Ai computing series.

The launch of the Innodisk AI on Dragonwing computing series, developed in collaboration with Qualcomm Technologies has just been announced. The flagship EXMP-Q911 COM-HPC Mini module delivers up to 100 TOPS of AI performance while maintaining low power consumption and wide-temperature reliability from -40°C to 85°C. The Qualcomm Dragonwing™ SoCs also offers longevity support through 2038, ensuring supply stability for long-term industrial deployments. As the first product line within Innodisk’s AI on ARM portfolio, the series opens a new chapter for customers seeking sustainable and scalable ARM-based Edge AI solutions.

“With Innodisk’s new AI on Dragonwing series, we’re making advanced edge intelligence more accessible and scalable for industrial customers,” stated Anand Venkatesan, Senior Director, Product Management and Head of Industrial Processors, Qualcomm Technologies, Inc. “By pairing Qualcomm Dragonwing™ SoCs with Innodisk’s in‑house software and peripherals, OEMs can accelerate development and deploy with the performance, efficiency, and reliability they need—today and over the long term.”

The AI on ARM portfolio marks a key milestone in the collaboration between Innodisk and Qualcomm. The efficient architecture of the Qualcomm Dragonwing™ SoCs delivers exceptional AI inference TOPS within strict thermal and power constraints in edge environments. Combined with Innodisk’s extensive in-house expertise in driver porting and peripheral integration, the AI on ARM line-up elevates the SoC’s capabilities, making it a robust foundation for industrial edge AI deployments. This new line-up also reflects a deep co-development effort from both companies, uniting joint hardware–software engineering and early-stage system design to drive next-generation edge intelligence.

This collaboration centres on the EXMP-Q911 COM-HPC Mini module, powered by the Qualcomm Dragonwing™ IQ-9075 processor featuring an 8-core Kryo Gen 6 CPU and an Adreno 663 GPU, supporting 100 TOPS of AI performance. Based on defined test scenarios , the EXMP-Q911 can achieve up to 10× higher AI inference FPS relative to similar modules.

The EXMP-Q911 integrates 36GB of LPDDR5X memory and 128GB of UFS 3.1 storage, along with a rich set of interfaces, including PCIe Gen4, USB 3.2, dual 2.5GbE LAN, dual DP1.2, MIPI CSI-2, CAN FD, and more, delivering strong connectivity for compact, performance-demanding edge systems.

Beyond hardware, Innodisk strengthens its offering with software tools, including IQ Studio, an open-source developer portal on GitHub that provides BSPs, reference code, benchmark tools, and a dedicated community space for developers. These resources help accelerate prototyping, testing, and system integration. In addition, Innodisk’s cloud-based management platform, iCAP, further enhances remote device and AI model management across distributed edge environments.

Built on the compact COM-HPC Mini form factor under the latest PICMG specification, the EXMP-Q911 offers next-generation expandability beyond COM Express Mini and streamlines OEM integration with faster development cycles. As a deployment-ready module, it can be directly embedded into customers’ self-designed carrier boards for seamless system integration and reduced development effort. For a fully optimised integration experience, the module delivers even greater capability when paired with Innodisk’s carrier boards and pre-validated peripherals, including MIPI and GMSL embedded cameras with fully ported drivers for VLM and computer-vision AI, along with modular M.2 expansion cards for networking, storage, and industrial I/O. This combination provides a ready-made solution for streamlined deployment.

Innodisk and Qualcomm Technologies expect to strengthen their collaboration across reference designs, demo kits, and go-to-market initiatives. The product portfolio will also incorporate Qualcomm’s Dragonwing™ IQX and IQ8 SoCs and future ARM platforms for industrial automation, defect detection, AGV/AMR, smart city applications, and a wide range of vertical markets.

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@Innodisk_Corp @Qualcomm @mepaxIntPR #PAuto #Ai

Validation for radio test station.

