3-D for automation of the future.

Combination of Pulse Ranging Technology (PRT) with MEMS technology enables high-resolution 3-D point clouds.

From industrial automation to autonomous vehicles to care robots, mastering the challenges of the future will require powerful 3-D sensors that capture their surroundings quickly, comprehensively, and with millimeter precision.

High-performance distance measurement technology is combined with MEMS technology for the first time. This forms the basis for the R3000 3-D LiDAR/MEMS sensor, which will be presented as a product study at the Hannover Messe 2023. A technological innovation from Pepperl+Fuchs in cooperation with the Fraunhofer Institute for Silicon Technology ISIT enables maximum precision and performance - while remaining highly cost-efficient.

Combining the benefits of two technologies.
The 3-D measurement is based on Pulse Ranging Technology (PRT), a distance measurement method developed by Pepperl+Fuchs that can be scaled to meet a wide range of requirements. Based on over 250,000 emitted laser pulses per second, it measures distances from a few centimeters to several hundred meters with millimeter accuracy. Ambient light and other environmental influences are effectively suppressed. As a result, PRT delivers fast, precise, and reliable measurement results.

To reach the third dimension, they combine PRT with a micro-electro-mechanical system from Fraunhofer ISIT for the first time as part of the R3000 product study: A small, economical, and mechanically robust MEMS mirror is integrated into the sensor.

Through the motion of the piezoelectrically driven element, the emitted laser beam is deflected in two axes by 40° x 30°. Unlike conventional 3-D sensors, no pixel grid is created during the process of measurement. Instead, the R3000 uses a particularly small light spot and seamless scanning to produce ultra-high resolution 3-D point clouds with exceptional detail.

Intuitive operation due to intelligent user guidance.

To make communication between man and machine as simple as possible, the R3000 is equipped with additional functions. The sensor not only generates a 3-D point cloud, but also a superimposed intensity image that can visualize the scene and therefore facilitate programming and operation. In addition, each measurement point can be displayed with a visible laser beam. The synchronous laser projector allows the R3000 to be precisely aligned and adjusted without additional tools, ensuring easy commissioning. This function also enables interaction between the user and the service robot, for example.

Powerful 3-D measurement for the automation of the future.
With its innovative technology, the R3000 LiDAR/MEMS sensor will herald a revolution for solving complex automation tasks. Precise 3-D images of unknown environments are essential for the next generation of autonomous driving—from driverless transport systems in industry to automated transport of patients in retirement and nursing homes.

With the combination of PRT and MEMS, such complex, dynamic scenes can be captured in detail in real time. This creates a comprehensive database for completely new evaluations using artificial intelligence (AI) tools. As a compact and cost-effective sensor, the R3000 will make high-precision 3-D measurements available for a vast range of applications. In combination with advanced algorithms, the sensor will significantly drive development in the field of autonomous vehicles and service robotics - not only in manufacturing plants, hospitals or nursing homes, but in all areas of life.

@PepperlFuchsUSA @Fraunhofer @hannover_messe @mepaxIntPR #HM22 #Automation

Towards to smarter and safer wind turbines.

Envision Energy, the subsidiary of Envision Group providing world-leading green technology, is adopting Analog Devices' MEMS sensor technology in the company’s new generation of smart wind turbines. Initial goals for the collaboration include enabling new levels of wind turbine safety through enhanced real-time monitoring of vibration, tilt, and other information that can be used to inform safer windmill operation and design. Leveraging new capabilities offered by advanced MEMS sensors adds intelligence at the edge for real-time monitoring, further advancing the green energy revolution.

As one of the most mature renewable energy sources, wind power has achieved rapid growth in China in recent years. According to China’s National Energy Administration, by the end of 2022, the cumulative installed capacity of wind power in China reached approximately 370 million kilowatts, ranking first in the world. With the gradual expansion of wind power scale, wind turbine components are undergoing rapid iteration. Higher tower barrels, longer blades, and heavier engine rooms bring great challenges for the safe and reliable operation of wind power systems.

