Imaging in life sciences.

Delivers low-noise, high-throughput performance for life sciences and precision measurement.

The Falcon4-CLHS™ M8200-Scientific has been announced by Teledyne DALSA. This is a new 67 MP model in its Falcon4-CLHS area scan camera family. Optimised for life sciences, scientific imaging, and precision measurement applications, the camera combines ultra-high resolution with exceptional image quality, sensitivity, and measurement accuracy.

Built on a customised version of Teledyne e2v's Emerald™ 67 MP CMOS image sensor, the camera delivers approximately 3 e⁻ read noise, up to 64 dB dynamic range, 70% quantum efficiency at 550 nm, and pixel-level factory calibration to support demanding low-light and quantitative imaging applications.

Designed for high-resolution, larger-format imaging applications, the Falcon4-CLHS M8200-Scientific addresses the needs of whole-slide imaging, genomics, and spatial omics, fluorescence microscopy, high-content screening, automated cell analysis, imaging cytometry, and light-sheet microscopy. Its combination of low noise, high sensitivity, wide dynamic range, and factory-calibrated image quality also makes it well suited for precision metrology, semiconductor inspection, materials analysis, and other advanced scientific and industrial imaging applications where measurement accuracy, throughput, and image consistency are critical.

"Life science and scientific instrument developers require both exceptional image quality and high throughput," said Manny Romero, Senior Product Manager at Teledyne. "The Falcon4-CLHS M8200-Scientific extends the Falcon4-CLHS platform into demanding quantitative imaging applications, delivering true 67 MP resolution along with enhanced sensitivity, dynamic range, image consistency, and measurement accuracy."

The camera's 8,192 × 8,192 square sensor format with 2.5 µm pixels maximises usable imaging area for microscopy applications, while operation at up to 65 fps supports high-throughput imaging workflows. Combined with Teledyne's imaging ecosystem, including sensors, frame grabbers, and software, the camera provides a complete end-to-end solution from a single supplier. This is particularly well suited for OEM developers building next-generation life science, scientific, semiconductor, and industrial imaging systems that demand performance, reliability, and long-term product stability.

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Ultra-High-Speed Imaging in light-starved conditions.

The release of Teledyne DALSA's next-generation Linea™ HS2 8k backside illuminated (BSI) 1 MHz Time Delay Integration (TDI) camera has been announced. Designed for ultra-high-speed imaging in light-starved conditions, the Linea HS2 8k camera joins the existing 16k models, delivering exceptional image quality with 5 µm resolution and an industry-leading maximum line rate of 1 MHz.

The Linea HS2 family features a highly sensitive multi-array charge-domain Teledyne DALSA CMOS BSI TDI sensor, available in 8k and 16k resolutions with optimized quantum efficiency to meet the rigorous demands of current and future machine vision applications. The multi-array TDI sensor architecture allows the camera to be configured for superior image quality with maximized line rate, dynamic range, or full well capacity, depending on application requirements. This results in unsurpassed signal-to-noise performance and dynamic range for the most discriminating inspections.

This flexibility makes the Linea HS2 8k particularly well-suited for inspecting semiconductor wafers, high-density interconnects, genomics flow cells, or any other high-speed inspection applications. On-chip binning further enables higher web speeds to boost system throughput. The camera is equipped with Camera Link HS CX4 connectors for Active Optical Cables, providing complete EMI immunity.

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Contact image sensor series expansion.

Teledyne DALSA has expanded its AxCIS™ family of high-speed, high-resolution, fully integrated line scan imaging modules, now available in resolutions up to 1,800 dpi and lengths of up to 1,500 mm. These easy-to-use Contact Image Sensors (CIS) integrate sensors, lenses, and lighting into a single compact unit, offering a cost-effective inspection system for many demanding machine vision applications, including semiconductor wafer, battery, and print inspection.

Powered by Teledyne’s multiline CMOS image sensors, AxCIS delivers exceptional image quality with monochrome line rates of up to 80 kHz at a 14 µm pixel size, or resolutions up to 1,800 dpi. For color inspection, it outputs a native RGB 3-line rate of up to 60 kHz, at a 28 µm pixel size or 900 dpi resolution, so that flaws can be identified with unprecedented precision. AxCIS also offers a unique high dynamic range (HDR) capability to further improve defect detectability. Its unique sensor design covers the entire field of view without missing pixels, providing a 100% seamless image without interpolation, and the telecentric lens supports true metrology applications.

