Friday, January 29, 2010

AMC Processor Module with Extended Temperature option

Concurrent Technologies have announced their latest high performance Advanced Mezzanine Card (AdvancedMC®) single width, mid-height or full-height, processor module suitable for AdvancedTCA®, MicroTCA™, Scope Alliance and proprietary platforms.

The AM 210/x0x features a low power dual core processor from the Intel® embedded roadmap - the Intel® Core™2 Duo processor operating at 2.26 GHz or 1.86 GHz and supports up to 8 Gbytes DDR3-1066 SDRAM. It is designed for use in a variety of applications including wireless base stations, Voice over IP, media-servers, blade-servers within the communication market as well as projects within the defence, security, and industrial markets. Commercial and extended temperature versions are now available for both processor speeds. For embedded types of applications there is an option for an onboard application flash disk (up to 8 Gbytes). The AM 210/x0x supports a variety of industry standard operating systems.

The AM 210/x0x board supports the 2.26 GHz Intel Core 2 Duo SP9300 or the 1.86 GHz Intel Core 2 Duo SL9400 processor. The processor utilizes Intel’s 45nm process technology, and offers a large last-level on-die cache (6 Mbytes), 1066 MHz Front Side Bus, Intel® Virtualization, Intel® 64 Technology, improved power management, plus new features and enhancements to the Intel® Core™ micro-architecture delivering increased instructions per clock. The Intel® Thermal Design Power (TDP) for the 45nm 2.26 GHz dual core processor is 25W giving a much improved performance per Watt when compared to earlier generations of processors. The Intel® GS45 Graphics Memory Controller Hub and Intel® ICH9M-SFF IO Controller Hub are used to complement the processor to achieve a low power, yet high performance core design. The board is suited for CPU intensive processing applications whereby the processor’s dual cores can access up to 8 Gbytes of dual channel DDR3-1066 SDRAM, via two SODIMMs, with a peak bandwidth of up to 16 Gbytes/s.

It is designed in compliance to AMC.0 (including full or mid-height front panel, full hot swap, and IPMI capabilities), AMC.1 Type 8 (single x8 or dual x4 PCI Express interface), AMC.2 Type E2 (2 x Gigabit Ethernet interfaces) and AMC.3 Type S2 (2 x Serial ATA300 ports). A variant is available providing rear I/O compatibility with Scope Alliance systems. In the AMC extended options region the module also features, as a sales variant, 2 x Serial ATA300 ports, 2 x USB 2.0 ports and an RS-232 port. There is a further Gigabit Ethernet port, 2 x USB 2.0 ports and an RS-232 port accessible via the front panel. An optional onboard USB Flash disk is available in a range of capacities of up to 8 Gbytes.
See AMC specs on the PICMG site.

Commercial temperature (0°C to +55°C) and extended temperature (-25°C to +70°C) variants are now available with either the mid-height or full-height front panel type.

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