconfigure wire harnesses or modules to help achieve faster development cycles and reduced costs.”

Purpose-built for zonal architectures.
Each MX-DaSH Modular Wire-to-Wire Connector is based on an unsealed, cartridge-based hybrid connectivity platform that consolidates multiple connectors and connection types into a single connector. By reducing the total number of unique parts, this new connectivity system offers unparalleled freedom to meet specific automotive design challenges and accelerate upgrades, as well as slash design and tooling time.

This “building block” approach optimises vehicle harnesses, which can result in significant weight, size and cost savings. Purpose-built for zonal architectures, MX-DaSH Modular connectors are ideally suited for high-content connection points, including instrument panel-to-body harness connections, seat power and signal connections, and electrical/electronic architecture components. Wiring and module engineers can also change cartridges within the housing, making it easier to add new features or swap out pins and cartridges to meet architecture needs.

Global reach and adoption by OEMs.
Localised manufacturing and compatibility with industry-standard terminals is driving adoption of MX-DaSH Modular connectors worldwide while decreasing global supply chain challenges.

The MX-DaSH Modular connector’s adherence to USCAR2 performance specifications for automotive electrical connector systems is also key, along with USCAR49 performance specifications for miniature automotive coaxial connectors.

As the largest automotive market and hotbed for innovation in electrified vehicles (EVs) and Advanced Driver-Assistance Systems (ADAS), China is a major proving ground for next-generation automotive technologies, including Molex connectivity solutions. A regional version of the MX-DaSH Modular connector will be included in MY26 cars in China to address the unique cost, packaging and expedited time-to-market requirements of Chinese automotive OEMs.

In addition, the new modular, cartridge-based connectors are being deployed by other automotive manufacturers in North America and Europe with new designs for MY28 vehicles expected to include MX-DaSH Modular Wire-to-Wire and Wire-to-Board Connectors.

Automation friendly, reliability focused.
The MX-DaSH Modular connector’s automation-friendly design lends itself to precise automated assembly operations, improving manufacturing efficiency and quality while lowering labor costs. Moreover, inclusion of positive-locking features, blade stabilisation and vibration resistance help boost overall reliability by protecting against inadvertent disconnection in demanding automotive environments. Robust engineering support, extensive quality control and a full range of versatile and customisable solutions reinforce the role Molex plays as a unique resource for improving vehicle wiring performance and reliability.

Molex MX-DaSH Modular Wire-to-Wire Connectors are available now, offering unprecedented design freedom and flexibility to accommodate the rapid rise in data, power and high-speed signal requirements in today’s vehicles. Maximum pin count for the connectors is 70 circuits, with maximum circuit count per cartridge as follows: 26 circuits for 0.50mm (CTX50) cartridges, 14 circuits for 1.20mm cartridges, 4 circuits for 2.80mm cartridges, and 3 circuits for 4.80 and 6.30mm cartridges.

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@MolexConnectors @mepaxIntPR #Automotive #China

What has Ai got in store for industry in 2026?

Here are ten connectivity and electronics design predictions.

Our friends at Molex are predicting that artificial intelligence (Ai) will continue to transform every major industry sector over the next 12 to 18 months, driving exponential demand for computational resources while causing major bottlenecks in both compute power and connectivity. Ai-driven data proliferation and processing are creating new opportunities and obstacles for design engineers across fast-growth sectors, including automotive, aerospace, consumer electronics, data centres, industrial automation and MedTech.

“Ai models in every industry—from autonomous vehicle sensors and high-resolution medical imaging to real-time control systems on factory floors—generate massive amounts of data while requiring high-speed connectivity, advanced power delivery and efficient thermal management,” said Aldo Lopez, SVP and president, Datacom and Specialty Solutions, Molex. “In 2026, we will remain steadfast in helping remove critical bottlenecks in compute power and connectivity while working with customers, suppliers and partners worldwide to develop future-ready, Ai-driven infrastructures.”

Top 10 Predictions for 2026

1. High-speed interconnects remain essential to delivering the speed and density to enable Ai/Machine Learning workloads in modern hyperscale data centres.
Communication between major compute elements, like GPUs and Ai accelerators within a data-centre server or chassis, necessitates a mix of high-speed backplane and board-to-board solutions designed for 224Gbps PAM-4 speed, along with high-speed pluggable I/O connectors that support aggregate speeds up to 400/800Gbps while providing a path to 1.6T.

2. Energy consumption hampers data-centre scaling, propelling advancements in thermal management.
The heat generated by high-performance servers and systems needed to scale generative Ai applications while supporting the transition to 224Gbps PAM-4 has exceeded traditional solutions relying on air-cooling technology. Developments in liquid cooling, including direct-to-chip cooling, immersion cooling and passive components that enhance active cooling, will continue to gain traction and exploration over the next 12 to 18 months.

