Single device integration for process and factory automation.

FieldComm Group’s Strategic Integration Committee (SIC), composed of leading automation industry suppliers and Standards Development Organisations (SDOs), has announced the official timeline for releasing the updated Field Device Integration (FDI) Specification. This milestone marks a critical step toward unifying device integration across process, hybrid, and factory automation.

Following the transfer of FDT/DTM assets to FieldComm Group in 2024, the organisation has significantly accelerated its efforts toward unified device integration. The resulting roadmap is a product of coordinated work by the SIC and specialised working groups. Comprised of board-level companies from FieldComm Group along with key leaders from OPC Foundation, ODVA, and PROFIBUS & PROFINET International (PI), the SIC has led the harmonisation of FDI and FDT technologies. This collaboration aims to deliver a unified, intuitive, and scalable device integration standard that addresses the evolving needs of modern manufacturing, helping both end users and vendors.

Key enhancements in the updated FDI Specification:

• Compliance, incorporating the requirements of the Cyber Resilience Act (CRA)
• Unified device integration standard for process and factory automation
• Support for legacy systems, enabling modernisation without infrastructure replacement
• Real-time OT/IT connectivity through a common information model (PA-DIM)
• Support for modern platforms and development tools
• Empowering intelligent device and lifecycle management with protocol tunneling support, also known as nested communications

FDI specification timeline for migration:

• End of 2026: Release of the updated FDI Specification
• End of 2027: Deployment of the updated FDI Developer Toolkit
• 2029: Market availability of registered FDI-enabled systems and devices

"Today’s industrial systems are more complex than ever, yet this complexity must not compromise interoperability," said Steve Biegacki, Chair of the Strategic Integration Committee and former Managing Director of the FDT Group. "Our goal is to deliver a unified device integration solution that enhances data interoperability with OT/IT systems while supporting innovative features for modern manufacturing. This approach also provides a practical migration path, safeguarding existing investments and preparing the industry for future advancements."

“As a co-owner of the FDI specification, the OPC Foundation is committed to robust and interoperable device integration for OPC UA users and fully supports the harmonization of FDI and FDT technologies to achieve this goal,” said Stefan Hoppe, President of the OPC Foundation.

“ODVA is pleased to support the harmonization of FDI and FDT technologies to enable enhanced device integration interoperability for users of EtherNet/IP,” said Al Beydoun, President and Executive Director of ODVA.

“PI appreciates that the FieldComm Group initiated the valuable discussions to determine the need for merging FDI and FDT, taking into account the needs of interested companies, as well as the technologies of the four participating standards development associations,” said Dietmar Bohn, Executive Director of PI.

This update will enable manufacturers to transition toward more intelligent, responsive operations, unlocking the full value of industrial data and modern automation architectures.

FieldComm Group encourages automation stakeholders, vendors, integrators, and end users alike, to engage in this transition and follow key milestones.

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@FieldCommGroup @FDTGroup @OPCFoundation @ProfibusUK #PAuto #Standard

Standards group names President and Operations VP.

Dr. Al Beydoun has been appointed as President and Executive Director of ODVA.  He currently serves as ODVA's Vice President of Technology and Standards, brings a wealth of experience in engineering management and electronic systems development to the organization.

Dr Al Beydon

Dr. Beydoun began his career at Ford Motor Company and Visteon Corporation working in the design and development of powertrain controls products, before moving to Lear Corporation. At Lear, he served most recently as Director of Software and Systems engineering, supporting global markets with various electronic modules. Dr. Beydoun holds an undergraduate and a Master’s degree in Electrical Engineering from the University of Michigan, a Ph.D. in Electrical and Systems Engineering from Wayne State University, and an MBA from the Broad College of Business at Michigan State University.

Adrienne Meyer

The Board also announces that Ms. Adrienne Meyer has been appointed as Vice President of Operations and Membership. Ms. Meyer’s professional experience has focused overall on business operations for not-for-profit organizations and associations. She has held positions of increasing responsibility at ODVA, most recently serving as its Director of Membership and Operations. Ms. Meyer holds an MBA from the Ross School of Business at the University of Michigan.

"It is an exciting and dynamic time in the industry, as new technologies for IIOT and Ethernet are emerging that will enable customers utilizing CIP-based EtherNet/IP to adopt the technology in new applications and at new levels,” said Mr. Fabrice Jadot, Senior Vice President for Innovation & Technology and CTO, Industry Business for Schneider Electric and Chairman of the Board of ODVA. “With this leadership team, ODVA reinforces its strong organizational structure, which will allow it to continue to deliver innovative industry solutions.”

“The collective experience and knowledge that Dr. Beydoun and Ms. Meyer bring to the leadership of ODVA will enable the organization to continue to serve the vendor community and membership as we work to solve industry’s challenges,” said Dr. Jürgen Weinhofer, Vice President of Common Architecture and Technology at Rockwell Automation and ODVA Treasurer.

Ms. Katherine Voss, ODVA’s past president, is continuing to support the organization as an advisor in this transition. "Voss’s remarkable leadership of the organization served as a foundation for the growth of ODVA technologies, in particular EtherNet/IP. The Board recognizes her stewardship of the organization with deep appreciation."

#ODVA #PAuto 

Ethernet to the Field!

Organizations are cooperating to promote developments for Industrial Ethernet to expand use of EtherNet/IP™, HART-IP™ and PROFINET™ into hazardous locations in the process industry.

FieldComm Group, ODVA and PI (Profibus & Profinet International) have joined together to provide an update on developments that are underway to realize an advanced physical layer for Ethernet that can be used in process automation and instrumentation to connect field devices in remote and hazardous locations, commonly referred to as “APL.” The organizations were joined by representatives from suppliers of process instrumentation and controls in order to provide a well-rounded perspective on the benefits of an advanced physical layer for end users in the process industries, as well as discuss the actions being taken to complete the work needed to realize APL in process field devices.

They have announced the publication of a joint white paper, “Ethernet to the Field,” which lays out the vision and timeline for the realisation of an Ethernet technology suitable for use in remote and hazardous locations founding in the process industries. The organizations foresee that the first Ethernet-connected field devices for use in hazardous locations should appear in 2022. To achieve this result, the organizations are seeking to leverage the work currently underway in the IEEE 802.3cg Task Force, which is developing amendments to the IEEE 802.3 Ethernet standard for an Ethernet physical layer operating at 10 Mb/s over single-pair cable. Because of good progress for the specification of the long-reach solution (10BASE-T1L), it is planned that the IEEE 802.3 standard will include 10BASE-T1L by the end of 2019.

Experts of the APL project have already started the necessary additional developments to define the requirements and develop the necessary technology to achieve an Industrial Ethernet suitable for use in hazardous locations up to Zone 0, Division 1. To get the necessary approval, the experts work closely with a certification body for intrinsic safety to validate the developed Ex protection concepts and to prepare for standardization in the IEC.

Because the future developments for an advanced physical layer for Industrial Ethernet will provide significant benefits to end-users in the process industry at current & future events.

 @FieldCommGroup @ProfibusUK #PAuto #Fieldbus, @AllThingsPROFI