Immersive technology explored.

The newest issue of the Mouser Electronics's Methods technology and solutions journal has been published. Immersive Technology, the third issue of volume four, offers a collection of articles that explore emerging technologies, including augmented reality (AR), extended reality (XR), mixed reality (MR), and virtual reality (VR), that are integral to living, working and studying in new sensory environments. 

“Immersive technologies like VR and AR are top of mind as innovative companies seek to redefine the way we collaborate, communicate, and spend time together,” says Kevin Hess, Mouser Electronics’ Senior Vice President of Marketing. “The newest issue of Methods goes beyond the hype to explain some of the most important technologies underpinning these new applications, and what they mean for the future of work and entertainment.”

The Immersive Technology issue features contributions from leading subjective matter experts in the fields of robotics, VR and immersive collaboration. The issue offers multiple articles on the technological advances and engineering challenges shaping new applications for new sensory applications, in addition to pieces on 3D sound and product creation.

In addition to the Methods technology and solutions journal, Mouser offers a broad range of technical resources for design engineers and buyers, including blogs and e-books. Mouser’s content hub features exclusive design resources, white papers, videos, and product information, allowing design engineers to break new ground in product development and innovation.

@MouserElecEU @Publite #PAuto #AugmentedReality

New products introduced!

Mouser Electronics makes it a priority to stock the newest products and technologies from over 700 manufacturer partners, giving customers an edge and helping speed time to market. Last month (May 2018), the company launched more than 218 new products ready for same-day shipment. Some of the products just introduced are: Texas Instruments OPT8241 Time-of-Flight Sensor Texas Instruments OPT8241 sensor combines time-of-flight (ToF) sensing with an analog-to-digital converter (ADC) and a versatile, programmable timing generator. The OPT8241 offers QVGA 320×240 resolution data at frame rates up to 150 fps. Semtech SX1261/SX1262 LoRa® Transceivers Designed for extended battery life with just 4.2 mA of active receive current consumption, the Semtech SX126x sub-GHz radio transceivers are ideal for long-range RF wireless applications and are fully compliant with the physical layer requirements of the LoRaWAN specification released by the LoRa Alliance™. Arduino MKR IoT Bundle  The Arduino MKR IoT Bundle includes a powerful Arduino MKR1000 board — which combines the functionality of the Arduino Zero with a Wi-Fi Shield — and components for 5 IoT projects with step-by-step online tutorials on the Arduino Project Hub online platform. Bourns ChipGuard® ESD Suppressors Bourns ChipGuard ESD suppressors are multilayer varistor (MLV) products designed to protect against electrostatic discharge (ESD) strikes.

Mouser strives to empower innovation among design engineers and buyers by delivering advanced technologies. Arguably the world’s widest selection of the latest semiconductors and electronic components for the newest design projects are stocked. Their website is continually updated and offers advanced search methods to help customers quickly locate inventory and it also houses data sheets, supplier-specific reference designs, application notes, technical design information, and engineering tools.

@MouserElecEU #PAuto #TandM

Competition encourages technological advancements.

Mouser Electronics is once again sponsoring the Create the Future Design Contest, a challenge to engineers and students worldwide to create the next great thing.

Mouser's valued manufacturers Intel® and Analog Devices, Inc. are joining to sponsor the 16th annual contest, produced by Tech Briefs Media Group, an SAE International Company. COMSOL is also a principal sponsor of the contest.

The grand prize winner receives worldwide recognition and a cash prize of $20,000 for an innovative product that benefits society and the economy. Previous contests have produced more than 12,000 design ideas from engineers, entrepreneurs and students in more than 100 countries. Last year's grand prize winner was HI-Light, a solar thermal chemical reactor, developed at Cornell University, that converts carbon monoxide and water into methanol and other high-value hydrocarbons.

"Fostering technical innovation is an investment in the future that will benefit everyone," said Kevin Hess, Mouser Electronics Senior Vice President of Marketing. "As a forward-looking company, Mouser is proud to have the continuing opportunity to support this important event for engineers and students around the world."