3. Demand escalates for Co-Packaged Optics to support “scale-up” architectures.
Co-Packaged Optics (CPO) is considered essential for handling GPU-to-GPU interconnectivity in AI-driven architecture. Designed to deliver ultra-high bandwidth density directly at the chip edge, CPO enables much higher interconnect density while reducing power consumption and electrical signal loss. The focus on CPO is expected to intensify in the coming year, as it has been developed specifically to address the massive power and bandwidth demands of hyperscale data centres and Ai/ML clusters.

4. Specialty fibre optics accelerate MedTech and aerospace and other innovations.
Specialty fibre optics offer high-precision links with immunity to Electromagnetic Interference (EMI). No wider than human hair, optical fibre increasingly powers high-resolution imaging equipment, like MRI and CT scanners, while delivering concentrated laser energy for non-invasive therapeutic treatments. fibre optics also address engineering challenges in satellite and space systems to transmit vast volumes of data over long distances with minimal signal degradation.

5. Rugged, reliable and miniaturised solutions gain momentum across every major sector.
The use of compact, durable connectors that thrive in harsh environments has long dominated automotive as well as aerospace applications. Pushing boundaries for greater reliability in very small form factors has now permeated consumer electronics (e.g., fitness trackers, smartwatches and smart home devices); industrial automation (e.g., warehouse robots, touchscreens and sensors); as well as medical devices (e.g., endoscopes, insulin pumps and wearable health monitors).

6. Electrification continues to accelerate, driving demand for high-speed, high-power connectivity.
Electrification trends in military land systems are gaining ground, with growth in Electric Vertical Take-off and Landing (eVTOL) systems, which need lightweight, miniaturised and rugged MIL-SPEC connectors and cables. An early proponent of zonal architecture for next-gen electrified vehicles, Molex connects multiple sensors, cameras, radar, LiDAR and other technologies while prioritising the role of hybrid or mixed connectors needed to handle power and high-speed signals associated with in-vehicle networks.

7. Mandates for modular solutions and open standards grow across most industry sectors.
An active participant in the Open Compute Project (OCP), Molex is developing next-generation data centre cooling technologies and modular hardware specifications to enhance hyperscale system performance, efficiency and modularity. Close alignment with industry standards groups in aerospace also empowers Molex to focus on reducing size, weight, power and cost (SWaP-C).

8. 48V architecture gains traction as universal standard for power efficiency.
48V architecture is rapidly becoming the universal standard for power efficiency in AI-driven data centres and next-gen vehicles. A power architecture enabler, Molex drives innovation in 48V technology to solve thermal density challenges and reduce cabling weight in automobiles while addressing power spikes caused by generative Ai workloads in data centres in support of the OCP Open Rack v3 (ORV3) standard.

9. Personalisation continues to shift, thanks to emergence of agentic Ai.
Agentic Ai adapts readily to changing conditions, aiding real-time decision making and personalisation. In automotive, this translates to advances in autonomous driving and in-cabin experiences that function more like a third living space. In consumer electronics and MedTech wearables, greater personalisation optimises product usage while real-time diagnostics improve wellbeing. On factory floors, real-time access to data and adaptive human-machine interfaces improve productivity and operational efficiency.

10. Demands for supply optionality and regional manufacturing grow amid global trade volatility.
Investments in AI-driven data ecosystems will propel digital supply chain intelligence to support demands for new, regional supply networks and localised manufacturing amid shifting trade policies. The result requires increased supply chain resilience amid growing demands for increased predictive procurement intelligence. 

Supporting Resources.
You might like to dive deeper into these 2026 predictions and hear from Molex industry experts as they explore how engineering ingenuity and emerging technologies are shaping the future. Watch their videos here to discover their views on what’s in store across key industries in 2026.

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@MolexConnectors @mepaxIntPR #PAuto #Communications

Industrial communications business acquired.

Molex is a global electronics leader committed to transforming technology innovation with interconnect solutions for a wide range of industries. “Molex is delighted to transition our industrial communications business to HMS, a true market leader in the category,” said Dave Atkinson, Vice President and General Manager of Molex Industrial Solutions.

From left: Martin Hoffert, Director Corporate Strategy and M&A, HMS, Matthijs Von Witte, VP Sales, Molex Industrial, Bartek S. Candell, SVP, HMS Industrial Network Solutions Division, Dave Atkinson, VP and General Manager, Molex Industrial

The acquisition consists of several strategic assets including:

• Hardware and software intellectual property
• A product portfolio consisting of network interface cards and software stacks
• Customer relations, primarily in USA and Japan
• Development teams based in Waterloo, Canada, and Le Thuit Anger, France
• The French company Woodhead Software & Electronics S.A.S.U. 

