Developing open resource for roboticists.

ADLINK Technology is now part of the Open Robotics ROS 2 Technical Steering Committee (TSC).

Current members include
• ADLINK Technology
• Amazon
• Apex.AI
• Arm
• Bosch
• Canonical
• eProsima
• Intel
• LG Electronics
• Microsoft
• Open Robotics
• ROBOTIS
• Samsung
• TARDEC
• Tier IV
• Toyota Research Institute

The Robot Operating System (ROS) is the world’s leading open source resource for roboticists. The ROS 2 TSC sets the technical direction for open robotics and is made of organizations actively contributing to the development and success of ROS 2.

ADLINK’s contributions to the ROS 2 TSC are focused on:

• ROS Middleware (RMW) improvements for flexibility & performance via OMG Data Distribution Service (DDS) capabilities & best practices. • ROS 2 contributions for open source Vortex OpenSplice and Eclipse Cyclone DDS, an open source Eclipse IoT project that is suited for autonomous mobile robots (AMR). • Working to establish an Edge AI Working Group with fellow TSC members and contributing deep expertise in edge AI for machine vision.

"We're excited by ADLINK’s contributions and to have them join the ROS 2 TSC. Their contributions will help enable our vision of an open source robotics ecosystem." says Brian Gerkey, CEO of Open Robotics.

“ROS 2 is the future of robots, autonomous vehicles and industrial automation. It will be everywhere.” says Joe Speed, ADLINK Technology Field CTO, ROS 2 TSC representative and OMG board member.

The ROS 2 TSC was launched in Sept. 2018 to broaden participation in ROS 2 development and accelerate ROS 2 delivery.

#Robotics #PAuto @ADLINK_Tech @OpenRoboticsOrg

Driver machine interface.

Adlink Technology has  released its latest Driver Machine Interface (DMI) touch panel computer, the DMI-1210, designed specifically for train control and driver information display.

Powered by the Intel Atom® x5-E3930 processor (formerly Apollo Lake) and featuring a 12.1” (4:3) high resolution color display, 5-wire resistive touch screen and securable I/O interface, the DMI-1210 can be deployed as an HMI unit for driver’s desks, control panel for passenger information systems, surveillance system control/display unit or in railway diagnostics and communications applications.

The DMI-1210 is an EN 50155 certificated, cost-effective, commercial-off-the-shelf (COTS) driver interface that offers train radio display, electronic timetable, and diagnostic display functions and additional functionality such as train data recorder. The DMI-1210 supports full range DC power input from +16.8V to +137.5V DC. Optional MVB, GNSS, 3G/LTE, WLAN, and Bluetooth through add-on modules give system integrators the necessary tools to expand use case possibilities. With Adlink’s built-in Smart Embedded Management Agent (SEMA) management and status LEDs on the front panel, the DMI-1210 provides easy and effective health monitoring and system maintenance. In addition, system robustness and reliability are provided by careful component selection for extended temperature operation, isolated I/Os, conformal coated circuit boards, securable I/O connectors and high ingress protection rating (IP65 front, IP42 rear).

“By leveraging more than 20 years of expertise in developing highly reliable and available embedded computing systems, Adlinkis a premier supplier to the rail market, enabling both wayside and onboard applications, such as Communications Based Train Control (CBTC), Automatic Train Protection (ATP), Automatic Train Operation (ATO), Automatic Train Supervision (ATS), Computer Based Interlocking (CBI) and Train Control Center (TCC), Passenger Information, and Passenger Wi-Fi. We offer not only a field-proven, cost-effective and extensive COTS portfolio, but also a variety of fast time-to-market custom solutions with best-in-class ODM capabilities,” said Crystal Tseng, ADLINK senior product manager.

“The addition of the DMI-1210 further strengthens our EN 50155-compliant product portfolio and enables us to better serve our customers with its superior reliability and versatility. By leveraging our long-standing strategic partnerships with major processor and software vendors, we ensure best practices in lifecycle management and product obsolescence to deliver the supply longevity required by the industry. ADLINK offers design services in every major geographic region, benefiting customers with increased responsiveness, short delivery lead-time and ease of doing business.”

