New addition to sales management team in USA!

The leading provider of high-precision micro-assembly equipment and customized electronics manufacturing solutions AMICRA Microtechnologies GmbH, has selected Joe Ettipio as Sales Manager for the U.S. Western Region. Mr. Ettipio will be responsible for the company's state-of-the-art portfolio of die bonder and flip-chip bonder systems, wafer inking systems, dispense and test systems, and other advanced technology solutions and services, working out of his home office in California.

Joe Ettipio

He is the second addition to the U.S. Sales management team this year, and will be responsible specifically for the Western region of the United States. Joe brings along with him 24 years of diverse experience as a technical sales professional, selling and working in the front and backend microelectronics and semiconductor industry, as well as medical and aerospace and defense facilities, predominately located throughout North America and Europe.

He received a Bachelor of Science degree in Electrical Engineering from the State University of New York at Buffalo. He got his start into the field as an Electrical Design Engineer for General Dynamics in San Diego, California, which was then followed with him holding Sales Manager positions at Orthodyne Electronics, covering the European community, and Palomar Technologies, specializing in the Western U.S. Through these sales management experiences, Joe has established a proven track-record of creating and optimizing business relationships and markets, successfully managing projects throughout all phases, and maximizing sales results.

Since then, Joe has held several high-ranking leadership positions including being President of JPE Sales, Inc., Director of Sales (Americas) for F&K Delvotec, as well as serving the past 4 years as Director of Sales & Business Development (Worldwide) for McBain Systems.

From these positions he has solidified expertise in the area of die attach, wire bonding, inspection and measurement solutions as well as equipment customization to fit technically challenging niche applications requiring specialized optics, high accuracy motion control, automation and more. All of Ettipio’s experiences have given him an understanding on how to define and deliver solutions for complex customer requirements, and a dedication to boost customer satisfaction by meticulously managing projects from inception through installation and follow up.

New person joins international management team

Mr. Heng Song Lim has joined the international sales management team for AMICRA Microtechnologies' state-of-the-art portfolio of die bonders, flip-chip bonder systems, dispense and test systems, wafer Inking and other advanced technology solutions and services.

Heng Song Lim brings his proven global business acumen in the electronics industry to his new position at AMICRA. Prior to joining AMICRA, he served as Asia Pacific Business Manager for Nordson March Plasma System Inc., marketing advanced plasma equipment for die and wire bonding for semiconductor assembly. Before that, he worked for eight years as Sales and Marketing Manager at Shinkawa Singapore Private Ltd., and for nine years at ESEC (Asia Pacific) Private Ltd, where he rose from Sales and Marketing Engineer to Manager.

In addition to his broad-based professional experience, Heng Song Lim has an impressive educational background, with an MBA degree from the Royal Melbourne Institute of Technology/Singapore Institute of Management University. He holds a bachelor degree in business administration, a graduate diploma in marketing management and in management studies, plus an NTC-2 degree in electronic engineering from Singapore Technical Institute. "We are very pleased to welcome Heng Song Lim to our successful international management team," said Johann Weinhändler, Managing Director of AMICRA. "We are looking forward to a long-term fruitful relationship."

With the strategic management and leadership of Dr Johann Weinhaendler, Horst Lapsien and Rudolf Kaiser, and the dedicated team of highly experienced technical and manufacturing professionals, AMICRA has amassed more than 15 years of know-how in advanced micro-assembly solutions for the semiconductor back-end applications, fiber optics, LEDs, optical sensor and opto-electronics, and MEMS manufacturing.

AMICRA's state-of-the-art die bonder is the AFCPlus, a die bonder and flip-chip bonder that offers exceptional precision and extremely high placement accuracy. AFCPlus is designed for ultra-high-precision bonding at an accuracy of +0.5 µm at 3 Sigma. New to the AMICRA portfolio is the NOVAPlus die bonder and flip-chip bonder system, a dual-head die bonder / flip-chip bonder, which offers high precision bonding (+2.5 μm at 3 Sigma) and high speed (<3 2013="" a="" also="" and="" are="" at="" both="" events.="" exhibiting="" francisco="" href="http://www.semicontaiwan.org/en/" in="" industry="" leading="" other="" presented="" recent="" san="" sec="" semicon="" systems="" target="_blank" the="" they="" were="" west="">Semicon Taiwan 2013

in Booth 1024 (4-6/9/2013).