AxCIS has been designed for scalability across various fields of view using a single 24V power supply. With a small form factor and an IP60 dust proof optical path, AxCIS provides the flexibility to fit into systems with limited vertical clearance. Its SFP+ fibreoptic interface delivers high throughput data over standard low-cost, long-length cables with immunity to EMI radiation for harsh industrial environments.

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Camera for high‑speed industrial inspection.

Kaleido™ is a groundbreaking short‑wave infrared (SWIR) hyperspectral camera from Teledyne DALSA. Engineered to overcome the integration and performance barriers of industrial sorting, Kaleido targets critical applications in recycling, food safety, pharmaceuticals, and waste management. By significantly advancing material discrimination and increasing throughput, Kaleido redefines the cost-to-performance ratio for hyperspectral inspection.

Fully designed and vertically manufactured by Teledyne and encompassing the sensor, spectrograph, and interface, Kaleido delivers up to 1,280 pixel spatial resolution with line rates exceeding 2.3 kHz. This high-speed capability allows for the inspection of higher volumes in less time without sacrificing spectral precision.

“Kaleido represents a paradigm shift in how we leverage the collective power of Teledyne’s global ecosystem. It is a pinnacle of vertical integration, combining deep sensor physics, advanced optical design, and world-class system engineering,” said Sadiq Panjwani, COO, Teledyne Vision Solutions / Senior EVP and General Manager, Machine Vision Cameras Group. "By centralizing our breadth of capabilities, we have dismantled the traditional barriers to hyperspectral deployment: complexity and cost. We aren't just launching a camera. We are providing a scalable solution that fundamentally improves global outcomes by ensuring food safety, driving cleaner manufacturing, and enabling more responsible resource management. This is the future of industrial intelligence."

Kaleido simplifies the user experience with built‑in spectral band selection and spectrograph‑based aberration correction, ensuring consistent calibration across units throughout the full operating temperature range. These innovations reduce system complexity and accelerate time-to-market for machine builders. Additionally, Teledyne has integrated proven features from its award‑winning line scan families, such as metadata tagging and multiple regions of interest (ROI), ensuring that only the most relevant data is delivered to the processing engine for maximum efficiency.

The camera utilises a 10 GigE interface fully compliant with GigE Vision® and GenICam® standards. Optimised for high responsivity, the Kaleido sensor maintains strong signal integrity even in low‑light conditions, allowing for the effective use of modern, energy-efficient SWIR LED lighting. With flexible lens options and a robust global partner network, Kaleido is built for rapid scaling.

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Frame grabber.

Teledyne DALSA has released the Xtium™3 PCIe Gen4 family, a next-generation frame grabber engineered to deliver maximum sustained throughput and ready-to-use image data for high-performance industrial applications.

Building on the proven Xtium2 platform, the first model, Xtium3-CLHS PX8 supports the Camera Link HS® (CLHS) standard over the PCI Express™ Gen 4.0 interface. This single-slot, single-cable solution accommodates up to seven CLHS lanes, each operating at 10.3125 Gbps (72.2 Gbps in total), enabling acquisition bandwidths of 8.6 GB/s and host transfer rates of up to 13.2 GB/s via a PCIe Gen4 x8 slot.

Key features and benefits:
• High-speed data transmission:  Utilizes CLHS X-protocol with over 97% packet efficiency and 64/66-bit encoding. Supports long cable lengths exceeding 30 meters using 7-lane AOC cables
• Real-time data forwarding:  Redistributes incoming data to up to 12 computers via standard AOC cables for distributed image processing
• Optimized performance: PCIe Gen4 architecture delivers sustained throughput of 13.2 GB/s directly to host memory, reducing CPU load and accelerating image processing
• Broad compatibility:  Supports area and line scan, monochrome and color cameras, delivering exceptional performance for Camera Link HS (a future model will support CoaXPress®)
• Advanced image processing:  Enables multi-plane HDR processing for Teledyne’s Linea™ HS2 16K camera
• Software support:  Fully compatible with Teledyne’s Sapera™ LT Software SDKs and third-party software for seamless integration.