Designed to meet harsh operating requirements, their industry standard compliant, rugged product portfolio provides customers with a great level of flexibility in technology and roadmap planning.

@ADLINK_Tech #Transport 

Collaborating Innovator in network configuration.

ADLINK is now a Collaborating Innovator of the Open Networking Foundation (ONF) operator-led consortium. ADLINK and its broad range of strategic ecosystem partners continue to play an increasingly important role in influential industry consortiums such as ONF, Central Office Re-architected as a Datacenter (CORD) and Open Compute Project (OCP) by working together on advanced, open architecture business initiatives.

As an open, collaborative, non-profit consortium driving transformation of network infrastructure and carrier business models, the ONF serves as the umbrella for a number of projects, building solutions by leveraging network disaggregation, white box economics, open source software and software-defined standards to revolutionize the carrier industry. Working closely with leading communication service providers and equipment vendors on various open source projects, the ONF leverages its released reference designs to facilitate the roll-out of next-generation networking solutions, significantly driving down both Capex and Opex for the whole ecosystem and opening up enormous business opportunities for new services.

“Telecom operators are driving solutions based on open hardware and software architectures, enabling infrastructure for quick time-to-revenue while lowering TCO for emerging Edge and 5G deployment. At this inflection point, the ONF is well positioned to catalyze a transformation of the networking industry with its newly established strategic plan,” said Jeff Sharpe, ADLINK director of product strategy and business development for networking and communications. “We are very excited to join and contribute to ONF, as we will be able to leverage the ONF’s community resources and reference designs to develop next-generation networking solutions. Our ultimate goal is to bring ADLINK’s innovation and unique value proposition for network transformation to the carrier industry.”

ADLINK began its focus on open architecture by becoming a major contributor to the OCP more than five years ago. At the ONF, ADLINK will leverage its Open Compute Carrier-grade Edge Reference Architecture (OCCERA), OCP and GPU-based solutions to develop next-generation networking and communications platforms, enabling use cases such as Advanced Multi-access Edge Computing (AMEC), universal Customer Premises Equipment (uCPE) and extremely low-latency Edge Compute platforms for 5G networks. ADLINK’s solutions will effectively address the requirements for low-latency, high-bandwidth and compute-intensive applications driven by the needs of security, deep packet inspection (DPI), Edge Computing, virtual network functions (VNF), 5G evolution and revenue producing solutions for operators.

As a leading ODM, ADLINK is an ideal contributor to the ONF-envisioned business model with its high quality design and manufacturing capabilities, producing cost-effective COTS/custom solutions with reduced time-to-market. ADLINK offers design services in every major geographic region, which benefits customers with increased responsiveness, short delivery lead-time and ease of doing business locally. ADLINK also ensures best practices in product lifecycle management by leveraging its long-standing strategic partnerships with major processor and software vendors.

@ADLINK_Tech  #PAuto @ONF_SDN

Smart camera with choice of software.

Users can choose, for the first time, the image processing platform that best suits their application needs and be guaranteed a rich range of image processing functionality.

Stemmer Imaging can offer Adlinks's x86 NEON-1021 smart camera pre-loaded with a choice of Teledyne DALSA Sherlock, Stemmer's Common Vision Blox or MVTec Merlic embedded software.

The NEON-1021 features Intel® AtomTM quad core 1.91 GHz processors for increased computing power. FPGA coprocessors and GPU deliver advanced image processing capabilities, both beyond the performance of conventional smart cameras. This allows the camera to process multiple complex inspection tasks simultaneously.

By offering ADLINK NEON smart cameras with a choice of pre-loaded machine vision software, Stemmer Imaging is giving system integrators and developers the option of selecting the development environment that most closely meets their needs. While saving them the time and effort for porting software from other x86 platforms, they can also provide advice on the most suitable image processing platform for developers, if required.

Sherlock is an extremely popular and flexible imaging development environment for vision integrators. Its rich suite of proven vision tools and advanced algorithms can be applied to a wide variety of automated inspection applications, while a graphical point and click program construction enables rapid prototyping. Standard tools within Sherlock include:

• Search (pattern finding)
• ID readers
• Character readers (OCR)
• Measurement and counting tools
• Contour tools
• Texture and colour classifiers.