 “After some time of discussion, Molex and HMS concluded that the industrial communication business of Molex aligns closely with the vision of the INT division within HMS. We identified several synergies with Molex network interface cards, and their leading industry offer on network controller/scanners, which complement our INT product portfolio and create several cross-selling opportunities.
“At the same time Molex can focus fully on their core business, confident that their Industrial Communication customers will be in good hands with HMS. This is a perfect addition to the HMS portfolio and a win-win deal for both parties,” according to Bartek Candell, Senior Vice President of HMS Networks.

“We are confident that our talented team members will bring highly complementary engineering expertise and innovation capabilities to support our collective customers.” 

The primary rationale for the acquisition is to obtain strategic intellectual property and know-how from the experienced engineering teams. This acquisition supports division INT’s strategy by strengthening its software and hardware offerings through complementary IP blocks. It also expands HMS’s customer base in North America, a key strategic market and an essential initiative of the 2030 strategy for the INT division.

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@hmsnetworks @MolexConnectors @HMSAnybus @mepaxIntPR #PAuto #Communications

Mission-critical connectivity provider acquired.

Customers and partners to benefit from combined engineering expertise, expanded technology portfolio and enhanced global footprint

An agreement has been signed by Molex to acquire Smiths Interconnect, a leading provider of high-reliability connectivity products and solutions serving the aerospace, medical and semiconductor test and industrial markets. Smiths will receive cash consideration for the transaction, subject to customary adjustments for working capital, cash and debt.

“Molex is excited to reinforce our commitment to the aerospace and defense market with the acquisition of Smiths Interconnect,” said Joe Nelligan, CEO, Molex. “Smiths Interconnect has a highly complementary portfolio of advantaged solutions that strongly enhances the platform established by our acquisition of AirBorn last November. The combination of Molex’s global scale, capabilities and financial stability with Smiths Interconnect’s complementary technologies, products, customers and footprint will enable us to expand our aerospace and defense business and support customers in new and innovative ways.”

Smiths Interconnect designs and manufactures technically differentiated electronic components, along with microwave, optical and radio frequency products and subsystems that connect, protect and control critical applications. Smiths Interconnect has 21 sales, R&D and manufacturing locations across 12 countries, including the United States, Canada, Mexico, Costa Rica, France, Germany, Italy, the United Kingdom, Tunisia, India, China and Singapore.

The acquisition is expected to close in the first half of 2026, subject to regulatory approvals and other customary closing conditions. More information will be shared at that time. Jones Day is acting as Molex’s legal advisor and Rothschild & Co is serving as Molex’s exclusive financial advisor.

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@MolexConnectors @smithsinterconn @NapierPR #Pauto #Communications

Connectivity for 3D-Printing pioneer.

Ensuring seamless connectivity while streamlining printer-kit assemblies, as well as machine modifications and upgrades.

Molex is growing right along with Prusa Research, a rising star in the fast-paced world of 3D printing with more than 1,000 employees on three continents supporting a diverse and devoted base of customers worldwide. The Prague-based company strives to offer seamless experiences and unmatched flexibility for a variety of printing needs.

Guided by a steadfast commitment to community, sustainability, as well as open-source hardware and software principles, Prusa offers its printers fully assembled or as Do It Yourself (DIY) printer kits. Equally important is the ability for customers to unlock new capabilities over time through hardware and software modifications, add-ons and upgrades.

“Prusa Research needed connectivity systems with the right balance of functionality and simplicity without compromising quality,” said Brian Hauge, SVP and president, Consumer and Commercial Solutions, Molex. “With support from Arrow Electronics, we provide a full portfolio of connectors that are robust yet easy to use. Molex also stays in lockstep with Arrow and Prusa engineers to align emerging printer designs with new innovative connector solutions to ease new product introductions and upgrades.”

Rapid growth.
Prusa’s unwavering customer focus, passion for community and strong technology partnerships are cornerstones for driving a sustained rate of incredible growth. The company processed more than 300,000 orders for printers, filaments, resins and accessories last year while opening a U.S. subsidiary called Printed Solid, in Newark, Del., to further expand global reach by manufacturing printers and filaments in the United States.

“In 2024, Prusa grew 25% year over year, and we are excited for this year, which will be even bigger,” said Josef Prusa, CEO of Prusa Research. “We populated over one million parts using Molex CLIK-Mate connectors last year and they all have performed very well. We now have more than 20 printer designs, and they all use Molex connectors. Looking ahead, we will continue to work with Arrow and Molex to drive our further expansion in Europe while building out manufacturing capabilities in the U.S.”

To drive sustained growth, Prusa deployed Molex CLIK-Mate wire-to-board connectors, which align well with the company’s high standards for performance and straightforward operation. Ideal for devices that require connectors to carry more signal lines in less space, these wire-to-board connectors feature a unique tuning-fork terminal design that provides low-insertion force while maintaining secure contacts.