"Mouser Electronics is renowned for its support of innovation as well as for providing unmatched service to its customers and manufacturers," said Joseph Pramberger, President of Tech Briefs Media Group. "We are pleased to partner with such quality companies as Mouser, Intel and Analog Devices."

The Create the Future Design Contest brings attention to product designs that enhance quality of life, improve the efficiency and quality of healthcare or help to reduce dependence on nonrenewable energy sources. Previous grand prize-winning entries include an economical rapid screening device to prevent food-borne illness and a wheelchair propulsion system designed to increase the user's mobility while decreasing upper body repetitive strain injuries.

The contest was created in 2002 by the publishers of Tech Briefs magazine to help stimulate and reward engineering innovation. The grand prize winner will be chosen from the winners in seven entry categories: including Automotive/Transportation, Consumer Products, Electronics/Sensors/IoT, Machinery/Automation/Robotics, Medical, and Sustainable Technologies.

 @MouserElecEU #PAuto @TechWireIntl

3D-print design on International Space Station.

Mouser Electronics Inc. is teaming up with celebrity engineer Grant Imahara for the International Space Station (I.S.S.) Design Challenge, the newest series in the exciting Empowering Innovation Together™ program. Mouser is accepting entries for this incredible competition now through Oct. 7, 2016. The I.S.S. Design Challenge, co-sponsored by Mouser’s valued suppliers Amphenol and Intel®, is a call to college and university students, engineers, and makers, to create a 3D-printable project designed to help I.S.S. astronauts in space. Designs may include small electronics to be used with the object. All entries will be judged by Grant Imahara and a former commander of the I.S.S. “Imagine how exciting it would be to see your design made in space,” said Glenn Smith, President and CEO of Mouser Electronics, a leading global distributor of the newest semiconductors and electronic components. “We are really excited to present this unique contest. We hope our wide range of electronic components will enable people to create whatever their imagination sparks.” For the I.S.S. Design Challenge, Mouser has partnered with the Institute of Electrical and Electronics Engineers (IEEE), Made In Space along with Hackster and MacroFab. The winner of the I.S.S. Challenge will receive a 3D printer, a consultation with Made In Space — pioneers in additive manufacturing technology for use in the space environment — and the prestige of seeing their design 3D-printed aboard the I.S.S. “I love that this first-of-its-kind contest allows future engineers to build their confidence as a whole, and share in a global community of innovation,” said Grant Imahara. @MouserElec #ISS

USB Type-C receptacles.

Mouser Electronics, Inc. is now stocking the USB Type-C receptacle from TE Connectivity (TE), a world leader in connectivity. This new mid-mount connector provides data, power, and audio/video connectivity and transmission in a single solution. The receptacle is fully compliant with USB Type-C specifications and is designed to be small enough for handheld devices yet robust enough for industrial applications. TE’s USB Type-C receptacle, available from Mouser Electronics, features a reversible mating interface designed to accept a plug in any direction, enabling easy, reliable mating. The connector supports a variety of protocols and, with the use of adapters, is backwards-compatible to HDMI, VGA, DisplayPort and other types of connections from the single USB Type-C port. The connector supports scalable power charging, delivering up to 100W at 20V, and meets USB 3.1 protocols, giving it high throughput speeds up to 10Gbps plus backward-compatibility with USB 3.1 Gen 1, Gen 2 and USB 2.0. TE’s new USB Type-C connector features enhanced electromagnetic interference (EMI) shielding on the receptacle shell to help eliminate unwanted EMI leakage and provide enhanced performance over similar legacy products. It also offers additional connector board retention features compared to the industry standard footprint to provide enhanced reliability and ruggedness. The receptacle is suitable for a variety of applications, including factory automation, power chargers, medical devices, automotive infotainment systems, smartphones and tablets and wearable devices.