A variety of speciality tools have also been included to simplify difficult inspection tasks such as the inspection of beads of material or measuring the height profiles of parts using laser lines.

Stemmer’s own Common Vision Blox is a powerful programming library for fast and reliable development and implementation of vision solutions. Common Vision Blox not only provides a range of optimised tools, but also offers the freedom to embed user’s own algorithmic know-how and to implement innovations quickly. These tools for machine vision professionals include:

• Unique tools – premium tools for applications that are not available elsewhere
• Search and read
• 3D analysis
• Recording
• Surface inspection 
• Colour processing

MVTec MERLIC is an all-in-one tool for quickly building machine vision applications with no programming requirement. The PC-based complete software solution features an image- centric user interface, intuitively guiding the user through the application.

The NEON-1021 features 2MP global shutter image sensors. A built-in PWM lighting control module eliminates the need for additional lighting controller equipment, reducing total cost of ownership. Optimized I/O includes one additional slave GigE Vision camera connection, 4x isolated input, 4x isolated output, and VGA output for maximized integration with external devices. Rugged construction with IP67-rated housing and M12 connectors enables the camera to withstand the harshest industrial environments 

@stemmerimaging  #PAuto @ADLINK_Tech 

Driving innovative business ideas and technologies in the IoT environment.

ADLINK Technology has been an active member of the globally represented M2M Alliance, a key driver for innovative business ideas and technologies in the IoT environment, since the beginning of last April (2015).

About M2M Alliance
With its 76 members in eleven countries M2M Alliance is the globally largest machine-to-machine industry association. The M2M Alliance regards itself as a platform and voice for vendors and users of M2M solutions. M2M Alliance’s primary objective is the promotion of M2M technologies and solutions. The association organizes the M2M Summit and publishes the annual yearbook M2M Journal and an email newsletter.

Since its foundation as the largest association of the machine-to-machine (M2M) industry, M2M Alliance regards itself as a platform and voice for vendors and users of M2M solutions. M2M Alliance’s primary objective is the promotion of M2M technologies and solutions. The alliance actively engages in the economic and technological concerns of its members and supports cooperation, networking and information exchange between industry sectors and enterprises. It helps members find ideal partners for hardware, software, integration and consulting in the M2M growth market.

According to Dirk Finstel, CEO EMEA at ADLINK Technology, the M2M Alliance offers its members a unique platform to exchange ideas and to present themselves to market leaders and trade visitors from around the world.

“Workshops and developer forums give participants the opportunity to learn about the latest developments and make valuable contacts to create the basis for new product and business ideas,” explained Finstel. “We see this as an essential platform to jointly promote M2M and the Internet of Things (IoT) to generate new possibilities for the industry and end users, as well. ADLINK and our customers will benefit from these new international resources.”

Eric Schneider, chairman of the M2M Alliance is pleased with this latest accession.

“We warmly welcome ADLINK Technology, another leading supplier of innovative M2M products and solutions in the embedded environment, as a new member of the M2M Alliance,” said Schneider. “It underlines the importance of our association and enhances the internal and external exchange of experience.”

PXI embedded controller with 4th generation Intel Core i7 Processor!

Their new PXIe-3985, its highest performing 3U PXIe embedded controller has been released by AdLink. It is equipped with the quad-core 4th gen. Intel® Core™ i7-4700EQ processor and operating at up to 3.4 GHz clock frequency (in single-core Turbo Boost Mode). With four links x4 or two links x16 and x8 PCI Express gen 2 link capability, up to 8 GB/s of total system throughput and up to 16 GB of DDR3L 1600 MHz RAM, the PXIe-3985 is the perfect choice for applications requiring intensive data analysis or processing and high-speed data streaming, such as in wireless, radar, or RF testing environments.

