Seica has designed the system RAPID H4 FLEX for flex PCBs with a dedicated vacuum plate in the test area to minimize board warpage for the extremely thin flex circuits, our response to the constant demand for testing FLEX PCBs, which are rapidly spreading around the consumer electronics, automotive, medical, smart home industries and others. These are designed to fit into small areas with bending improving the miniaturization process and the high-density mounting design.
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