Advanced silicon photonics technology

MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, teams up with ePIXfab, the European Silicon Photonics support centre providing low-cost prototyping services for photonic ICs. The partnership gives MOSIS' customers access to imec’s state-of-the-art fully integrated silicon photonics processes and Tyndall’s advanced silicon photonics packaging technology.

Packaged passive silicon photonics chip. 

Imec, silicon photonic chip; 

Tyndall, fibre array packaging.

Imec’s silicon photonics platform enables cost-effective R&D of silicon photonic ICs for high-performance optical transceivers (25Gb/s and beyond) for telecom, datacom, and optical sensing for life science applications. The offered integrated components include low-loss waveguides, efficient grating couplers, high-speed silicon electro-optic modulators and high-speed germanium waveguide photo-detectors. A comprehensive design kit to access imec technologies will be provided. Moreover, the Tyndall National Institute, being a partner of ePIXfab, offers the ability to provide packaged silicon photonics devices. This includes the design and fabrication of custom photonic packages, fibre coupling (single and arrays) and electrical interconnects. Designs rules to support these packaging capabilities will also be provided.

“Imec’s Silicon Photonics platform provides robust performance, and solutions to integrated photonics products. Companies can benefit from imec silicon photonics capability through established standard cells, or explore the functionality of their own designs in MultiProject Wafer runs,” stated Philippe Absil, program director at imec. “With this collaboration MOSIS will offer its first access to a mature Silicon Photonics infrastructure, with the option for follow on production” added Wes Hansford, MOSIS Director.

The first ePIXfab-Europractice run for passive silicon photonics ICs is open for registration from June 2013 with design deadline September 9th 2013. MOSIS' customers can register for this run and obtain the design kit via MOSIS in June 2013.

Imec’s Si Photonics 200mm wafer platform offers extensive design flexibility and includes:
• Tight within-wafer silicon thickness variation 3sigma < 2.5nm
• 3-level patterning of 220nm top Si layer (193nm optical lithography)
• poly-Si overlay and patterning (193nm optical lithography)
• 3-level n-type implants and 3-level p-type implants in Si
• Ge epitaxial growth on Si and p-type and n-type implants in Ge
• Local NiSi contacts, Tungsten vias and Cu metal interconnects
• Al bond pads
• Validated cell library with fibre couplers, polarization rotators, highly efficient carrier depletion modulators and ultra-compact Ge waveguide photo-detectors with low dark current. 
• Design kit support for IPKISS framework, PhoeniX Software and Mentor Graphics software
Tyndall’s Si Photonics Packaging Technology enables
• Passive device packaging , single and mult-fibre arrays to grating couplers
• Active device packaging, modulators and detectors with electrical ports and fibre arrays
• Custom packaging requirements (mechanical, thermal stability etc.)

$1.5m for advanced research programme

Intel Corporation signs $1.5million advanced research programme with Tyndall National Institute

Intel Corporation has given details of a 3 year, $1.5million advanced research collaboration signed with Ireland’s leading ICT research Institute, Tyndall National Institute. The agreement is the first of a kind for Intel in Ireland and establishes a direct collaboration between Tyndall and the heart of Intel’s technology research group in the US. Intel has only one other such agreement in Europe. The agreement will provide Intel with a commercial exploitation license to technology created through the collaboration with Tyndall.

Who was John Tyndall? John Tyndall must rank as one of Ireland’s most successful scientists and educators. He reached the pinnacle of 19th century science and counted amongst his friends and collaborators many of the best-known scientists of that century. Born in Leighlinbridge, County Carlow, his early education has been likened to the “hedge school” variety, but the expert tutelage of his teacher, John Conwill, ensured he had a solid foundations in mathematics, English composition, drawing and surveying. Read more:

Intel continually raises the bar on innovation and excellence in its industry. Under the agreement Tyndall and Intel Researchers will investigate next generation materials, devices and photonics technologies that could have a profound impact on the performance and direction of future electronic devices.

Ireland's Minister for Enterprise, Trade and Innovation, Batt O’Keeffe TD welcomed the Intel-Tyndall advanced research agreement, saying it signalled an important collaboration between industry and higher education. 'The Innovation Taskforce Report called for greater collaboration between industry and academia in producing more commercially strategic and market-focused research outputs. By driving the collaboration agenda, the Government is laying a sustainable growth path based on new high-quality jobs and innovative products and services. Intel's investment shows Ireland has the high-quality research infrastructure and human capital needed to develop cutting-edge technologies for globally competitive markets. The role of Tyndall National Institute, Ireland's leading high-tech research institute, to host the research work reaffirms its reputation for aligning with the needs of indigenous and multinational firms.'

Speaking at the announcement Mike Mayberry, (Director Components Research, VP Technology and Manufacturing Group) at Intel said “Intel and Tyndall have been working closely together for some time on a range of different technologies. This new agreement forms a direct relationship with Intel’s internal research group in Portland. Through their publications and technology, Tyndall researchers have demonstrated their ability to innovate and invent technologies that can advance the frontiers of semiconductor technology. We at Intel are excited to enter into this advanced research agreement with Tyndall and look forward to a productive collaboration with the team here

Tyndall CEO, Professor Roger Whatmore said, “This collaborative research program with Intel provides direct industry and market guidance to our research programs, helping to ensure that what we deliver is manufacturable, relevant and of benefit to society. We are delighted that this program includes the Junctionless Transistor device invented at Tyndall by Professor Jean-Pierre Colinge, as well as photonic and advanced interconnect technologies. The interactions with the engineers and scientists within Intel, the world’s leading semiconductor company, will enable us to advance our technologies to the marketplace much more rapidly than we could possibly do on our own. “

“This agreement with Intel, is a direct result of the investments over the past 10 years by Science Foundation Ireland (SFI), the Higher Education Authority (HEA) and the Industrial Development Authority (IDA), which has attracted leading scientists and built word-class research facilities in Ireland. Now, more than ever, it is essential that the government maintains its investment in R&D if Institutes such as Tyndall are to continue to be key attractors for foreign direct investment” said Professor Whatmore.

Barry O’Leary, IDA CEO said, ‘The decision by Intel to further build on its collaboratory relationship with the Tyndall Institute is evidence of the strength of Ireland’s Research and Development landscape. This exciting partnership brings the Research and Development already carried out between Intel and Tyndall one step closer to commercial realisation. Research and Development plays a vital role in Ireland’s Foreign Direct Investment and further embeds existing jobs here. I look forward to supporting Intel and Tyndall as they continue to work together in the development of next generation technologies that will potentially impact the direction of future electronic devices.’