“As a sponsor member of the PXI System Alliance, ADLINK is continuously expanding its portfolio of PXI and PXI Express offerings with new generation Intel processors. We’re dedicated to providing test and measurement operators with the means to overcome testing task challenges at the lowest possible time to market.’’ stated Catherine Wu, Senior Product Director of ADLINK's Measurement and Automation Product Segment. “ADLINK leads the field in its introduction of the PXIe-3985 4th gen Intel® Core™ i7 processor-based controller. With the highest CPU and graphic performance on the market, we’re helping customers to increase their testing throughput and accelerate the testing process.’’

Based on PCI Express technology, the ADLINK PXIe-3985 can offer four links x4 or two links x16 and x8 PXI Express link capability for interfacing with a PXI Express chassis backplane. When configured in this combination, with a high performance PXI Express chassis such as the ADLINK 3U 18-slot PXES-2780 chassis, maximum system throughput of up to 8 GB/s is enabled, providing an effective solution for high bandwidth applications requiring intensive data analysis or processing and data streaming. In addition the PXIe-3985 features up to 16 GB of 1600 MHz DDR3L memory capacity, ideal for seamless execution in memory-intensive applications.

The ADLINK PXIe-3985 provides versatile I/O capability, including dual DisplayPort connectors with 4K 2K support, dual GbE ports, GPIB, four USB 2.0 ports, dual hi-speed USB 3.0 ports and trigger I/O for advanced PXI trigger functions. Easy connection with external standalone instruments or devices and innovative design such as dual BIOS backup, reduce maintenance efforts, with fast and easy swapping of battery, storage device, and SODIMM modules all deliver high availability in testing systems.

The PXIe-3985, supporting Windows 7 32/64-bit operating systems, is optimized when installed in the ADLINK 3U high capacity 18-slot PXES-2780 chassis or compact 9-slot PXES-2590 chassis, are winning combinations for a wide variety of testing and measurement applications.

Industry’s 1st Quad Core x86 smart camera!

A powerful, new generation x86 smart camera, NEON-1040 has been launched by Adlink. This camera features the quad core Intel® Atom™ processor E3845 1.9 GHz, 2048 x 2048 pixels @ 60 fps 1" monochrome CMOS global shutter image sensor, and PWM lighting control support. The quad core CPU increases computing power, and FPGA coprocessors and GPU deliver advanced image processing, both beyond the capabilities of conventional smart cameras. Rich software support and API compatibility further enable easy migration from original platforms, making it simple for system integrators to fulfill a variety of inspection application needs.

Key Features:

• Powerful: Quad core Intel® Atom™ processor E3845 1.91GHz
• Fast: 4MP, 60fps, monochrome global shutter CMOS sensor
• Rugged: IP67-rated housing and M12 connectors
• Precise: Advanced image processing support
• Cost-effective: Additional GigE Vision 1 slave camera support
• Economical: Built-in PWM lighting control
• Versatile: 4x digital inputs, 4x digital outputs, USB 2.0 and RS-232 ports
• Convenient: VGA output, max. 2560x1600 @60 Hz
• Simple deployment: Support for STEMMER Common Vision Blox, MVTec HALCON, and many others
• Open architecture: GeniCam , GenTL, Open CV and Open CL compatible

Powerful performance enables high speed complex captures
NEON-1040 provides not only high-end global shutter operation for high-speed captures, but also quad core Intel® Atom™ processors E3845 1.91GHz, dramatically improving on the performance of existing smart cameras. With FPGA coprocessor support, the NEON-1040 accelerates image pre-processing, including LUT (look up table) and ROI (region of interest), and shading correction, thereby reducing CPU loading and enabling complex acquisition at high speeds.

Easy development speeds time to market
“As the performance requirements for machine vision and industrial automation systems becoming more demanding, devices used require more synchronization and scalability. This means open architecture and simple software devolvement environments with multiple devices can greatly benefit developers, relieving them of the burdens of becoming familiar with additional application tools” said Neil Chen, product manager of Adlink’s vision product segment. “Adlink's NEON-1040 offers flexible software development support including GeniCAM, GenTL support for image acquisition, and Open CV and Open CL programming, significantly benefiting developers by easing migration from x86 platforms, and simplifying integration with motion, I/O, and other devices.”