Prusa particularly appreciates the audible “click” sound that offers immediate confirmation of secure contact, as well as easy automatic board placement and simplified set-up for at-home customers. Not only do CLIK-Mate connectors prevent DIY users from inserting them in the wrong orientation, but they also enable Prusa engineers to streamline production by speeding surface mount technology (SMT) line assembly.

Compact, high-performance Molex Micro-Fit Connectors, which blend power and flexibility without impacting space or reliability, also are deployed by Prusa. In addition, Molex ultra-microcoaxial RF connectors are used to link Bluetooth and Wi-Fi connectors, along with other Molex solutions for supporting high-speed data and RF microwave technology.

Up to 16 types of CLIK-Mate connectors currently help Prusa streamline printer production. Molex connectors are featured across Prusa’s printer line, including the new CORE One printer, which hit the market this past January. Other connectivity solutions, such as Molex’s Easy-On FFC/FPC Connectors, as well as custom connectivity solutions, are being explored to enhance support for existing and new printers.

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@MolexConnectors @Prusa3D @NapierPR #Pauto #Communications

High speed connectivity.

To drive electronics design innovations across diverse industry sectors in 2025.

An uptake in reliable, durable, high-speed interconnects over the next 12-to-18 months as the impact of generative artificial intelligence (AI), machine learning (ML) and cloud solutions intensifies across every sector, including data centers, automotive, consumer electronics and medical technology is predicted by Molex. Increased collaboration among electronics product designers, manufacturing engineers and supply chain specialists also will be needed to address ever-increasing requirements for innovations in thermal and power management, material science, and battery technology, among other pressing priorities.

• Increase in opportunities predicted for high-speed optical transceivers and miniaturized connectivity solutions to address data-intensive applications • Advances in thermal and power management require investment and innovation in next-gen technologies and emerging industry standards • Cross-industry collaborations and supply optionality continue to streamline design flexibility and adaptive decision making.

“We anticipate a consistent rise in connectivity-related solutions in 2025 that will drive advancements in hyperscale data centers and software-defined vehicles while reducing obstacles and barriers for smaller, yet more powerful consumer and MedTech devices,” said Mike Deppe, VP of Global Product Development, Molex. “The growing demand for data and instant access to information will continue to create both opportunities and challenges in connectivity, which we are prepared to address on behalf of our customers, suppliers and technology partners worldwide.”

Top 10 Predictions for 2025.
1. Continued use of high-speed optical transceivers for hyperscale data centers The rapid adoption of generative AI is escalating demand for massive processing and capacity scaling in hyperscale data centers. In response, operators are increasing their use of high-speed optical transceivers for both inter- and intra-rack connectivity to offer additional port density, greater signal integrity and reduced power consumption.

2. Spike in 224 Gbps PAM-4 interconnects requires thermal management improvements With deployments of 224 Gbps PAM-4 interconnects growing and the path to 448 Gbps PAM-4 coming into view, it is clear that air-cooled data center solutions are reaching operational limits. This reality is driving the emergence of new thermal-management solutions, including liquid cooling solutions, such as direct-to-chip and immersion cooling. Molex is working closely with customers, power-ecosystem partners and groups like OCP to speed development of next-gen cooling technologies and standards.

3. Momentum in 48-Volt systems propels advancements in automotive functionality By quadrupling system voltage, 48V technology boosts electric turbocharging, regenerative braking, infotainment systems, and battery preconditioning for auxiliary charging. The delivery of higher current and voltage also is crucial to increasing power efficiencies in sensors, actuators and control units needed for advanced driver assistance systems (ADAS).

4. Power systems remain one of the biggest product design engineering challenges Unrelenting demand to balance power capacity, functional safety, efficiency, and cost and performance monitoring is driving aggressive investment and innovation in battery technology, along with solutions designed to reduce signal and power interference.

5. Slow pace of 5G rollouts will continue to stall as consumers await “killer apps” The arrival of Meta’s Orion illuminates the future of AR glasses but will take time to drive 5G momentum. As “killer apps” emerge, the pace of 5G rollouts will gain speed accordingly amid rising requirements for high-speed wireless connectivity, along with the need for small, dense connectors, such as the millions of miniaturized connectors Molex supplies to leading mobile device manufacturers.

6. Convergence of ruggedized, miniaturized connectors will fuel cross-industry innovations Use of compact, durable connectors with a pitch of 2.54mm or less will dominate in electric vehicles and zonal architectures while gaining major traction in other areas, including consumer electronics, medical devices, industrial automation and smart agriculture. Blending the best of miniaturization and ruggedization improves space efficiency, signal integrity and thermal management.

7. Advancements in material science balance strength, weight and sustainability The use of digital twins, AI and material databases will continue to play ever-increasing roles in material characterization, processing innovation, selection, application engineering and testing. Expect more material science breakthroughs in building miniaturized connectors, especially in balancing strength, weight, conductivity, chemical resistance, sustainability, the use of bio-based materials, and more.