The Xtium3 series is designed to meet the demands of modern machine vision systems, offering robust performance, scalability, and flexibility for a wide range of industrial applications.

Fully supported by Teledyne’s Sapera LT Software SDKs, the Xtium3 series empowers developers and integrators to build robust, high-speed imaging systems with minimal overhead and maximum flexibility.

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@TeledyneDALSA  #PAuto #Manufacturing 

In-line 3D measurement and inspection.

The Z-Trak™ Express 1K5 3D laser profiler series has been introduced by Teledyne DALSA. Purpose-built for cost-effective, in-line 3D measurement and inspection, the Z-Trak Express 1K5 is the latest innovation in the Z-Trak family. It delivers high-speed 3D inspection with real-time processing, achieving a maximum profile rate of 5,000 profiles per second across its full measurement range. This makes it ideal for a wide range of industries, including secondary battery production, automotive, lumber inspection, factory automation, and logistics.

Featuring a 1,700mm horizontal field-of-view, the Z-Trak Express 1K5 enables precise measurement and inspection of wide-body objects such as wooden planks, road surfaces, pallets, and automotive body parts, using a single sensor. It also supports the integration of multiple sensors in a variety of topologies, enabling advanced measurement and inspection tasks such as measuring the thickness of moving parts, performing continuous 360° inspections, and extending the horizontal field-of-view, all without compromising Z-resolution. To simplify deployment and reduce costs, the Z-Trak Express 1K5 synchronizes multiple sensors using a data cable and supports content-based triggering for enhanced flexibility.

All Z-Trak profilers are deployment-ready, delivering micrometer level measurements without the need for in-field calibration. To accommodate objects of varying sizes, shapes, colors, finishes, and material compositions, Z-Trak Express 1K5 includes real-time, user programmable profile enhancement functions, two-point HDR, and models with eye-safe red or blue lasers. Like all Z-Trak laser profilers, Z-Trak Express 1K5 performs on-board processing without compromising the profile rate.

The Z-Trak Express 1K5 series comes bundled with:

• Z-Trak 3D Apps Studio – a license for a powerful suite of software tools for in-line measurement and inspection
• Z-Expert – a graphical configuration utility
• Sherlock™8 – a field proven rapid deployment platform for machine vision, enabling seamless communication with PLCs and other devices via industry standard communication protocols such as TCP/IP, MODBUS®, ProfiNet® and more.

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@TeledyneDALSA  #PAuto #Manufacturing #TandM

Camera family for cost-sensitive applications.

The new Tetra™ line scan camera family has been launched by Teledyne DALSA. Designed for a wide range of machine vision applications, Tetra leverages Teledyne’s latest multiline CMOS image sensor technology and builds on the success of the original Linea™* series of high-value line scan cameras.

The Tetra camera family is designed for cost-sensitive applications, offering a high performance-to-cost ratio through its 2.5 GigE Vision interface, which ensures highly reliability data transmission over long cable lengths. Available in 2k, 4k, and 8k resolutions with a line rate of up to 150 kHz, the camera comes in both monochrome and color versions, with power consumption under 6 watts. Monochrome models deliver excellent image quality with options for single monochrome or dual-line HDR mode, while the color models provide true red, green, and blue colors without any data interpolation.

Tetra includes essential line scan features such as multiple regions of interest, programmable coefficient sets, and power over internet. Its 2.5 GigE Vision interface makes it ideal for applications such as electronics inspection, optical sorting, printed materials inspection, packaging inspection, web inspection, and general machine vision.

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*See: 16k TDI line scan camera. (18/9/2024) 

@TeledyneDALSA  #PAuto #Manufacturing

Tools for in-line 3D measurement and inspection.

The Z-Trak™ 3D Apps Studio, a suite of software tools developed for in-line 3D machine vision applications has been introduced. Designed to work with Teledyne DALSA’s Z-Trak family of laser profilers, it simplifies 3D measurement and inspection tasks on production lines. Capable of handling 3D scans of objects with varied surface types, sizes and geometric features, Z-Trak 3D Apps Studio is ideal for factory automation applications across a wide range of industries including electric vehicles (EV batteries, motor stators etc.), automotive, electronics, semiconductors, packaging, logistics, metal fabrication, lumber, and many more.