Hirokazu Hamada, the President of Anritsu Corporation has announced that Qualcomm Technologies, Inc. has validated Radio Communications Test Station MT8000A. This is now supported by the Qualcomm® Development Acceleration Resource Toolkit (QDART) for testing 5G NR Sub-6 GHz small cells using the Qualcomm 5G RAN Platform.

Different 5G small cells, such as femtocells, picocells, and microcells, all have different coverage. Small cell BTS are used when requiring high data rates and density in indoor areas and crowded places, such as shopping malls and sport stadiums. The Qualcomm® FSM100 5G RAN Platform is a very capable 5G NR small cell solution that is used widely by mobile operators. The platform is designed to help original equipment manufacturers (OEMs) reuse their software and hardware reference designs across Sub-6 GHz and mmWave products.

The MT8000A test solution supports non-signalling RF tests of 5G NR millimeter wave (mmWave) and Sub-6 GHz base stations (BTS). The 3GPP TS38.141-1 and TS38.141-2 compliant all-in-one MT8000A test solution cuts test times and costs when manufacturing 5G BTS radio units (RU).

OEMs of small cell Sub-6 GHz (FR1) infrastructure can use the QDART and MT8000A to test small cells while taking advantage of unique MT8000A features, such as high-quality parallel testing of multiple DUTs.

By offering this high-efficiency platform for testing Qualcomm Technologies’ small cell modem chipsets, Anritsu is contributing to the development and spread of 5G radio access networks.

@Anritsu @AnritsuEMEA @Qualcomm #TandM

Lifetime of innovation recognised!

Imec, the research and innovation hub in nanoelectronics and digital technologies, today presented its annual Lifetime of Innovation Award to Dr. Irwin Jacobs, Founding Chairman and CEO Emeritus of Qualcomm. The annual industry honor is presented to the individual who has significantly advanced the field of semiconductor technology. The formal presentation will be made at the global Imec Technology Forum (ITF) in May in Belgium.

Dr Irwin M. Jacobs

In making the announcement, Luc Van den hove, president and CEO of imec, said: “Irwin Jacobs’ many technological contributions laid the groundwork for creating the mobile industry and markets that we know today. Under his leadership, Qualcomm developed two-way mobile satellite communications and tracking systems deemed the most advanced in the world. He pioneered spread-spectrum technology and systems using CDMA (code division multiple access), which became a digital standard for cellular phone communications. Together, these technologies opened mobile communications to the global consumer market.”

Irwin Jacobs began his career first as an assistant and then associate professor of electrical engineering at MIT and, later, as professor of computer science and engineering at the University of California in San Diego. While at MIT, he co-authored Principles of Communication Engineering, a textbook still in use. He began his corporate life as a cofounder of Linkabit, which developed satellite encryption devices. In 1985, he co-founded Qualcomm, serving as CEO until 2005 and chairman through 2009. His numerous awards include the National Medal of Technology, the Marconi Prize, and the Carnegie Medal of Philanthropy. His honors include nine honorary degrees including doctor of engineering from the National Tsing Hua University, Taiwan.

Imec initiated the Lifetime of Innovation Award in 2015 at their annual global forum known as ITF (Imec Technology Forum). The award marks milestones that have transformed the semiconductor industry. The first recipient was Dr. Morris Chang, whose foundry model launched the fabless semiconductor industry, spurring creation of new innovative companies. In 2016, Gordon Moore was honored, creator of the famous Moore’s law theory and co-founder of Intel. Dr. Kinam Kim was honored in 2017 for his contributions in memory technologies and his visionary leadership at Samsung.

Luc Van den hove concluded, saying: “Our mission is to create innovation through collaboration. By gathering global technology leaders at the ITF, imec provides an open forum to share issues and trends challenging the semiconductor industry. In this international exchange, imec and participants outline ways to collaborate in bringing innovative solutions to market.”

@imec_int #PAuto