8. Mass customization and consumerization of the automotive experience varies by market Vehicle architecture development will align with different driving preferences and experiences worldwide. In China’s dynamic market, ongoing experimentations will drive innovation while the European market, led by German automakers, considers a mix of technologies. American OEMs will advance software-driven architectures, particularly in passenger and sport utility vehicles.

9. Cross-Industry collaborations to thrive as design engineers tap different experiences Continued cross-industry collaborations are expected to increase at an accelerated pace as design engineers leverage expertise in hyperscale data centers to address concerns and challenges in power and thermal management, sensor fusion and signal integrity in automotive and consumer electronics.

10. Ongoing supply chain volatility requires inventory rebalancing and supply optionality Operationalizing intelligence and data to gain faster, more precise access to real-time insights will lead to better forecasting and risk management, with a shift toward predictive, scenario-based supply chain planning and faster, more adaptive decision making.

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@MolexConnectors @NapierPR #Pauto #Conmmunications

The future of robotics.

The rising potential of human-machine collaborations.

A thought leadership report that looks at the future potential of robotics, resulting in more intuitive, intelligent and interconnected human-machine communications and collaborations has just been published. “The Molex 2024 Robotics Report: How Robotics will Empower Human Potential” contemplates a future where highly advanced robotics systems and multipurpose robots transform fundamental aspects of everyday life — from improving how factories function and students learn to making smart homes more efficient, elevating patient care and other applications.

“As we explore the role of robotics across various industries, it is becoming increasingly apparent that the future will be shaped by the evolving relationship between humans and machines,” said Brian Hauge, SVP and president, Consumer and Commercial Solutions, Molex. “This latest industry report sheds light on a promising future of unprecedented human-machine interactions while underscoring the critical need for enabling technologies and seamless connections between robotics systems and their human counterparts to empower faster, more effective and extremely precise decision making.”

Foundational Technologies Driving Robotics Advancements.
The future of robotics depends in larger part on the continued evolution of core communications and computing technologies that enable autonomous operation in dynamic environments. Topping the list is high-speed connectivity, as robotics systems require low-latency communications and near-instantaneous data transfers to respond with speed and precision. While 5G/6G networks will deliver high bandwidth, low latency communications, it is important to design robotics solutions with multiple connectivity options, including the ability to switch between 5G and Wi-Fi or satellite networks that provide multi-channel redundancy.

Equally important, processing data locally on nearby edge devices ensures uninterrupted, independent operation of robotics systems and robots. With edge computing, for example, these automated solutions can process data instantaneously, which is essential for applications requiring split-second decisions. In most industrial automation or manufacturing environments, robots are always programmed with fail-safe protocols that throttle back power and functionality to a safe operational state if connectivity is disrupted or compromised.

Benefitting from AI/ML and Sensor Fusion Innovations As the biggest engines behind robotic adaptability, advancements in AI and ML are crucial. AI algorithms let robots make informed decisions based on real-time data while adapting quickly to new circumstances, and even predicting future conditions based on past interactions. Through ML, robots can analyze patterns to optimize behavior while increasing efficiency and accuracy by continually learning, adapting and improving performance. Sensor fusion combines data from different sources, such as LiDAR, cameras, along with depth and force sensors, to help multipurpose robots better perceive depth, movement and obstacles in different settings.

Important Factors in Greater Human-Robot Interactions According to Molex’s robotics report, robots that can understand, respond to, and even anticipate human emotional and contextual needs are on the horizon. With Natural Language Processing (NLP), for instance, robots can follow spoken commands, engage in dialogue and adjust actions based on contextual understanding. Additionally, emotional AI enables robots to recognize and respond to emotional cues by analyzing a human’s tone of voice or facial expressions. Molex expects this rise in human-centered interactions to foster a deeper sense of engagement, enabling future robotics systems and autonomous robots to adapt more readily to complex home environments, and take on new roles as personalized educational tutors, indispensable surgery assistants and continuous patient monitors.

With the arrival of Industry 4.0, collaborative robots, or cobots, are gaining traction in handling increasingly complicated duties in industrial settings. Not only can robotics systems and an entire fleet of robots keep production lines running smoothly, but they can also anticipate and fix potential manufacturing bottlenecks while helping engineers design better products. In the future, cobots will redefine precision and personalization in every environment, including operating rooms, classrooms and battlefields.

Critical Enabler of Robotic Transformations Major advances in robotic technologies and greater interaction opportunities will require innovations in connectivity, power management and data processing. Molex’s robust portfolio of resilient and reliable connectors will enable ever-increasing collaboration between humans and machines to support the most demanding applications across diverse industry sectors.

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@MolexConnectors @NapierPR #Pauto #Robotics

Immersion management - thermal management solution.

