Reducing the time and cost of deploying and upgrading high-performance data centres to meet unrelenting demand for generative AI and machine learning workflows.
A thermal management solution that reduces the time and cost of deploying and upgrading high-performance data centers to meet unrelenting demand for generative AI and machine learning workflows has been introduced. Molex VaporConnect™ Optical Feedthrough Modules for two-phase immersion cooling address constant increases in data center speed and capacity by leveraging a unique, cassette-based design that bolts directly onto immersion tanks and enables optical transceivers and network cabling infrastructure to be swapped out without changing mechanical interfaces or impacting immersion tank architecture. Reference designs for the new modules will be available commercially in Q1 of 2025.
“Molex continually embraces innovative optical solutions to ease data center deployments and upgrades while alleviating critical thermal management challenges,” said Trevor Smith, general manager, Optical Connectivity, Molex. “VaporConnect gives customers the flexibility to upgrade connectivity and scale cooling system designs to keep pace with data center growth by simply deploying a different module, which will accelerate upgrades while reducing overall energy, cooling and technology costs.”
Streamlining two-phase immersion cooling.
Molex VaporConnect Optical Feedthrough Modules simplify the connections between optical transceivers contained within immersion tanks and cabling infrastructure that exists outside the tank using fully upgradeable sealed modules. With VaporConnect, sealing and cabling is accomplished inside the module, giving customers the opportunity to upgrade connectors without impacting immersion tank design or architecture. Additionally, customers have the flexibility to re-use standard cabling infrastructure for multiple product generations, which further reduces deployment time, cost and complexity.
A full range of industry-standard and Molex optical connector form factors are available for single- and multi-mode fiber solutions. They also feature mix-and-match functionality to facilitate system upgrades to newer or denser connectors. Customizable module footprints are available to fit specific space and application requirements.
Molex VaporConnect Optical Feedthrough Modules are also designed to minimize external patching and shuffle requirements by leveraging Molex FlexPlane™ optical circuitry technology. As a result, complex optical shuffles and high-density fiber routing are integrated seamlessly within the module for simpler installation and plug-and-play operation.
A sealing gasket comes with every VaporConnect module, which is thoroughly tested using industry-standard, helium-leak testing to ensure a reliable seal with the tank wall. This also assures a seamless transition from the server line cards inside the tank to outside cabling infrastructure. Testing is underway for compliance with industry-standard GR-1435-CORE.
VaporConnect modules are designed to accommodate customer specifications, with the number of fiber channels dependent on the number and type of connectors used. As many as 576 fibers can be integrated into a single module. A range of form factor options are available, including MPO, LC and very small form factor (VSFF) options, such as MMC, MDC, SN and SN-MT. This ensures conformance to existing infrastructure and streamlines system upgrades. As part of Molex’s continued investment in this area, an EBO connector option is currently in development, with availability slated for the first half of 2025.
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