Ruggedness, versatility, and maximum integration reduce TCO
The unit presents a minimal footprint at 68.5mm x 110mm x 52.7mm. Rugged construction, housed in a sturdy, dust-proof, washable IP-67-rated casing and M12 connectors allow it to withstand the harshest industrial environments, such as machine tooling and food/beverage packaging applications. The additional GigE port enables easy connectivity with external devices, such as GigE Vision slave cameras, and EtherCAT with I/O control modules. The built-in PMM lighting control conserves TCO while communicating with LED lighting. Versatile I/O support including 4x digital inputs, 4x digital outputs, USB 2.0 port, RS-232 ports, and VGA output, max. 2560x1600 @60 Hz, maximize convenience for factory automation users.

With optional Microsoft® Embedded Standard 7, support for 64-bit instruction, onboard 2 GB RAM and up to 32 GB storage, the camera embodies a stable, high performance software operating environment for high-speed machine vision applications. The NEON-1040 starter kit, including the Adlink x86 smart camera, LED lighting, lens, cable set, and terminal board, will be available in early July 2014. Their NEON-1020, 2MP @ 120 fps x86 smart camera will also be released at the same time.

Embedded computer!

ADLINK Technology has released the new Extreme Rugged™ HPERC-IBR system. The HPERC™ (High Performance Extreme Rugged Computer) Series offers a compact, highly reliable and efficient processing unit to meet challenging SWaP (Size, Weight and Power) requirements for modern ground and aerial vehicle applications. HPERC offers one of the first product implementations of the VITA-75 standard to address commercial off-the-shelf (COTS) requirements for Unmanned Ground Vehicle (UGV) applications.

“The HPERC system offers intense capabilities in a VITA-75 footprint, leveraging Intel® Core™ i7 processing power coupled with a GPGPU and a wealth of I/O support for camera and vehicle data busses,” said Jeff Munch, Director of ADLINK's Small Form Factor Product Center. “This solution can readily provide the necessary image processing and I/O required for UGV applications both today and in the future.”

In addition to the 3rd Generation Intel Core processor and optional GPGPU, the HPERC-IBR also offers DDR3L-1333 ECC soldered down memory up to 16GB, dual removable solid state drives with available RAID 0/1, as well as 4 USB 3.0, 2 USB 2.0, 4 Ethernet, 7 Serial, 8 GPIO, and 3 HDMI/DisplayPort/DVI interfaces. The HPERC-IBR also has expansion options to support fast and easy integration of additional interface cards such as PCI/104-Express and Mini PCI Express.

To endure harsh environments, the HPERC-IBR was developed using ADLINK’s Rugged by Design methodology to withstand extreme shock, corrosion and galvanic oxidation. The HPERC-IBR offers flexible cooling options: the HPERC-IBR-MC (-40°C to + 85°C) for cold-plate cooling and the HPERC-IBR-MH (-40°C to + 75°C) designed for natural convection cooling.
The ADLINK HPERC Series is compliant to VITA-75 20/21/22 small form factor mounting and provides a wide array of fast I/O via MIL-DTL-38999 connectors. Additional expansion interfaces to meet the demands of various sensor suites are easily added with user-defined I/O pins.

Novel twin channel CameraLink (PoCL) embedded vision computer

The EOS-4000 from Adlink is industry’s first 2 channel PoCL (Power over CameraLink) ready-to-deploy embedded vision pc system. With a 3rd generation Intel Core i5/i7 quad processor and compatible with PoCL cameras from Stemmer Imaging’s portfolio, the compact EOS-4000 allows high speed, high resolution imaging for industrial factory automation and medical imaging applications.

For applications requiring high data bandwidth and zero latency image acquisition, the EOS-4000’s dual independent PoCL ports provide data transfer up to 2.56 GByte/s, and pixel clock rates up to 85 MHz for high speed capture of large images. The system uses direct memory access to transmit image data directly from the camera to system memory, eliminating CPU loading during image acquisition. The EOS-4000 supports 64-bit memory addressing, benefiting large address space vision applications.

The rugged and compact (230 x 206 x 82 mm) EOS-4000 supports a two channel PoCL CameraLink base configuration, reducing cabling requirements and eliminating the need for external power adapters. It simplifies system installation and lowers maintenance costs.