Reducing the time and cost of deploying and upgrading high-performance data centres to meet unrelenting demand for generative AI and machine learning workflows.

A thermal management solution that reduces the time and cost of deploying and upgrading high-performance data centers to meet unrelenting demand for generative AI and machine learning workflows has been introduced. Molex VaporConnect™ Optical Feedthrough Modules for two-phase immersion cooling address constant increases in data center speed and capacity by leveraging a unique, cassette-based design that bolts directly onto immersion tanks and enables optical transceivers and network cabling infrastructure to be swapped out without changing mechanical interfaces or impacting immersion tank architecture. Reference designs for the new modules will be available commercially in Q1 of 2025.

“Molex continually embraces innovative optical solutions to ease data center deployments and upgrades while alleviating critical thermal management challenges,” said Trevor Smith, general manager, Optical Connectivity, Molex. “VaporConnect gives customers the flexibility to upgrade connectivity and scale cooling system designs to keep pace with data center growth by simply deploying a different module, which will accelerate upgrades while reducing overall energy, cooling and technology costs.”

Streamlining two-phase immersion cooling.
Molex VaporConnect Optical Feedthrough Modules simplify the connections between optical transceivers contained within immersion tanks and cabling infrastructure that exists outside the tank using fully upgradeable sealed modules. With VaporConnect, sealing and cabling is accomplished inside the module, giving customers the opportunity to upgrade connectors without impacting immersion tank design or architecture. Additionally, customers have the flexibility to re-use standard cabling infrastructure for multiple product generations, which further reduces deployment time, cost and complexity.

A full range of industry-standard and Molex optical connector form factors are available for single- and multi-mode fiber solutions. They also feature mix-and-match functionality to facilitate system upgrades to newer or denser connectors. Customizable module footprints are available to fit specific space and application requirements.

Molex VaporConnect Optical Feedthrough Modules are also designed to minimize external patching and shuffle requirements by leveraging Molex FlexPlane™ optical circuitry technology. As a result, complex optical shuffles and high-density fiber routing are integrated seamlessly within the module for simpler installation and plug-and-play operation.

A sealing gasket comes with every VaporConnect module, which is thoroughly tested using industry-standard, helium-leak testing to ensure a reliable seal with the tank wall. This also assures a seamless transition from the server line cards inside the tank to outside cabling infrastructure. Testing is underway for compliance with industry-standard GR-1435-CORE.

VaporConnect modules are designed to accommodate customer specifications, with the number of fiber channels dependent on the number and type of connectors used. As many as 576 fibers can be integrated into a single module. A range of form factor options are available, including MPO, LC and very small form factor (VSFF) options, such as MMC, MDC, SN and SN-MT. This ensures conformance to existing infrastructure and streamlines system upgrades. As part of Molex’s continued investment in this area, an EBO connector option is currently in development, with availability slated for the first half of 2025.

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@MolexConnectors @NapierPR #Pauto #DataCentres

Enhanced current sensors for industrial and automotive applications.

Increased performance ideally suited for busbar current sensing in industrial inverters, motor drives, as well as power distribution and charging systems.

Molex has announced the Percept Current Sensors to address the growing demand for highly accurate busbar current sensing solutions in industrial and automotive applications. Percept Current Sensors leverage Infineon’s high-precision coreless current sensors and Molex's proprietary electronics packaging technology to further reduce sensor size and weight while simplifying installation and system integration significantly.

“The new Percept Current Sensors benefit from Infineon’s coreless sensor and our proprietary electronics packaging technology to set new standards for current-sensing accuracy, reliability and integration simplicity,” said Lily Yeung, director, Sensors, Transportation Innovative Solutions, Molex. “Together we can save customers valuable space and optimize product performance, while reducing major design and manufacturing complexities and costs.”

The compact, coreless design and unique electronics packaging of the Percept Current Sensors results in a solution that is 86% lighter and up to half the size of competing current sensors. This enables higher-density packaging within devices, which contributes to reductions in overall system weight while facilitating greater design flexibility.

The Percept Current Sensors offer increased sensing opportunities in space-constrained applications as well as those sensitive to electromagnetic interference (EMI). They also provide accuracy within 2% across a wide temperature range and entire product lifespan, along with low sensitivity and offset errors. Additionally, Infineon’s differential Hall-effect sensor design suppresses noise from stray magnetic fields, which are commonly found in demanding industrial motor-drive and automotive applications.

“Infineon’s XENSIV™ TLE4973 and TLE4972 are part of our family of high precision coreless magnetic current sensors with a measurement range of 0A to 2000A, offering tremendous flexibility for different power ranges. When combined with Infineon’s sensor, Molex’s innovative package creates a small, efficient and robust solution for the automotive and industrial markets,” said Matthias Grewe, vice president and head of Product Line Magnetic Sensing, Infineon Technologies.

