As the name suggests, Samtec’s RF edge launch connectors are installed on the edge of the board. Doing so makes it easy to align the launch pin with the circuit trace, which also helps to ensure proper ground alignment for preventing RF leakage. Samtec’s RF edge launch connectors compression mount to the printed circuit board instead of requiring solder. Proper alignment and the removal of solder allows for increased signal integrity performance capabilities (versus soldered edge launch, or even vertical or angled launch connectors).
The solderless design of the 185-EL, 240-EL and 292-EL Series connectors means they are reusable, also known as field replaceable; with up to 500 mating cycles, this makes them extremely cost-effective. Samtec’s RF edge launch connectors are easy to install and do not cause damage to a printed circuit board.
“When electrical performance is critical, edge launch connectors are often selected in lieu of vertical or angled launch connectors. Samtec worked to enhance the overall connector design for advanced impedance and VSWR performance over other edge launch connectors commonly found in the industry. Combined with Samtec’s Sudden Service® offerings, which include signal integrity and launch optimization services, we anticipate Samtec RF edge launch connectors to quickly find homes in the marketplace.” says David Beraun, RF Product Marketing & Development Manager at Samtec
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