Among the challenges, the tower barrel is one of the key windmill components requiring monitoring to ensure the safety and reliability of wind power turbines. The tower barrel extends from the ground up to the windmill generator and blades. To promote safety, as well as to help prevent tower collapse and other extreme accidents, Envision Energy joins forces with ADI to introduce predictive maintenance technology into the core control of smart wind turbines. This is done by deploying ADI’s precision inertial measurement unit (IMU) and low-noise, low-drift accelerometers on different positions of the tower barrel to monitor the key states of tower barrel in real-time. Information gathered by monitoring tower barrel conditions is used to inform danger prevention measures.

"In the long-term, wind power and energy storage will become the energy of the future for the world. While we move toward that goal, safety remains the first factor in the process of value mining," said Haipeng Chen, Director of Intelligent Control Division at Envision Energy. “We are pleased to work with ADI to add its predictive, precision, high-reliability MEMS sensors to our wind turbines. This increases the safety of the tower barrel as well as brings the blade diameter and tower barrel height to the next level, continuing to lead the progress of the industry."

"ADI has decades of experience in the field of MEMS sensors," said Neil Zhao, Director of MEMS Technology Group Asia at ADI. “We are committed to helping customers solve challenges in different scenarios through high-performance solutions and all-around support. This collaboration with Envision Energy supports the promotion of smart distributed wind turbines."

@ADI_News #Pauto #Envision #Energy

VP for international sensor company.

Teoman Ustun has been appointed Vice President of Marketing and Product Development with ACEINNA.

Teoman Ustun

The company primarily focuses on developing and manufacturing innovative MEMS sensor and sensing systems solutions for autonomous vehicle navigation, ADAS and industrial applications.

“ACEINNA’s industry leading high precision MEMS based IMU technologies are used for a wide range of highly affordable and easily integrated autonomous navigation solutions for the automotive, industrial, telecom, datacenter and cloud infrastructure, consumer appliances, agricultural and construction markets,” explained Mr. Ustun. “I am looking forward to accelerating ACEINNA’s new product development and marketing in the automotive and industrial space, and bringing ACEINNA’s game-changing new MEMS sensor technologies to market worldwide.”

According to Yang Zhao, CEO of ACEINNA, “An accomplished semiconductor and sensor executive, Mr. Ustun brings a unique combination of technical domain expertise in sensor development, technical marketing and partnership development.”

Teoman Ustun is a technical and visionary business leader with 20+ years of experience in product development, marketing, strategy, execution, M&A and partnership management with passion to grow and build new businesses, revenue generation models and talent. 

Recently, Teoman was the co-founder and CEO of Mulberry Sensors, a startup developing laser based, chip scale, high performance molecular sensors. Before Mulberry, for 11 years he worked at Analog Devices (ADI) where he directed advanced sensors organization, created an innovative product pipeline, formulated and executed strategy, and prioritized organic and inorganic sensor investments, creating a lifetime revenue opportunity of $250M+. 

Prior to joining ADI, Teoman worked at Physical Sciences Inc. (PSI). In PSI, Teoman implemented manufacturing and quality processes that helped increase commercialization of high impact technologies. Teoman has an MBA from MIT, Sloan as well as an engineering management master from MIT.

@MEMSsensortech #PAuto #MEMS

Ultra-wide angle thermal MEMS sensor.

Omron Electronic Components Business Europe has added a wide angle 32 x 32 element version of its D6T MEMS Thermal Sensors, offering the widest field of view that Omron has ever delivered.

The new Omron D6T-32L-01A can view across 90.0° by 90.0°, able to encompass a wide area such as a whole room from a single point. This high performance sensor offers contactless measurement of temperatures of 0-200ºC in ambient temperatures of -10-70ºC. The D6T-32L is one of three new D6T variants announced by Omron. Applications where a more restricted field of view is needed can be fulfilled by the 1x8 D6T-8L-09H and the 4x4 D6T-44L-06H, offering 54.5° x 5.5° and 44.2° by 45.7° respectively. These two devices offer contactless temperature measurement between 5-200ºC at ambient temperatures of 5-45ºC.