Molex’s proprietary electronics packaging technology enables seamless integration of high-current conductors, connectors, Printed Circuit Boards (PCBs), busbars, and heat sinks, among other mechanical components, into a single device. This capability is highly suited for assemblies that must withstand high temperatures, high currents and harsh environments. Percept Current Sensors take advantage of this proprietary packaging method to ensure flexible system integration and boost accuracy from precise chip placement and factory calibration. Pre-calibrated systems not only lead to simpler, streamlined installation, but also can dramatically speed assembly time.

This novel packaging technology uses 99% less water than typical PCB manufacturing and does not require any chemicals or generate copper sludge, enabling a more environmentally friendly manufacturing method. Versatile and configurable design options, including the sensor-in-busbar design, provide customers with a complete package for plug-and-play deployments that do not require excessive development time, resources or cost.

These Sensors are available in industrial- and automotive-grade options, encompassing full-differential and single-ended output modes and bi-directional sensing. Available current ranges include +/-450.0 to +/-1,600.0A; operating temperatures extend from -40 to 125°C in accordance with AEC-Q100 Grade 1 standards. Sensors for industrial applications are slated for October 2024 availability, followed by automotive application product approval process planned for the first half of 2025. Limited engineering samples for industrial applications are available today.

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@MolexConnectors @Infineon @NapierPR #Pauto #Automotive 

Connector design trends, tradeoffs and emerging technologies.

Uniting ruggedization and miniaturization in connector design.

A report that explores the ever-increasing role of ruggedized, miniaturized interconnect solutions in unlocking new possibilities for electronic device innovation across a growing swath of industries has been published by Molex. The report, entitled “Breaking Boundaries: Uniting Ruggedization and Miniaturization in Connector Design,” looks at the trends, tradeoffs and enabling technologies that remove roadblocks while helping shape the future of electronics.

“Increasing demand for electronics in new vehicle platforms has intensified the need for smaller and rugged interconnects designed to withstand the harshest environments,” said Carrieanne Piccard, VP and GM, Transportation Innovative Solutions, Molex. “As a result, the ruggedization of miniaturized connectors has emerged as an overarching design principle, requiring a holistic approach across the entire lifecycle of components to achieve optimal product reliability, performance and longevity.”

Critical connectivity enablers.
In this industry report, Molex defines miniature connectors as having a pitch of 2.54mm or less while ruggedness refers to features for withstanding the harshest environments and mechanical stresses. The convergence of interconnect ruggedization and miniaturization has enabled major innovations in the automotive industry, especially in supporting electric vehicles (EVs) and zonal architectures. Now the trend is permeating other industries, including consumer electronics (e.g., fitness trackers, smartwatches and smart home devices); industrial automation (e.g., industrial robots, touchscreens and sensors); as well as medical devices (e.g., endoscopes, insulin pumps and wearable health monitors).

Growing adoption of compact, durable connectors is gaining traction in other application areas, such as smart agriculture. Vertical farming systems with dense sensor and lighting installations require space-efficient connectors that work in wet, humid environments without interruption. Smaller, lighter and rugged connectors found in agricultural drones or “flying tractors” also must be protected against extreme temperature and excessive vibration, along with exposure to moisture, dust and corrosive chemicals.

Pushing design boundaries.
Molex’s new report explores best practices for clearing major design and manufacturing roadblocks to facilitate the design of increasingly smaller, lighter and more reliable connectors. Aluminum alloys and specialized, high-strength steel, as well as high-performance polymers, offer exceptional durability and lightweight construction. Processing these materials into complex connector geometries, however, often calls for specialized techniques, ranging from micro-molding and high-precision machining to laser welding or selective plating.

In addition, dense pitch layouts enable higher-contact density to accommodate smaller device footprints, but they require high-precision manufacturing and assembly. Increased risk of crosstalk and ineffective heat dissipation also can occur. To mitigate these issues, engineers can rely on advanced signal routing techniques, shielding and isolation methods, along with advanced thermal management strategies like heat sinks or thermal vias. Molex DuraClik Connectors feature housings made from high-temperature PBT material and secure terminal retention to withstand extreme automotive environments.

Multi-Functional Terminals (MFTs) represent a significant leap forward in miniaturized connector technology by integrating multiple functionalities — power, signal and even mechanical features, like locking mechanisms, into a single compact connector. Molex’s new report also investigates top environmental factors that can compromise component reliability while offering strategies and solutions to ensure optimal connector performance in harsh conditions. Strain relief features and contact design help optimize connector performance despite constant exposure to the stresses of vibration, shock and repeated mating cycles.

At Molex’s Global Reliability Lab, engineers simulate real-world vibration, temperature cycling and exposure to harsh chemicals. Molex Micro-Lock Plus Connectors address vibration challenges with a positive locking mechanism to ensure secure mating while averting accidental uncoupling in high-vibration environments. The connector's metal solder tabs provide added strain relief to solder joints for enhanced resistance to mechanical stress and vibration.