The enhanced connectivity of the EOS-4000 provides a rich I/O capability, including trigger and encoder input and two independent RS-232 serial communication ports, reducing host computer loading. 64 isolated digital I/O connectors, digital filter, dual storage, internal USB port, and 1 kbit programmable EEPROM all ideally equip the EOS-4000 to integrate, deploy, and manage copy protection or authentication of software licenses for system development, further accelerating time to market.

High performance compute blades!

Designed to meet the performance and flexibility requirements of NEPs and TEMs.

ADLINK Technology has announced the aTCA-6200, a next-generation AdvancedTCA® (ATCA) processor blade that demonstrates their leadership in the development of high performance compute blades with flexible expansion capabilities. The aTCA-6200 features two 1.8 GHz eight-core Intel® Xeon® processors E5-2648L, the Intel® C604 chipset, DDR3-1600 memory up to 128GB and a PICMG® mid-size AMC bay. On-card connectivity includes dual 10GBASE-KX4 Fabric Interfaces, dual GbE Base Interfaces, dual front panel GbE egress ports, CFast socket and quad SAS channels which provide leading edge network performance and storage capabilities. The aTCA-6200 is ideal for carrier-grade applications such as media servers in IPTV, IP Multimedia Subsystem (IMS) broadband networks, and wireless infrastructures, providing telecom equipment manufacturers (TEMs) and network equipment providers (NEPs) with a flexible, cost-effective solution for mission critical applications and a reliable, smooth path for scalability and expansion.

“With its two eight-core Intel® Xeon® processors E5-2648L, eight sockets for DDR3-1600 VLP RDIMM memory up to 128GB capacity, and one mid-size AMC bay, the aTCA-6200 delivers the computing power of 32 concurrent threads, massive I/O and memory capacity, and flexible connectivity for high-end telecom and media server applications requiring carrier-grade performance,” stated Eric Kao, Director of ADLINK's Embedded Computing Product Segment.

“ADLINK’s aTCA-6200 is equipped with the latest Intel® Xeon® processor E5-2648L featuring an integrated memory controller and two Intel® QuickPath Interconnect (Intel® QPI) point-to-point link interfaces. Intel® QPI provides higher bandwidth with low latency connectivity from processor to processor at up to 8 GT/s,” stated Steve Price, director of marketing, Communications Infrastructure Division, Intel. "With Intel® Hyper-Threading Technology and Intel® Turbo Boost Technology, the Intel® Xeon® processors E5-2648L increase the performance of both multi-threaded as well as single-threaded workloads and energy efficiency.”

ADLINK’s new aTCA-6200 provides high-speed data-transfer on the PICMG 3.1 Fabric Interface enabled by an Intel® 82599EB 10GbE Ethernet controller and Base Interface connectivity provided by Intel® 82576EB Gigabit Ethernet controllers. Versatile storage support includes four channels of SAS RAID 0/1, onboard bootable CFast socket, onboard 2.5” SATA drive space, and modular Fabric riser card for additional PICMG Fabric Interface protocols. The mid-size AMC bay supports AMC.1 PCI Express and Advanced Switching, AMC.2 Gigabit Ethernet and AMC.3 SATA/SAS storage expansion. I/O features of the aTCA-6200 include Base Interface channels, Fabric Interface channels and front/rear egress ports. Front panel I/O includes two RJ-45 GbE ports, three USB 2.0 ports, an RJ-45 to DB-9 standard serial port and a DB-15 connector for analog graphics output.

Supporting high-speed serial point-to-point connections

ADLINK Technology  has introduced the cPCI-3970 Series, the first 3U CompactPCI PlusIO compatible processor blade in its product lineup that supports high-speed serial point-to-point connections.

The ADLINK cPCI-3970 Series is equipped with the latest quad and dual core 2^nd Generation Intel^® Core™ i7/i5 processor with ECC memory support, and the Intel^® QM67 Platform Controller Hub (PCH). It is a high performance solution for applications in industrial control and automation, transportation, and medical segments that require enhanced graphics capabilities, ECC memory and high speed I/O interconnects.