Commenting, Gabriele Fulco, European Product Manager, Omron, said, “The new additions to the D6T sensor range open up a great range of new applications. From the detection of abnormal temperatures in industrial equipment on the production line to monitoring of food and other temperatures in the kitchen, the D6T can make a valuable contribution to safety – identifying potential problems before they become major hazards. This can not only save lives but also costs, allowing preventative maintenance to be undertaken in a timely manner. People detection remains a further key application area, and the new sensors are able to detect the presence and location of people in a space more accurately and reliably than ever.”

Omron D6T MEMS thermal sensors are based on an IR sensor which measures the surface temperature of objects without touching them using a thermopile element that absorbs radiated energy from the target object. Incorporating a state-of-the-art MEMS thermopile, custom designed sensor ASIC and signal processing microprocessor and algorithm into tiny package, the D6T is believed to offer the highest signal-to-noise ratio (SNR) in the industry. It converts the sensor signal to a digital temperature output giving a straightforward interface to a microcontroller. The space saving design of the D6T, at only 14 x 8 x 8.93 mm for the largest 32 x 32 element version, makes it exceptionally well suited to temperature detection in a wide range of Internet-of-Things and other embedded applications.

#Pauto @OmronEurope @NeeshamPR

Dicing, bonding & electroplating facilites.

Sensera has acquired and qualified additional thin-film processing equipment including a dicing saw, a wafer bonder and an electroplating cell to meet the growing customer demand in this segment.

"We are very pleased to be able to expand our production capabilities, closely aligning ourselves with growing customer demand. This new production equipment substantially broadens our existing tool set and enables greater vertical integration and process control," said Tim Stucchi, GM/COO of the Sensera MicroDevices Division.

• The new dicing saw operates in either fully-automatic or semi-automatic mode for full wafer and custom cuts, featuring a positional accuracy down to 1 μm and a cutting speed of 300 mm/sec. It supports small pieces and allows for custom shaping of silicon, sapphire, Pyrex, quartz, ceramics and metals.

• Operating under high vacuum, precisely controlled temperature and high-pressure conditions, the new wafer bonder facilitates extremely demanding applications. Eutectic, thermal compressive, adhesive and anodic bonding processes with a wafer alignment accuracy of 2 μm have been smoothly integrated into Sensera's qualified processes, thus enabling the company to offer many wafer level packaging (WLP) solutions to its current and future customers in multiple applications and market spaces:

• Microfluidic devices for bio-analysis, medical research and drug development • Pressure sensors for human implantable surgical devices • Precision accelerometer and gyroscope devices for geo-positioning • Micro-mirror devices for laser based Automotive self-driving applications

The wafer bond chamber is configurable to process small coupons (from ~10 mm2) and wafer diameters from 25 mm (1”) up to 200 mm (8").

• The electroplating cell is able to plate and electroform wafers or discreet parts up to a size of 200 mm (8"). Typical applications include MEMS, Integrated Circuits (IC) on silicon, gallium arsenide and similar glass-type substrates. Sensera's qualified processes achieve exceptionally low residual stress and enable tight thickness uniformity control.

"To drive down cycle times, improve quality control and reduce costs, our fab requires ongoing capability upgrades," stated Ralph Schmitt, CEO of Sensera Inc. "Our objective here is to bring previously outsourced processes back in-house and to expand our internal capability to develop and produce complex MEMS products and solutions. The new dicer, bonder and electroplating cell are just some of the essential steps required to enable innovative development programs and commercial volume customer shipments.”

 @Sensera_Inc #Pauto #IIoT

Accelerometer has wide frequency range.

The new MEMS (Micro-Electro Mechanical System) miniature, single axis, capacitive accelerometers from Kistler,  have been designed for use in applications in automotive, aerospace, rail and other sectors where challenging environmental conditions may be encountered.

The wide frequency range from DC to 2 kHz and high operating temperature of +125°C combined with six measuring ranges from ±2g to ±200g means that the new accelerometers easily meet the demands of a wide variety of applications.

The sensing element and integral signal amplifier are enclosed in a fully hermetic, lightweight, welded titanium housing with integral ground isolation. A choice of industry standard 4-pin connector or an integral PTFE insulated cable both with temperature output for where external signal compensation is needed. The integrated signal amplifier provides a wide range of industry standard output signal options to interface with most current DAQ systems.