Since even a single drop of water or speck of dust can create corrosion, shorts, and ultimately, device failure, ingress protection is essential. Molex’s Squba Connectors feature IP68-rated seals certified as resistant to nearly five feet of water for 30 minutes. These compact connectors optimize power delivery in one of the smallest, most durable form factors available.

As devices continue to shrink in size yet grow in functionality, Molex engineers are pushing the design boundaries of miniaturization and ruggedization to solve real-world business problems and exceed customer expectations.

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@MolexConnectors @NapierPR #Automotive #PAuto

Hybrid connector system.

The MX-DaSH family of data-signal hybrid connectors just introduced by Molex unify power, signal and high-speed data connectivity in a single connector system. These innovative wire-to-wire and wire-to-board connectors are designed to support the transition to zonal architecture and address the full range of emerging applications requiring reliable data transmission. These include autonomous driving modules, camera systems, GPS and infotainment devices, LiDAR, high-resolution displays, sensor-device connectivity and more.

“The complete MX-DaSH portfolio enables automotive designers to reimagine vehicle electronics by integrating power and high-speed data transmissions within a single connector system to achieve major savings in size, space, cost and labor,” said Greg Everly, director, new product introduction for Molex, Transportation Innovative Solutions (TIS). “Our holistic approach lets designers mix and match different types of terminals, offering greater freedom and flexibility to support zonal architectures and simplify wiring harnesses.”

Optimizing Innovative Automotive Designs.
MX-DaSH connectors are available with sealed and unsealed options to optimize next-gen automotive architectures with assorted environmental and design requirements. Versatile configurations support different power and signal terminal sizes, such as 0.50, 0.64, 1.20, 1.50, 2.80 or 4.80mm, as well as high-speed FAKRA Mini (HFM®) modules for high-speed data transmission.

To ensure heightened reliability, MX-DaSH wire-to-wire connectors feature industry-leading male blade stabilization and independent secondary locks for robust and reliable terminal mating. Moreover, MX-DaSH empowers automotive engineers to accommodate a growing mix of devices and sensors with different network requirements by offering modular sections or cartridges in the wire to board option that support various interfaces without changing form factors or footprints.

Reducing Cost and Complexity.
With the new MX-DaSH family, automotive OEMs and their suppliers can better meet escalating demands for more compact, hybrid connectivity to support a multitude of automotive applications. For example, Mx-DaSH makes it possible to reduce the number of inline, wire-to-board connectors for an instrument panel and body control harness from eight to two while removing up to six meters of copper wiring, depending on the specific vehicle model.

Multiple options in this connector system encompass a variety of wire-to-wire applications. For instance, the 31+1-Way connector system combines 31 power and ground circuits, as well as a high-speed data connection, to decrease packaging requirements by up to 30%. With more functionality built into every MX-DaSH connector, considerable time savings can be realized through streamlined harness installations. Fewer component requirements also offer increased opportunities to further reduce BOMs.

Additionally, Mx-DaSH connectors have been designed for automated harness assembly to decrease cycle times and elevate overall manufacturing process efficiency and quality.

MX-DaSH connectors have been validated in accordance with global industry standards groups, including USCAR, Peugeot and IEC, to ensure reliable performance under the harshest automotive environmental conditions. MX-DaSH wire-to-wire connector models are available, along with select wire-to-board models and custom configurations. A continued expansion of the product family is underway to help customers keep pace with evolving vehicle connectivity needs.

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@MolexConnectors @NapierPR #Automotive #PAuto

Regional Distributor of the Year award for Northern Europe.

The British team of TTi Europe has won the 'European Regional Distributor of the Year 2023 – Northern Europe' award from Molex. This accolade recognises the valued commitment TTI Europe makes to Molex customers across Northern Europe, contributing significantly towards shared growth.

L to R: Darrell Gibbs, Outside Sales Manager,
Stephen Radford, Branch Product Manager &
Helen Thurston, General Manager Sales
Great Britain, TTI, Inc. – Europe

“We are pleased to present TTI UK with this award in recognition of their commitment to our demand creation efforts,” says Paul Keenan, Director of Distribution, Europe at Molex.

“Congratulations to the entire team for their continued engagement across the region. We are incredibly honoured to win this coveted award from Molex,” says John Islam, Manager Supplier Development – Product Marketing at TTI Europe. “The teams from Molex and TTI UK have worked closely together and I would like to thank them for their collaboration. We have continually invested in Molex’s inventory; as a result, we have the widest and deepest portfolio in the channel, with the newest products available. This is backed by local sales and technical support, meaning we can offer the best solutions to customers.”

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@ttiinc @MolexConnectors @Publitek #Energy #PAuto