It features streamlined tools for measuring object thickness, inspecting glue-beads, weld seams, and identifying defects on flat, inclined, and curved surfaces on machined, assembled, or extruded parts. It also includes anchoring and data enhancement features like reflection elimination to ensure reliable and repeatable results under diverse operating conditions.

The Z-Trak family of laser profilers features various multi-sensor topologies to enhance the field of view while preserving height resolution, to overcome occlusion, or to provide a 360° view of objects for inspection and measurements. Z-Trak 3D Apps Studio simultaneously acquires, processes, and analyzes 3D scans and 2D gray scale images (reflectance data) all with 3D visualization capabilities.

For easy integration and quick deployment, the Z-Trak 3D Apps Studio is accessible via Sherlock 8.30 (or higher), a field proven, no-code, graphical development environment for factory floor applications. Z-Trak 3D laser profilers include a Sherlock 8 license for in-line measurement applications.

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@TeledyneDALSA  @Notified #PAuto #Manufacturing

AI-powered smart camera.

Their next generation AI-powered BOA™3 smart camera for industrial automation and inspection has been announced by Teledyne DALSA. This new BOA3 smart camera is designed to leverage the best features from previous BOA generations and combine them with new sensor and AI (Artificial Intelligence) inspection technologies developed by Teledyne. BOA3 is a highly integrated vision system in a compact, rugged smart camera format designed to meet the needs of the most complex, demanding machine vision applications.

“The new BOA3 is an exciting next step in our smart camera development,” said Szymon Chawarski, Product Line Manager, Vision Systems. “Its modular and flexible architecture will allow us to offer new and powerful solutions for embedded machine vision inspections.”

It offers sensor resolutions from 1.2 to 12MP, integrated or C-mount lens options, onboard I/O, and includes easy-to-use machine vision software, all in one common platform. BOA3 smart cameras deliver the flexibility and uncompromised functionality to enable quick, cost-effective embedded machine vision deployments.

It also comes with iNspect™, an easy-to-use, no-code inspection development software with tools for positioning, part locating, pattern matching, measuring, barcode reading, feature or defect detection, including automatic reading of characters (OCR) based on a pre-trained AI inference network. Combine the broad range of traditional vision tools with powerful AI Classification or Object Detection models created in Astrocyte™, Teledyne DALSA’s GUI-based AI Trainer software.

BOA3 models with 1.2, 5MP, and 12MP monochrome sensors are available immediately. Color versions are planned for release at the end of 2024. New sensor and lens options will be added to the platform in 2025.

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@TeledyneDALSA  @Notified #PAuto #Manufacturing

16k TDI line scan camera.

The Linea™ HS2 TDI line scan camera family has been introduced by Teledyne DALSA. Drawing on over four decades of industry leading expertise, this innovative camera series represents a significant breakthrough in next generation TDI technology. Designed for ultra-high-speed imaging in light starved conditions, it delivers exceptional image quality with 16k/5 µm resolution and boasts an industry leading maximum line rate of 1 Megahertz, or 16 Gigapixels per second data throughput.

The Linea HS2 features a highly sensitive Backside Illuminated (BSI) multi-array charge-domain TDI CMOS sensor with 16k/5 µm resolution and optimized Quantum Efficiency, meeting the rigorous demands of current and future machine vision applications. The multi-array TDI sensor architecture allows the camera to be configured for superior image quality with maximized line rate, dynamic range, or full well, according to specific application requirements. This makes it particularly ideal for inspecting semiconductor wafers, high density interconnects and flat panel displays, and for life science applications. On-chip binning also enables higher web speeds to boost system throughput. The camera is equipped with dual Camera Link HS CX4 connectors to Active Optical Cables providing complete EMI immunity.

Linea HS2 offers a seamless upgrade from Teledyne’s existing Linea HS line scan cameras, featuring the same pixel size, optics, cables, and mounting hardware, but with a 2.5 time increase in speed, while maintaining reasonable power consumption. An optional liquid cooling accessory provides thermal stability during operation.

For a complete solution, the Linea HS2 camera works with Teledyne’s Xtium2 CLHS series of high-performance frame grabbers, utilizing next generation CLHS technology. Built on reliable, field-proven high-speed data transmission technology, it delivers data at 16 Gigapixels per second over dual CLHS CX4 connectors to active optical cables. Its data forwarding capability supports parallel data processing in up to 12 PCs.

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 @TeledyneDALSA #Manufacturing #PAuto 

Image sensors in colour.

Teledyne DALSA's AxCIS™ family of high-speed and high-resolution fully integrated line scan imaging modules are now available in colour. These easy-to-use Contact Image Sensors (CIS) combine sensors, lenses, and lights all-in-one, offering a lower cost inspection system for many demanding machine vision applications including battery and print inspection.

Powered by Teledyne’s multiline CMOS image sensors, AxCIS delivers superior image quality with up to a 60 kHz x 3-line rate of native RGB colours, at a pixel size of 28 µm or 900 dpi resolution, so that defects can be detected with unprecedented precision. Its unique sensor design covers the entire field of view without missing pixels, providing a 100% seamless image without any interpolation. In addition to defect detection, its unique design also supports true metrology applications.

AxCIS has been designed with scalability to various fields of view with a single 24V power supply. With a small form factor and an optical path with an IP50 dust proof design, AxCIS can fit almost anywhere in your system, even with limited vertical clearance. Its Camera Link HS SFP+ fibreoptic interface delivers high throughput data over standard low-cost, long-length cables with immunity to EMI radiation for harsh industrial environments.

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@TeledyneDALSA #Manufacturing #PAuto 

Compact camera has qualities twice it size.

The Linea™ Lite 8k Super Resolution camera from Teledyne DALSA is now in production. This is a compact and cost-effective GigE line scan camera which delivers 8k resolution images, a performance that normally requires a camera body twice the size.

Built for a wide range of machine vision applications, Linea Lite cameras have a 45% smaller footprint than the original Linea and are based on Teledyne’s proprietary multiline CMOS image sensor design. This new 8k Super Resolution Monochrome camera uses two 4k/7 μm pixel rows with pixel offset. Data from two 4k/7 μm images is captured simultaneously and then reconstructed to achieve a super resolution image of 8k/3.5 μm in real time, significantly enhancing signal-to-noise ratio and the detectability of subpixel defects. Teledyne DALSA’s patented technology allows for the use of 4k/7 μm lenses and lighting without sacrificing on responsivity and MTF (due to the smaller pixel size). The camera is compatible with standard M-42 lenses, significantly saving on the total system cost.

Using Teledyne’s Sapera™ LT software, the Linea Lite 8k Super Resolution camera delivers data throughput at twice the bandwidth of a standard GigE interface, providing 25 kHz at full 8k resolution, i.e. 205 MB/sec. Speed can be further increased using Teledyne’s award winning TurboDrive™ technology, which pushes past the gigabit Ethernet speed ceiling. The new Super Resolution technology also significantly boosts speed for inspection systems, and Power over Ethernet (PoE) enables a single cable to drive both the data connection and power source.

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@TeledyneDALSA #Manufacturing #PAuto

High performance 5GigE Camera.

The Teledyne DALSA Linea™2 4k Multispectral 5GigE line scan camera is now in production. This new camera takes vision systems to the next level with its performance and value, offering a 5GigE interface with five times the bandwidth of the Linea GigE camera.

The Linea2 4k Multispectral 5GigE simultaneously captures high resolution RGB plus Near Infrared (NIR) multispectral images to reveal invisible features that cannot be detected using visible lighting alone. This makes it ideal for identifying hard to see defects, contaminants and security features in applications such as automated optical inspection, printing inspection, optical sorting systems, material grading and inspection, web inspection and many other machine vision applications.

Packed into a small form factor, this camera is powered by Teledyne’s high-performance quadlinear CMOS sensor with a 4,096 x 4 pixel resolution and 7 x 7 μm pixel size. There are four sensor rows for red, green, blue, and NIR channels, with spectrally independent color and NIR outputs for minimal crosstalk. Unlike prism-based cameras, the Linea2 cameras do not require high-cost optical lenses which helps significantly reduce the overall vision system cost.

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