The cPCI-3970 Series includes two blade types based on the same electrical and mechanical design: the cPCI-3970 which is equipped with HM connectors, and the fully PICMG 2.30 compliant cPCI-3971 which features an Ultra Hard Metric (UHM) J2 connector with a data transfer speed of 5 Gb/s. Both products are compatible with the CompactPCI PlusIO pin assignment and support PCI Express Gen2 x4, three SATA ports, three USB 2.0 ports and two Gigabit Ethernet ports at the J2 connector.

“ADLINK’s cPCI-3970 Series has an outstanding performance-per-watt ratio and is designed for maximum interoperability, expandability and flexibility," states Eric Kao, Director of ADLINK's Modular Computing Product Center. "CompactPCI PlusIO compatibility allows the cPCI-3971 to be electrically and mechanically backward compatible with CompactPCI and paves a smooth path for upgrading the legacy CompactPCI parallel bus to modern high speed serial interfaces. It can work in hybrid backplanes with a legacy 32-bit/33MHz CompactPCI bus for existing CompactPCI peripherals and modern high speed point-to-point serial connections. The cPCI-3970 Series is well suited for the requirements of today’s embedded applications.”

“ADLINK's cPCI-3970 Series is equipped with the 2^nd Generation Intel^® Core™ i7 processor and the Intel^® QM67 PCH. This powerful combination provides built-in HD graphics, smart multi-tasking capabilities and improved power efficiency. Intel^® Hyper-Threading Technology and Intel^® Turbo Boost Technology 2.0 are supported to use processor resources more efficiently with multiple threads to running on each core and dynamically adapt processor frequency to match the workload,” said Matt Langman, marketing director of Intel’s Embedded Computing Division.”

The cPCI-3970 Series is a 3U CompactPCI blade with rich features for different applications. For high density computing applications, it can operate in a system slot as a master or in a peripheral slot as a standalone blade. In addition, the cPCI-3970 Series is compliant with the PICMG 2.9 specification and supports system management functions based on the Intelligent Platform Management Interface (IPMI) as well as hardware monitoring of physical characteristics such as CPU and system temperature, DC voltages and power status. With different riser cards installed and the addition of a Rear Transition Module (RTM), the cPCI-3970 Series provides versatile I/O interfaces up to two DisplayPort/DVI/HDMI, four serial ports, four SATA ports, five USB 2.0 ports, four GbE ports, PS/2 KB/MS, audio ports, and one PMC/XMC site for expansion flexibility. Trusted Platform Module (TPM 1.2) is also supported to provide efficient hardware-based data protection.

The  cPCI-3970 Series supports up to two dual-mode DisplayPorts for dual independent digital display outputs. The DisplayPort supports single link DVI or HDMI by passive adapter cable and analog VGA interface by active adapter cable. With the ADLINK XMC-G460 graphics module installed in the XMC site, the cPCI-3970 Series supports up to four independent displays. Storage interfaces supported by the cPCI-3970 Series include one SATA 6 Gb/s direct connector for a 2.5” HDD/SSD, CompactFlash socket, CFast socket and three SATA ports on RTM with RAID 0/1/5/10 support.

The ADLINK cPCI-3970 Series supports the following operating systems: Microsoft Windows^® XP, Microsoft Windows^® 7, RedHat Enterprise Linux 6 and VxWorks.

High-speed PCI express digitizer

AdlinkTechnology has released the PCIe-9842, their PCI Express digitizer providing an impressive 200 MS/s sampling rate of 14 bits of data across one channel. The PCIe-9842 is specifically designed for applications such as light detection and ranging (LIDAR) tests, optical fiber tests, and radar signal acquisition. Its 100 MHz bandwidth analog input is designed to receive ±1V high-speed signals with 50 Ω impedance. With this simplified front-end design and highly stable onboard reference, the PCIe-9842 provides not only high-accuracy measurement results but also delivers high-dynamic performance.

