New entry-level 3D camera.

Introducing Ensenso S, camera manufacturer IDS Imaging Development Systems shows that the use of industrial-grade 3D technology does not have to be expensive. The 3D camera is particularly suitable for 3D applications that require budget-friendly, easy-to-integrate and industrial-grade camera technology. The new Ensenso S10 has an ultra-compact, IP65/67-protected housing and generates 3D data using laser point triangulation, supported by artificial intelligence. This makes the camera suitable for a wide range of applications – and delivers robust 3D information even in low ambient light.

Ensenso S10 is equipped with a 1.6 MP Sony sensor and operates on a laser-based 3D process. A narrow-band infrared laser projector creates a high-contrast dot pattern – even on objects with difficult surfaces or in low-light environments. The camera's laser point triangulation is accelerated by a neural network and enables reliable mapping of the captured pattern points to the hard-coded positions of the projection. This results in robust and geometrically precise 3D data with high depth accuracy. At object distances of 50 cm, the maximum deviation is only 0.6 mm. At full projector power, the Ensenso S10 3D system achieves up to 20 point clouds per second with consistently high quality and resolution.

With a rugged zinc die-cast housing, a 60° field of view and a working range of 0.5 to 3 metres, the 3D camera can be used universally and is suitable for industrial applications with high cost efficiency. Combined with the proven flexibility of the Ensenso SDK, it is also quickly and easily integrated into many applications where, for example, variant objects need to be safely gripped in large numbers or obstacles need to be detected for collision-free movements of robots and UAVs. The Ensenso S10 is also at home in logistics automation as well as in robotics or in the agricultural sector. Especially high-volume and price-sensitive projects can now benefit from 3D image processing in industrial quality.

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