A hard anodised plate on the bottom of the sensor provides ground isolation when using adhesive mounting. For more demanding installations, the sensors are supplied with two screw holes with integral isolation inserts to ensure ground isolation in combination with the hard anodized plate.

The new sensor design is optimized for low frequency applications common to Aviation/Aerospace, Automotive, Civil Engineering Structures, Seismic and other R&D studies, especially where very low frequency measurements need to be made accurately, even under varying temperatures in exposed, outdoor environments.

 #Kistler #Pauto 

New markets for miniaturised gas sensors.

There is an increasing demand for monitoring environmental air conditions both indoors and outdoors, as poor air quality is a growing threat to the public health. It has caused more deaths annually than HIV/AIDS and malaria combined. Citizens are increasingly aware of this problem and are seeking low cost and user-friendly solution to monitor the air condition. This rising need will lead to a market of more than €2.5 billion ($3bn) by 2028, which is analysed and forecasted by the recently updated IDTechEx Research report Environmental Gas Sensors 2018-2028.

In this report, the focus has been on six major emerging market segments:

• Automotive
• Smart devices
• Wearable devices
• Smart home
• Smart city
• Air purifiers

The automotive industry currently dominates the gas sensor market with the goal of automating air flow into the drivers’ compartment. Automotive industry will remain an essential segment for the gas sensor in the coming years. However, IDTechEx expects to see a large rise in sales towards the integration of gas sensors with mobile and wearable devices. These devices will allow consumers to monitor the air conditions dynamically and then encourage them to take appropriate action Instantaneously.

Gas sensors will also play a key role in Internet of Things (IoT) development and will be used extensively in households and cities connected with digital technologies. Heating, ventilation and air conditioning (HVAC) systems, air purifiers, smart windows and other applications will employ sensors to improve the quality of life across the world. We expect a growing market for gas sensors in the smart homes and cities.

These new markets have emerged because new manufacturing methods are enabling the fabrication of smaller, lower power and more selective sensors. The sensor industry is at a tipping point, from expensive, bulky, high power instruments to cheap, small and low-power components.

Microelectromechanical systems (MEMS) and screen printing techniques facilitate the miniaturisation of gas sensors, which is the key to integrate gas sensors into consumer electronics, such as mobile phones and wearable devices. We envision a rapid growth in applying MEMS to gas sensors and making them more accessible in our daily lives.

The report lists the primary manufacturers of gas sensors and gives a SWOT analysis of ten relevant companies. A comprehensive study of current devices that rely on gas sensors for environmental monitoring is included. The report covers more than 40 profiles, gathered through primary research and interviews with the most transformative gas sensing companies across all the value chain.

An exhaustive view is given of the pivotal technologies that will be used in the next decade to monitor the air quality around the world. Ten-year forecasts across a range of market segments are provided with key trends and required technique throughout the session. IDTechEx predicts a significant rise in sales across several major segments, primarily in the mobile device and air purifier industries. Wearable devices will exhibit the fastest growth, with 40 times larger market in 2028 than now. As miniaturisation through MEMS becomes more available, gas sensors can reach their full potential, contributing to many new markets.

@IDTechEx #PAuto #IoT

MEMS Capacitive Accelerometers.

Silicon Designs, Inc. has introduced six new series of low-cost, high-performance MEMS capacitive accelerometers, in both traditional and smaller footprints.

These include the single axis Model 2220 or triaxial Model 2470, featuring aluminum housings and a standard 1 meter integral cable; the single axis Model 2240 or triaxial Model 2480, featuring hermetically sealed titanium housings and an integral connector; and the single axis Model 2276 or triaxial Model 2476, featuring aluminum housings and an integral connector. Each model is offered in full-scale standard ranges from ±2 g to ±400 g, along with choice of ±4V differential or 0.5V to 4.5V single ended output. Their expanded temperature performance to +125°C, as well as improved scale factor and bias temperature shifts, allows them to provide excellent long-term stability with an industry-best-in-class price-for-performance ratio. The accelerometers are also relatively insensitive to temperature changes and gradients.

Depending upon selected model, units feature a simple four-wire (single axis) or eight-wire (triaxial) connection; flexible response to either DC or AC acceleration (0-2000 Hz); low-impedance outputs, supporting up to 2000 feet of cable; and flexible operation from +8 to +32 VDC power. Each device is marked on its top and bottom surfaces with a serial number for traceability. A calibration test sheet is supplied with each unit, showing measured bias, scale factor, linearity, operating current, and frequency response. A simple test sequence, using the earth’s gravity, may be used to verify operation and calibration. 

#SDI #PAuto

Powerful sensor solutions worldwide!

A global distribution agreement with MEMSIC  has been announced by Mouser Electronics. MEMSIC is a world leader for the consumer electronics, communications, automotive, medical and industrial sensing sectors. Through the new agreement, Mouser will distribute MEMSIC micro-electromechanical systems (MEMS) sensors to customers worldwide.

The MEMSIC product line enables mobility and the Internet of Things (IOT) by combining all the essential elements for engineers’ application needs, including solutions for drones, mobile, wearable, industrial, medical and smart parking applications. The MEMSIC product line at Mouser Electronics features a variety of sensor products, including magnetic and e-compass products, accelerometers, 6-degree-of-freedom (DOF) and 9-DOF inertial measurement units (IMUs) and orientation sensors, and gas flow modules.

The MEMSIC MMC5883MA Anisotropic Magneto Resistive (AMR)-based three-axis magnetic sensor provides the industry’s highest accuracy, lowest noise, and lowest power consumption. The sensor provides 16-bit operation over a wide ± 8 Gauss operating range, and features linearity of ± 0.2 percent full scale range (FSR), hysteresis of 0.2 percent FSR, and repeatability of 0.2 percent FSR on each of its three axes. It exhibits extremely low current consumption of only 20µA at a data rate of seven samples per second and extremely low noise level of only 0.4 mGauss total RMS noise. Combining this performance in an industry-standard small LGA package the sensor addresses the ever-increasing demands of industrial and drone applications.

The ultra-low-cost  MXC6255XC/U DTOS accelerometers are two-axis motion and orientation sensors, based on MEMSICs proven MEMS thermal technology. The DTOS accelerometers allow designers to integrate key user interfaces, such as programmable “shake to change” menu navigation, TV/music channel selection, and vertical/horizontal picture orientation. The devices can also provide some basic game play control, fall-over detection in irons and other appliances, and other applications in mobile devices, toys, and consumer electronics.

The MFC2000 bi-directional digital MEMS gas flow sensors are more durable and provide high levels of measurement repeatability when compared to existing diaphragm or turbine-based gas flow meters. The silicon-based devices offer great power consumption characteristics, such as sleep-mode currents as low as 1 µA and typical operating currents of 3 mA. Other benefits include low 2.7 V–5.5 V supply operation, wide dynamic range with 3-percent or better accuracy, and the ability to provide the necessary performance over a 100:1 flow range. The architecture of the mass flow sensor modules is highly customizable for different flow rates and form factors optimized to application requirements. The gas flow sensors reduce the need for specialized machines in care centers, and enable gas flow-related medical equipment to be economically introduced into the home medical market.

#PAuto @MouserElec @MouserElecEU @MEMSsensortech

MEMS sensor development platform.

Combines world leading communication, sensor and development technologies

A new evaluation platform for MEMS and environmental sensors, created by linking the Cinterion® Concept Board by Gemalto to an STMicroelectronics NUCLEO expansion board has been introduced by Anglia Components.

Using source code supplied by Anglia, designers can request measurements such as temperature, humidity, pressure, co-ordinates and g-force from the on-board sensors using SMS communication or AT commands. The suite supports customers with the evaluation and design process by providing the tools and open source software required to facilitate further development using Java® as the design environment.

The Gemalto Cinterion Concept Board was specifically developed as an incubator to open up the creation of innovative Internet of Things M2M based systems to the huge and very innovative Java development community. The Board provides a simple environment that offers the developer everything that he or she needs to quickly transform exciting ideas into market ready M2M applications. The Board includes the powerful Cinterion M2M module offering global 2G and 3G cellular connectivity.