For applications that require data to be acquired and transferred in real-time, the PCIe-9842 is designed on the PCI Express x4 bus interface to provide adequate bandwidth for real-time transfers. As the signal is converted from analog to digital, the data will be transferred directly and continuously at a sustained 400 MB/s rate to the host system memory. End-users will further benefit from a typical dynamic performance that includes a 11.3 effective number of bits (ENOBs) and a 70 dB signal-to-noise ratio (SNR) with an input frequency of a 10 MHz sine wave.

“The benefits of PCIe-9842’s exceptional dynamic characteristics will be especially evident in radar signal acquisition, high-speed RF spectrum monitoring, and optical signal detection applications,” stated Catherine Wu, Product Director at ADLINK. “We designed the PCIe-9842 as a cost and feature optimized solution to provide our customers with an ideal digitizer solution.”

Adlink not only provides legacy drivers for users to develop using Microsoft C++ and Visual Basic, but also a task-oriented driver (DAQPilot) to accelerate the development cycle. Express VIs and Polymorphic Vis for the PCIe-9842 also provide a quick and simple way to operate the digitizer in LabVIEW®.

Fastest SATA 6 Gb/s industrial grade SSDs

The ADLINK ASD Series of SSDs is highly reliable, has an extended operating temperature range, and is able to withstand high levels of shock and vibration. ADLINK SSDs are ideal for applications in telecom, defense, medical, industrial automation and transportation.

AdLink Technology presents their ASD Series of industrial grade solid state drives (SSDs). The AdLink ASD Series is designed to meet the needs of today's mission critical applications in severe environments and reduce time-to-market for rugged platform integrators who require comprehensive solutions to provide embedded platforms with high availability, performance and reliability. These ASD SSDs provide a SATA 6 Gb/s (SATA III) interface to match the data transfer capabilities of 2nd generation Intel® Core™ processor-based platforms and have the fastest read/write speeds available on the industrial market. The AdLink ASD Series offers reliability, ruggedness and extreme performance, allowing AdLink to provide a complete storage solution for its customers.

These industrial grade SSDs deliver low latency with less than 1ms access time, power consumption as low as 2 watts, high reliability and high capacity. The series is available in 2.5”, 1.8” and JEDEC MO-297 (Half-Slim) form factors and is designed for use in enterprise, industrial and embedded computing platforms in fields such as defense, telecom, transportation, industrial automation and medical.

The AdLink ASD Series is well-suited for rugged and embedded environments. It supports a wide operating temperature range from -40°C to 85°C and is resistant to high levels of shock (1,500G/0.5msec) and vibration 3.08G (7-800Hz). SSDs have no spin-up time, seek time or rotational latency, resulting in faster system boot and shorter application load time compared to conventional hard drives. To provide additional reliability, they implement wear-leveling and hardware ECC, resulting in years of reliable operation with minimal maintenance and a mean time between failures (MTBF) of up to 2 million hours.

“Our customers depend on AdLink to provide a total solution in a ruggedized format that is able to operate under the most demanding environmental conditions," stated Stephen Huang, Vice President of the Industrial Computing Product Segment of AdLink. "The AdLink industrial grade ASD SSD Series provides customers with the high data transfer rates of the SATA 6 Gb/s interface, high reliability and long product life in an industrial grade storage solution. With these advanced features and leading NAND flash controller technology, AdLink continues to provide customers with high quality solutions and reliable product support. Our new line of industrial grade SSDs meets the requirements of transportation, avionics, factory floor, and other rugged applications with extended temperature requirements.”

Built using high speed SLC/MLC NAND flash with Toggle-Mode and advanced controller technology, the AdLink ASD Series offers high speed performance of up to 470MB/sec sequential read and 385MB/sec sequential write speed (2.5" 128GB SLC). With no moving parts, ASD SSDs are designed to deliver the durability required by portable devices that are frequently dropped or jostled. In addition to the 2.5" form factor, the AdLink ASD Series offers models in 1.8" form factor with Micro SATA connector and in Half-Slim form factor to provide design flexibility for customers seeking to create next generation ultra-thin rugged devices based on the standard SATA interface. For smoother integration of embedded platforms, the AdLink ASD Series is compatible with the latest Intel-based platforms. Product descriptions and features of the AdLink ASD Series are summarized in Table 1 below: