PXI automatic test systems on display!

At the 2015 PXI Show, the Peak Group is adding a number of new products to its portfolio of automatic test systems based on its partnerships with National Instruments (NI), GOEPEL electronic and Virginia Panel Corporation (VPC).

A major new product is a simplified fixture interface for boundary scan using a new VPC Pull-Thru receiver from GOEPEL electronic. The new PXI 1149/VPC(x) ensures an outstanding signal quality in the interface between GOEPEL electronic's PXI/PXIe SCANFLEX® Boundary Scan controllers and test fixtures, and completely eliminates the complication of any kind of manual wiring in the configuration of the interface.

VPC Pull-Thru receiver

The new Pull-Thru adapters are designed to improve the integration quality and seamless combination of structural test technologies with functional test in volume manufacturing. As well as the actual JTAG signals, the new Pull-Thru adapter offers additional connections for GOEPEL electronic's dynamic I/O signals for enhanced handling of all Embedded System Access (ESA) technologies. As a result, it provides the ability to test and program highly complex boards, including on-chip flash programming, with significantly reduced test points, in some cases without the use of traditional test points or probes at all.

The new unit is fully compatible with the scalable Mass InterConnect system from VPC using Pull-Thru Receiver series G20, G20x, G40 and G14x. Using this option, users can now easily combine JTAG/Boundary Scan with the PXI Interface Test Adapter (ITA) solutions from VPC to create a high performance reliable fixture interface.

Peak is also featuring its partnership with Simplicity AI to provide integrated test solutions based on National Instruments industry-standard platforms along with Peak's test hardware and fixturing technology and Simplicity AI's advanced test & measurement software. Peak and Simplicity AI are both NI Alliance Partners.

Also on show is their modular rack system, which is ergonomically designed for use in all test environments and includes an integrated VPC Mass InterConnect interface receiver adaptor, allowing large numbers of different contact types to be quickly and easily connected in a single operation.

The Peak modular rack system is height, width and depth adaptable to customers' test requirements. It incorporates built-in service panels, high volume cooling, and large doors on the sides and rear, with a wide body allowing for ancillary equipment and circuitry on both sides of the main chassis. Also incorporated are full emergency stop and door interlock safety circuitry, plus a mains distribution, filtering and safety circuit box.

Inline systems for programming & test!

New features in the RAPIDO™ multi-site inline production system family for high-speed in-system programming and board test based on the latest Embedded System Access (ESA) technologies have been made available by Goebel. One of the essential innovations is an option to utilise planar downholders in sandwich construction. Now ultra-thin, rigid-flexible boards with contact gaps of up to 50 mil can be safely handled in multiple-up production. Utilising this technology, RAPIDO has become one of only a few systems that meet the challenges of safe inline contacting for such sensitive applications.

As a second innovation, all fixtures are equipped with an intelligent module for identification and data storage. The compatibility between fixture and target board can be ensured by means of this so called FID module (Fixture Identification and Data). Additionally, there is the opportunity to automatically configure the entire system incl. band width, UUT, test program, etc. This approach avoids manual faults and provides a simple and efficient UUT change. Furthermore, the FID module determines fixture state, stores the entire life cycle, and signals required maintenance work, such as probe changing.

Other amendments include an increase in adjustable band width for standard systems to 250 mm. Moreover, new functions at the MES interface (Manufacturing Enterprise System) are implemented.

“The extension of our RAPIDO system family gives us the opportunity to meet the demands of high-volume production particularly in the automotive and consumer industries even better”, said Alexander Beck, Team Manager Integration in Goepel electronic’s JTAG/Boundary Scan Division. “All developments are derived from customer concerns and the growing range of installations and applications. In association with our extensive worldwide service, we are able to deliver individually configured standard solutions with highest productivity.”

Software platform for embedded test & validation to support 4th generation Intel® Core™ Processors

Goepel electronic is now supporting the 4th generation Intel® Core™ processors (code-named “Haswell”) within the framework of the SYSTEM CASCON™ platform for validation and test of complex processor boards.

SYSTEM CASCON™ is an integrated software development environment with a comprehensive tool suite, uniform GUI, and graphical project development for the synchronized utilization of all ESA technologies, enabling test, programming, and debug operations without nail or probe access (noninvasive). In addition to JTAG/Boundary Scan/ IEEE 1149.x, key elements of the ESA philosophy are, in particular, Processor Emulation Test, Chip Embedded Instrumentation, Core Assisted Programming, and FPGA Assisted Test.

Support of the new Intel processors is based on the recently introduced Intel® Silicon View Technology (Intel® SVT). Intel® SVT is a proprietary method, comprised of various features integrated into Intel processors and chipsets, enabling platform debugging, electrical validation and production test. Complex 4th generation Intel Core processor-based designs with reduced physical access and high-speed signals can now be tested structurally and functionally with high-quality diagnostics. By means of processor-specific VarioTAP® models, these capabilities can be seamlessly incorporated into SYSTEM CASCON. Additional information can be found on-line here.

“For more than a decade our system solutions have enabled the utilization of Boundary Scan/IEEE 1149.x features of Intel processors for the test of complex boards. Supporting the 4th generation Intel Core processors based on the Intel Silicon View Technology is the next logical step in the exploitation of additional validation and test opportunities with our Embedded System Access philosophy", explains Heiko Ehrenberg, Technology Officer for Embedded System Access Technologies and Managing Director at Geopel electronics LLC in the US. “For designs applying the 4th generation Intel Core processors, our OEM, ODM and EMS customers can now refer to new SYSTEM CASCON tools to accelerate prototyping, shorten time frames for New Product Introduction (NPI), and ensure the quality of production test with reduced access. As quite a number of these users are also members of the Intel Intelligent System Alliance, this platform enables us to specifically address the needs of, and cooperate with, system developers, system manufacturers, and system integrators.”

In the context of the new product development, Geopel electronic has joined the Intel® Intelligent Systems Alliance as General Member. Intel Intelligent Systems Alliance is a global ecosystem of 200+ member companies that provide the performance, connectivity, manageability, and security developers need to create smart, connected systems. Close collaboration with Intel enables Alliance members to innovate with the latest technologies, helping developers deliver first-in-market solutions.

Intelligent inspection system for selective solder joints features new camera!

Goepel electronic offers an internally developed camera and illumination system for optical inspection of selective solder joints to be integrated into external test cells. The integration package contains a specifically designed 4 Megapixel BUZZARD camera with GigE interface, multispectral illumination, a PC and respective software. The camera and illumination system concept, which has been successfully utilized in Goepel electronic’s well-proven OptiCon AOI systems for mounted PCBs, can be configured to the specific optical test demands of each inspection system.

The 4 Megapixel camera BUZZARD with integrated Power PC provides excellent images, and provides functionalities for image pre-processing, e.g. equalization, shading corrections, filter functions and many more. Another highlight is the multispectral illumination incl. control, coverage of light spectrum from UV to IR and guaranteed high-contrast images of inspected solder joints and components. The BUZZARD camera is the first in a line of newly developed camera systems based on several CCD sensors.

An integral part of the integration package is the easy-to-use TOM Line software for industrial applications. It features an extensive range of test functions, for example to evaluate THT solder joints, shorts or solder splashes. The software can be operated and controlled by means of a remote interface.

This integration package consists exclusively of components developed and produced in GOEPEL electronic’s facilities. Consequently, inquiries concerning system integration, service and support can be processed fast and qualified.

Cost-efficient optical inspection system

Cost-efficient optical inspection system for automated conformal coat inspection and more

GOEPEL electronic offers an enhanced version of its system for the automated optical inspection of fluorescing conformal coating. The TOM system (Teachable Optical Measurement) may be used for inspection of PCB coatings as well as PCB areas, which mustn’t be coated. The maximum PCB size is 460 X 400 mm.

Because of its modular design, the system can be adjusted to specific test requirements. The range of possible standard camera configurations extends from one to multiple camera configurations (1 Megapixel to 5 Megapixel), as colour or black/white variant. Various illuminations for the visible and UV ranges (conformal coating) are available.

In addition to conformal coating inspection, the TOM In-Line system can be utilized, e.g. for component presence, selective solder joint inspection, display and LED check as well as colour recognition and optical character reading.

The intuitive TOM-Line software enables a very simple and convenient test program generation without prior programming knowledge. A respective user interface is available for combined optical and electric test via JTAG/Boundary Scan.

The integration of camera, illumination and software into customised system is also possible.

Select promotion!

Peak Production Equipment has been promoted to Select Member status of GOEPEL electronic’s global alliance program GATE™ (GOEPEL Associated Technical Experts).

Under the terms of the GATE program, members receive application-specific transfer of GOEPEL electronic’s product expertise in the area of JTAG/Boundary Scan utilisation, as well as participating in the joint development of customised automated test systems incorporating these technologies.

Andrew Pitt of GOEPEL electronic (left)
 presents the GATE Select Member
certificate to Karl Miles of the Peak Group.

Peak has already collaborated with GOEPEL electronic on a number of test solutions and systems based on combined functional and JTAG/Boundary Scan technologies for major customers in the aerospace and defence markets. As well as continuing to provide the specialised integration of GOEPEL electronic’s hardware and software platforms into customised test systems, Peak is expanding its offering to include dedicated JTAG/Boundary Scan solutions so that the test solution can evolve with the product as it moves through prototype into production and repair. Peak’s holistic approach to managing customers’ test solution requirements ensures that benefits of the GOEPEL electronic solutions to the customer are realised throughout the product life cycle.

Commenting on the award of Select Member status within the GATE program, Karl Miles, Technical Sales Manager of the Peak Group, said: “Owing to the higher complexity of the products being tested in industries such as aerospace and defence, we have seen an increase in the number of our solutions requiring JTAG/Boundary Scan integration. This has dramatically increased our experience of this technology, and we are delighted that GOEPEL electronic has recognised this with promotion to Select Member of the GATE program.”

“It was a logical step to promote Peak as Select Member within our GATE program”, says Frank Amm, Corporate GATE Program Manager with GOEPEL electronic. “An increasing number of satisfied customers, the extended visibility of GOEPEL electronic’s Boundary Scan solutions and therefore an intensified market penetration were the strongest arguments to award Peak Production Equipment. We’re definitely on the right path towards even greater success in a fiercely competitive market.”

Image capture & processing for 3D X-ray inspection system

Stemmer Imaging has supplied GÖPEL electronic with machine vision systems for use in its new OptiCon X-Line 3D X-ray inspection system for simultaneous inspection of both sides of double sided printed circuit boards. Parallel image capture allows real time 3D X-ray image reconstruction from 2D images taken at different angles at production line speeds.

At the heart of the image capture system is a 3D parallel X-Ray detector developed in-house by GÖPEL. This allows the simultaneous capture of images from nine different directions in a 12 bit grey scale with a maximum object resolution of 10 µm per pixel. The detector hardware achieves continuous data rates of up to 40 gigapixels/s.

Following hardware-based image integration and pre-processing there are 360 megapixels/s distributed over nine angles of observation available for further processing in the PC. In the reconstruction process, the image data are converted into a 3D output of typically 24 megapixels/s. As each projection captures a different region of the board, the board is moved under the X-ray beam so that all the required angles of observation are observed sequentially.

With reconstruction requiring a 64 bit PC platform, they worked closely with GÖPEL engineers. The Sales & Marketing Director, Mark Williamson, said: "This is a classic example of Stemmer working in partnership with an OEM customer. Our involvement extended far beyond the supply of the basic components. Our technical expertise was essential to ensure seamless integration of frame grabbers, 64 bit drivers and other image processing components to meet the required demands of speed and accuracy".