Fibre to chip connectivity specialist company acquired.

The acquisition of Teramount Ltd., the developer of detachable fiber to chip connectivity solutions optimised for high volume Co Packaged Optics (CPO) and other silicon photonics applications, has been completed by Molex.

“Teramount’s passive, detachable coupling approach supports large assembly tolerances and semiconductor grade wafer level processes—filling a critical gap in the optical stack,” said Aldo Lopez, president, Datacom Solutions, Molex. “By integrating this unique technology into our optical interconnect portfolio, Molex offers a more seamless path from early-stage prototypes to high-volume CPO and other silicon photonics architectures required for the AI era.”

Teramount will continue to operate as a design and engineering hub in Jerusalem (IL), supported by Molex’s global optical capabilities. It will become part of the Optical Connectivity segment within the Optical Solutions Business at Molex.

Financial terms of the transaction were not disclosed.

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See also: Agreement for fibre-to-chip connectivity (15/4/2026)

@MolexConnectors  @TeramountLTD @NapierPR #PAuto