Anglia has harnessed the Concept Board to X-NUCLEO-IKS01A1, a motion MEMS and environmental sensor expansion board from STMicroelectronics. The board is designed around high performance STMicroelectronics accelerometer, gyroscope, magnetometer, humidity, temperature and pressure sensors.

Anglia has created a live online demonstration of the concept. An introductory video introduces the main features of the board, and illustrates the simple steps involved in connecting the hardware, getting the software running and controlling the boards using an SMS interface.  The video also illustrates the main features of the Gemalto Developer Zone, and its SensorLogic cloud based enablement platform, each offering a wealth of resources to speed the developer to a fully working design. Developers can try a pre-configured live board located at Anglia live for themselves by following the steps outlined here.

Commenting, Andrew Pockson, Divisional Marketing Manager of Anglia said, “By bringing together Cinterion’s communication technology, STMicroelectronics sensors and the Java development environment, we have created a tinderbox. Just the spark of creativity is needed to set the combination alight and create successful Internet of Things designs that transform the world.”

MEMS pressure sensors

This is a quick heads-up on International Frequency Sensor Association's (IFSA) newly published book titled, "MEMS Pressure Sensors: Fabrication and Process Optimization," from the pen of Parvej Ahmad Alvi Assistant Professor in the Department of Physics, School of Physical Sciences, Banasthali University, India.

So far, no book has described the step by step fabrication process sequence along with flow chart for fabrication of micro pressure sensors, and therefore, the book has been written taking into account various aspects of fabrication and designing of the pressure sensors as well as fabrication process optimization. A complete experimental detail before and after each step of fabrication of the sensor has also been discussed. Thus this may be said to be an unique book.

It will greatly benefit undergraduate and postgraduate students of MEMS and NEMS course, process engineers and technologists in the microelectronics industry as well as MEMS-based sensors manufacturers.

MEMS Pressure Sensors: Fabrication and Process Optimization, ISBN: 978-84-616-2207-8, 176 p., hardcover.

MEMS based inclination

New MEMS-based inclinometer with linear output

ASM has a new inclinometer, the PTAM27L series, based upon MEMS technology for single and dual axis tilt angle measurement. The compact, flat housing was designed for OEM applications. For single axis versions, the measurement ranges span from±15° to ±180°, in increments of 15°. For dual axis versions, the measurement ranges span from ±15° to ± 60°, in increments of 15°.

The new series is an extension of the POSITILT® family of MEMS based inclinometers. This wear-free sensing technology offers high resolution and is shock resistant. The housing is rated IP64 and with a height of only 10mm, the PTAM27L can be easily installed into the tightest locations.

The maximum measurement range is ±180° for the single axis and ±60°, both are available in increments of 15°.

Several analog outputs and the corresponding excitation voltages are available:

U2L = 0.5…10 V with 18…36 VDC,
U6L = 0.5…4.5 V with 5 V DC ±5% (ratiometric),
U8L = 0.5…4.5 V with 10…36 VDC and
I1L = 4…20 mA with 18…36 VDC.

The PTAM27L offers 0.1° resolution,±1° linearity and ±100 x 10-6/ C° temperature stability. The operating temperature range is 0 to 60 C° full scale.

Inclinometers

Compact Inclinometers for OEM applications introduced

ASM has introduced its smallest addition to the POSITILT® inclinometer series that is available in single and dual axis versions. By using MEMS technology, this new inclinometer PTAM20 series is packaged into a very compact, flat housing making it ideally suited for OEM applications. The measurement range for the single axis version is available from +/- 15° to +/- 180°, in increments of 15°. For the dual axis version, the measurement range is available from +/- 15° to +/- 60°, in increments of 15°.

Due to its small size of 7mm in height and 48 mm in diameter, the PTAM20 series inclinometer has been designed to fit into the tightest locations in OEM applications. The enclosure is rated IP60 which is suitable for many instrumentation functions.

The maximum measurement range for the single axis version is +/- 180° and +/- 60° for each axis in the dual axis version. Each version is available with smaller ranges in +/- 15° increments. Several analogue output types are available: 0.5-4.5 V, 0.5-10 V and 4-20 mA.
The resolution is 0.05° and the linearity is up to +/- 0.5°. Each version offers high shock resistance.